This inline board cleaning and defluxing system for water-soluble fluxes accommodates PCBs up to 24". Measures 12½ ft. long. Has a 60° angled nozzle directing spray under the components for removal of all water-soluble flux residues. Has high-performance stainless steel spray pumps and a turbine-powered rotating air knife, working with fixed-position air knives. A rinse water closed loop recycler is available for zero discharge operation.
Manncorp, www.manncorp.com
Pressure Decay Leak Test Calculator is automated and generates nearly instantaneous answers to “what if” modeling of pressure decay leak testing variables from 8-sensor concurrent leak testing technology. Variables that can be manipulated include pressure ranges; leak rate target; number of concurrent pressure decay sensors in use (up to 8 with Optima vT leak and flow tester); customization of test cycle times, including all stages of fill, stabilization, test time, and total, and part/test volume.
USON, Calculators@uson.com
535-10M UV cured epoxy is formulated for disk drive, camera module, optoelectronics and circuit assembly applications. Non-conductive adhesive cures rapidly when exposed to high-intensity UV light. Is low outgassing, flexible, high-strength; does not contain antimony.
Engineered Material Systems, www.conductives.com
Shrouded male pin connectors are for frequently mated interconnects and blind mate conditions. Double row connectors come in 4- to 64-pin configurations, in through-hole and surface mount termination styles. Shroud extends above pins to limit misalignment between connectors during mating and de-mating. PTH and SMT versions are dual-row with 0.100" spacing pin-to-pin and row-to-row. Connector body is molded from high-temperature thermoplastic with thermal stability, chemical resistance and flammability rating of UL94 V-0. Pins are made from precision-machined brass. Engaging leads are 0.030" in diameter, 0.142" long and gold-plated. Are RoHS compliant and suitable for Pb-free reflow.
Mill-Max, www.mill-max.com
357-348 wire bond encapsulant and flexible circuit bonding adhesive is for circuit assembly applications. Protects wire bonds and reduces stresses associated with thermal cycling. Reportedly is chemically resistant to inks. Has high fracture toughness and adheres to flexible circuits, FR-4 and metal substrates. Meets ionic cleanliness standards.
Engineered Material Systems, www.conductives.com
Production Runner PCB production line is designed for high-mix, low-to-mid-volume automated assembly; is suitable for both short and long runs. Includes dual-head 8,000 cph MC-385V2V pick-and-place, 5500 dual squeegee stencil printer, and CR-4000C Pb-free hot air convection reflow system. MC-385 accommodates 128 smart tape feeders and includes Cognex on-the-fly vision that aligns standard and odd-form SMDs, providing a placement range from 01005s through 100mm x 150mm connectors. 5500 stencil printer features vertical lift and the ability to process double-sided boards. CR-4000C reflow has a 16" pin conveyor over a 20" stainless steel mesh belt; includes KIC Auto Focus Power process automation software.
Manncorp, www.manncorp.com