Copper Glass-Coated Micro Wire features glass insulation for use in semiconductor wire bonding. Is a replacement to traditional copper bonding wire or gold wire. Is cast, not drawn, to enable a soft metal core with a high strength, ultra-fine glass coating. Is said to eliminate anti-oxidation, enabling a longer shelf life. Supports larger spools, for simpler materials management. Protects against shorts since the wire is coated and cannot make contact. Scale to 4 microns.

RED Micro Wire, redequipment.com

Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm² and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.

Milara, www.milarasmt.com

M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.

ECD, www.ecd.com

Manual Lead Tinning System (MLTS) is for re-tinning leads of fine-pitch quad flat pack SMDs in-house without bridging. Is reportedly ideal for hi-rel, military, and avionics component refurbishing requirements. Employs a tinning method using a “side wave” solder nozzle that is purged with nitrogen. Side wave process uses natural cascade of the solder to scrub the old plating off, while wicking away excess solder. Is a work station for one person to handle all forms of component lead tinning. Can be configured with one or two solder pots with either the side wave or straight immersion nozzles, and flowing flux station. Solder pots and fluxers are operated through foot switches.

ACE Production Technologies, www.ace-protech.com