4-mm ITF3 feeder is for A-Series pick-and-place machines. Reportedly improves reliability of 01005 component placement. Accepts W4P1 all-plastic tape standardized by the IEC; tape eliminates paper dust that can cause bad solder connections to the micro-miniature components. Is static-free. Helps cut waste by 75% compared with traditional 8-mm tapes on a 2-mm pitch.
1-2577 silicone conformal coating is for use as a PV cell and module coating. Offers abrasion resistance and good dielectric properties. Cures with a hard slick surface, and is Mil spec and UL-approved. One-part RTV also contains a UV indicator and adheres to metal, aluminum, ceramic and plastic. Comes in bottles, pails and drums.
Tridak Model 775H heated valve dispenses heavy, stringy, temperature-sensitive, or reactive materials. Is a pneumatically operated spool valve supplied with a temperature controller and thermocoupler. Heats material being dispensed from ambient up to 350°F. Can dispense volumes as little as 0.01 mL; provides continuous, adjustable and lockable flow. Offers an adjustable and lockable suck-back control. Can be supplied with special nozzles or manifolds. When heated, the valve can be used alone or as part of a complete heated system. Used alone, it lowers the viscosity of the material only at the dispense point.
A full line of standard 300-series nozzles are for the Assembléon MC-24 and MC-24X, and the Yamaha YG300 placement machines. Is capable of handling components sizes from 01005 to larger BGAs and QFPs for large mix and min. changeover.
Multitest concept, for pressure sensors for MEMS test and calibration equipment, equips a standard test handler with a pressure contact cassette and combines it with the pressure generator. Components can be aligned to meet pressure test requirements. Covers from 0.2 to 20 bars with up to five different pressure levels over a temperature range from -40° to 135°C. Supports absolute pressure tests, as well as relative pressure and leakage tests.
Solder Paste Recycling unit reportedly is able to reduce the amount of waste material to less than 10% of current volumes. Now enables the separation of flux and solder, using a solder pot mechanism that inverts during each cycle. Turns wasted solder paste into solder bar in approx. 34 to 45 min. Max. volume per cycle is approx. 5.5 lb.