TT-400 tabletop soldering robot platform features 150W hot iron soldering robots, a 400 mm x 365 mm soldering area, tip cleaning station (sponge and air bow off), and camera. Other features include: USB port for program save or load modes to enable program transfer, simulation mode (for process validation prior to soldering), and 64 bit high speed on-board processor. Stores and recalls up to 100 programs, each having up to 9,999 instruction points.

Promation, www.pro-mation-inc.com

GreenData Manager environmental compliance software now exports IPC-1752A XML files at the component level. Can be used as a data conversion tool, generating product-level IPC-1752A XML reports from individual component data. Determines whether a component, subassembly or complete product is compliant with a wide variety of regulations. Substances list now more than 24,000, and recent changes to the REACH SVHC Candidate list included.

GreenSoft Technology, greensofttech.com

CN-1736 reworkable underfill encapsulant is designed to underfill 0.4mm pitch package-on-package assemblies. Has low viscosity and CTE. Reportedly has greater flux compatibility than predecessors. Has a viscosity of 650cps and a CTE of 55 ppm/°C. Rework is accomplished with temperature of 170°C to 180°C.

Zymet, www.zymet.com

Ablestik ICP-3535M1 one-component, pre-mixed electrically conductive adhesive provides low and stable contact resistance when used with 100% tin-terminated components. Offers lower temperature processing, lower stress assemblies and regulatory-compliant Pb-free formulations. Attaches to a variety of substrates, including low-temperature co-fired ceramics, high-temperature ceramics, and OSP-finished printed circuit boards. Reportedly maintains stable contact resistance and good mechanical integrity after 3,000 hrs. of temperature and humidity testing, 3,000 cycles of thermal shock evaluation, and 3,000 hrs. of heat storage. 

Henkel, www.henkel.com/electronics