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S3088 flex inspects printed circuit board assemblies. Is an enhanced version of S3088-III AOI. Combines high-reliability inspection capability with ease-of-programming features. Is for prototype capability to high-production speed. Intel core i7 computer and touch-screen monitor are included. Has optional operation of vVision inspection software. 100% inspection compatibility.

Viscom, www.viscom.com

FX series AOI has upgraded YESPC software. Is suited for high-volume or high-mix manufacturing, providing inspection of 01005 components. Includes Advanced Fusion Lighting and 5 megapixel color image processing. Software is a web-based statistical process control tool that can be used for real-time and historical charts and inspection reports. In real-time mode, it focuses on defect prevention by monitoring for unwanted trends in the manufacturing process. User selectable “chart windows” can be configured to show defect paretos, yield trends, machine utilization, as well as X-Y positional and Cp/Cpk data.

Nordson YESTech, www.nordsonyestech.com

Advantis 3 surface-mount modular placement platform is for medium-volume environments. Has VRM linear motor technology that provides improved accuracy, acceleration and velocity without the downtime of lead screw-driven positioning systems. Includes 30-spindle Lightning head. Vision capability can be expanded or spindles added without changing heads, delivering a throughput of up to 34,400 cph. Has a component range of 0201 passives through 150mm connectors and expansive odd-form capabilities. 1- and 3-beam base models are available, as well as a large overlapping component range between placement heads.

Universal Instruments Corp., www.uic.com

MT2168 pick-and-place handler places each individual package in the optimum position relative to the contactor, even in high parallel test setup. Self-alignment is performed in 6°, solving deviations in planarity or outline.

Multitest, www.multitest.com/MT2168

No. 813 walk-in printed circuit board curing oven, has a 350,000 btu/hr., 500°F gas heater. Workspace dimensions are 48" x 48" x 72".  Has 4" insulated walls and an aluminized stainless steel interior and exterior. A 3300 CFM, 2-HP recirculating blower provides horizontal airflow. Safety equipment, such as a 325 CFM 1/3 powered force exhauster, is included. Features a 2" insulated floor with truck wheel guide tracks and a removable top-mounted heat chamber.

The Grieve Corp., www.grievecorp.com

Innova and Innova + direct die feeders enable presentation of wafer-level devices to GenesisSC platform. Are portable; can assemble a complete module on a single machine, placing die and passives precisely. Can install multiple feeders on a single placement machine with minimum feeder slot consumption. Alternate feeder functionality permits continuous running of like part numbers on multiple feeders. Present a wide variety of flip chips or circuit-up devices with easy relocation. Process wafers of various sizes up to 300mm. The latter processes up to 13 300mm wafers with on-board expansion capabilities.

Universal Instruments Corp., www.uic.com

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