Andes Solbot II multi-point selective soldering system uses customized and dedicated fixtures/nozzles. Is Pb-free compatible; features a footprint of 540 x 720 x 250mm. Can solder printed circuit boards up to 260 x 340mm. Number of components on PCB does not affect tact time.

Andes, www.andes.co.jp
Seika Machinery, www.seikausa.com

2800ISP in-system programming station incorporates 8th generation site technology using Vector Engine BitBlast. Can program flash architectures, including eMMC, PCM and Raw NAND, plus microcontrollers and other device technologies on-board after reflow. Reportedly ideal for medium- to high-volume production; is configurable and can program up to 16 devices in parallel. High-density flash memory devices are able to achieve read/write speeds up to 140 Mbits per sec.

BPM Microsystems, www.bpmmicro.com

Neoplace 400 pick-and-place machine has a rotating head that can be equipped with grippers for components, paste or resin dispensers, or specific processing systems. The 4/8 tools multi-head can load the components in sequence. Can place non-standard components. Fluid dispensing unit and high dynamics are optional.

Osai Automation Systems, http://osai-as.it/

XACT 4 flexible screen and stencil printer handles large boards. Features dual light source vision, patented 2-1/2D post-print inspection, and standard closed-loop controlled print head, expanded substrate size capability. Is compatible with IPAG Integrated Paste and Glue Dispensing

ASYS Group, www.asys-group.com