Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
 
DEK, www.dek.com

Pressurex is a thin flexible sensor film that reveals pressures from 2 - 43,200 PSI. When placed between the contacting surfaces of a flip chip bonder, it changes color directly proportional to the amount of pressure applied. Precise pressure magnitude and distribution is then determined by comparing color variation results to a color correlation chart.

Sensor Products Inc., www.sensorprod.com/pressurex

Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing.  Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Is for fluid packaging operations, including filling vials, bottles and other specialty containers. Can be integrated into robotics and automated production processes. Possesses adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals. Comes in stainless steel and Teflon construction. Model 345 valve controller is ideally suited to actuate this valve.
 
Tridak, www.tridak.com

Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails. 
 
Fujipoly America Corp., www.fujipoly.com