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New Products

UA-2605 reworkable edgebond adhesive improves thermal cycle performance of CBGAs and plastic BGAs. In a trial, it reportedly tripled the 0° to +100°C performance of a CBGA to nearly 2,500 cycles.  Only four beads of adhesive required, one at each corner. No need to preheat board; no need to wait for underfill flow; no need for multiple dispensing passes.

 

Zymet, www.zymet.com

iSpector HMA and HDA AOI is a nine-camera system: one top-down camera and eight side cameras. Side cameras operate simultaneously. Includes wide FOV from multi-angles; full-color inspection, and high dynamic range CMOS side cameras + CCD main camera.

Marantz Electronics, http://us.marantz.com
Christopher Associates Inc., www.christopherweb.com

MY100e series pick-and-place machines are for high-volume production environments. Enable a fully automated material flow with fewer operators. Reportedly have seamless workflow from prototypes to volume production. Include four models: LXe, SXe, DXe and HXe, each in two sizes ranging from 16,000 to 50,000 cph, with a total of 96 to 176 feeder positions. Are compatible with existing range of Mydata machines, feeders and software.

Mydata, www.mydata.com

StencilLaser G6080 features a real-time quality inspection system and improves throughput by about 20% over previous models. Optical inspection monitors stencil cutting process in real-time. New control system optimizes cutting parameters for individual apertures. Has a fully contained motion system and software-controlled cutting gas management.

LPKF Laser & Electronics, www.lpkfusa.com

Agilent TS-8900 automotive functional test system is a standardized PXI-based solution for testing medium- to high-pin-count electronic control units. Provides up to 20% better throughput compared with earlier Agilent automotive functional tester. Has simultaneous measurement channel capabilities. Includes 32-channel M9216A high-voltage data acquisition module. Capable of acquiring voltage levels ranging from 1 mV to 100 V at 250kSa/s per channel simultaneously. Provides direct connectivity to ECUs without the need for external front-end signal conditioning circuitry. Comes with a suite of more than 200 built-in applications-tuned test libraries.

Agilent Technologies, www.agilent.com

Model 2651A SourceMeter instrument reportedly provides the widest current range available for testing high brightness LEDs, power semiconductors, DC-DC converters, batteries, and other high power materials, components, modules and subassemblies. Offers a four-quadrant voltage and current source/load coupled with precision voltage and current meters. Combines functionality of multiple instruments in a single full-rack enclosure: semiconductor characterization instrument, precision power supply, current source, DMM, arbitrary waveform generator, V or I pulse generator, electronic load and trigger controller. Is expandable into a multi-channel synchronized system via TSP-Link technology. Can source or sink up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A). Measures signals as low as 1pA and 100 mV at speeds up to one microsec. per reading. Provides a choice of digitizing or integrating measurement modes for characterization of transient and steady-state behavior. TSP Express LXI-based I-V test software is embedded.

Keithley Instruments, www.keithley.com

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