Paraquda SMD pick-and-place machine uses new materials for high-speed control. Features short changeover times, an intuitive operation system (Eplace), and an integrated quality management system. Has 210 feeder capacity. Head can simultaneously hold and measure four components. Component range is 01005 up to 4" sq., up to 1" in height. Min. pitch is specified with 0.01". High-resolution fly-by vision system is equipped with latest Cognex SMD image processing technology.

Essemtec, www.essemtec.com

 

 

Offline teaching program II software has an XML data structure that enables a bidirectional data exchange; taking solder programs out of the offline teaching program and into the machine and vice versa is possible without further conversions. Differences between the original solder program and the program stored in the machine control system can be displayed automatically. Can process image data from cameras and scans. Automatically eliminates common picture distortions. Offers globally storing periodical process parameters for use with particular solder points or soldering passages when developing new solder programs. After teaching all solder points, the program computes the fastest way to minimize handling. This prospectively computed cycle time is displayed directly.

SEHO Systems GmbH, www.seho.de

No. 945 is an electrically heated 500°F universal oven used for various curing tasks. Workspace dimensions are 54" x 36" x 36".  6.6 KW are installed in Nichrome wire heating elements, while a 600 CFM, 1/2-HP recirculating blower provides horizontal front to rear airflow. Has 4" insulated walls, an aluminized steel exterior and Type 430 stainless steel interior. Equipped with an integral leg stand with casters and leveling pads. Controls include a digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blower airflow safety switch and SCR power controller.

The Grieve Corporation, www.grievecorp.com

NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.

FCT Assembly, www.fctassembly.com