SN100C P810 D4 lead-free solder paste is said to be lower voiding than conventional lead-free solder. Reportedly minimizes mid-chip solder balling and exhibits good wetting on all common substrates. When used in combination with vacuum reflow, produces solder joints on 19x19 mm pads and joints to power transistors with less than 1% voiding. Is based on SN100C.

Nihon Superior Co., www.nihonsuperior.co.jp/english

Premium Hot Bar Monitoring system is for Hot Bar reflow soldering, heat-seal bonding, ACF-bonding, and heat staking. Measures force, temperature, time and displacement; features Hot Bar connections and high throughput. Is equipped with MG3 Premium Hot Bar Monitor. Dual channel capability offers simultaneous monitoring. Has configurable graphic user interface with four display quadrants, graphic and numeric indicators, and online help. MG3 features on-screen SPC capability that generates real-time monitoring. Includes up to 99 available schedules and password protection. Offers interface infrastructure with RS232 or Ethernet TCP/IP. Process interrupt functions enable steering of the bonding process. USB port provides data storage and data transfer. Hot Bar Modules are integrated.

Miyachi Europe, http://www.miyachieurope.com/products/system/

U5002 closed loop desiccant dry units are designed to exceed challenges associated with IPC J-STD-033C (components) and 1601 (printed circuit boards) for handling moisture sensitive devices. Incorporate molecular sieve desiccant technology. Zeolite dryers feature dehumidification, enabling a 1400 liter cabinet to move from 50%RH to less than 5% in fewer than 4 min. Humidity levels achieved are below 0.5%RH with vapor content. Have been designed to regenerate only when necessary, based on operating load.

Super Dry, www.superdry.info

Through-hole 1mm pitch 860 series headers and 861 series single-row sockets provide support for applications requiring multiple insertions and extractions. Have solder tail diameters of 0.015"and 0.014" respectively. Tail diameters allow for smaller PCB holes. Insulator bodies have standoffs on the termination side of the connectors to aid in solder flow during the soldering process. Header and socket provide a mated height of 0.200" for board stacking applications. Are available in 2 -50 positions and are RoHS compliant; sockets have gold-plated shells and contacts; headers have gold-plated pins.

Mill-Max, www.mill-max.com/PR629