New Products
Ultra SPI solder paste inspection system is based on 64-bit technology. Dual 3D cameras inspect paste deposits on printed circuit boards for multiple defect scenarios. Uses latest Gerber and CAD generation utilities. Can produce a 3D inspection database within of 5 to 10 min. Graphical data output is available. Is 2D/3D capable.
Machine Vision Products, www.visionpro.com
Ultra V is for high-volume manufacturing. Is a 64-bit based AOI with 16 cores of processing power, an 8MP high frame rate camera, and a larger field of view, with a core technology of 10µm pixel size. Is capable of inspecting at solder joint level defects on components as small as 01005. Supports sub-pixel algorithms in metrology applications. Is configured with a 508mm x 508mm inspection and board handling area. Ultra V XL permits expansion of inspection envelope to 508mm x 762mm.
Machine Vision Products, www.visionpro.com
ezLOAD PCB support system with modular frame now features an extruded aluminum base. Reportedly reduces changeover times, improves product build quality, and can eliminate component damage during assembly. Features active grip technology to hold boards during assembly. Protects components while allowing boards to move freely through the assembly line. Includes magnetic locking base. Other base designs are available for non-magnetic tables.
Count on Tools, www.cotinc.com/ezload
Dual-band Emstat 35-013 workstation monitor protects in three zones: earth, mat and wristbands. There are two terminals: one for each operator positioned where it’s most convenient for them. Terminals fit under workbenches between operators. Use the latest digital signal processing technology to continuously monitor grounding parameters. If the connection is broken, an audible alarm sounds, and there is a status indicator.
Gemini Integrated Electronics, www.geminiintegratedelectronics.com
BR750 rework station has high-resolution split-vision and is Pb-free. Contains processing controls for removal and placement of BGAs, CSPs, QFNs, PoPs, and other subminiature surface mount devices. Has independent and programmable top and bottom hot air, plus rapid on/off IR underheaters; reportedly eliminates thermal tension that can damage boards or components adjacent to those being processed. Contains eight different set points; exact thermal conditions can be produced for profiles containing heating rate, target temperature, dwell time and cooling. Profiles are shown in real time on an LCD display. SMDs are automatically pre-aligned and picked up from the component nest at their exact centers. An upward-looking camera verifies positioning at all four corners of each device, while split-vision optics and electronic zoom adjustment of up to 22x do the fine tuning. Handles PCBs up to 500mm x 550mm and component sizes from 1mm x 1mm to 60mm x 60mm.
Manncorp, www.manncorp.com
XF-616 ultra-thin, white-coated polyimide label material uses a 0.5 mil film for space-constrained electronics. Is a high-temperature, thermal transfer printable material with an acrylic adhesive. Is designed to provide a 20% lower profile and survive harsh environments, including high process temperatures and harsh chemicals. Applications include LED monitors, battery labels, tablets, and handheld devices. Complies with RoHS, REACH, and is certified halogen-free to IEC 61249-2-21 levels.
Polyonics, www.polyonics.com
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri