Q2170 fine-pitch, fine-wire (17 - 75 µm), automatic Al/Au automatic wedge bonder is for smaller lot sizes, multiple product variations and frequent setup changes. Supports prototyping to medium-volume production. Designed for packaging complex hybrid, CoB/PCB and LED display devices; achieves wedge bonding for fine gold, aluminum wire and ribbon, and is said to enable quick package conversions. Operator interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage, and a bond parameter library. Options include programmable ultrasonic generator (256 increments) with low impedance transducers, programmable temperature controllers (optional dual-loop), application-specific software, and custom machines with a table up to 200 x 300 mm.

Questar Products International, www.questarproducts.com

VisionPro Surface vision software package, for inspecting material surfaces, combines visual defect detection and classification technology with a simple user interface. Enables defect detection, classification, and surface texture assessment during manufacturing. Monitors visual appearance of the material. Automatically identifies potential defects in the material’s surface using statistical analysis; classifies the defects into groups based on similarity in contrast, texture and/or geometry. Automatically classifies each defect according to the user-defined categories. Comes with point-and-click application configuration; visual self-learning defect classification tools, and automatic Web-based reporting tools that enable mapping, listing, and viewing defects. 

Cognex Corp.,  www.cognex.com/vprosurface