Cantilever Cart comes in standard and custom versions. Is flexible with a lightweight, small footprint. Many accessories can be clipped onto the cart. Uses include: storing bins or totes at any height or location (KanBan); holding tools or work-in-progress; staging; moving heavy items (estimated 100 lb. capacity). Can be used in electronics test and compliance labs, or as a repair cart for machine support and maintenance personnel.

Bliss Industries, www.blissindustries.com

Inert atmosphere cabinet oven No. 799 is used for processing ceramic components prior to assembly. Features max. operating temp. of 750°C; workspace dimensions of 38" x 38" x 50"; 60 KW installed in alloy wire high-temperature plug heaters; 3000 CFM, 3 HP alloy recirculating blower providing horizontal airflow; 12" thick insulated walls; stainless steel interior; solenoid operated door lock. Includes pressure regulator, flow meter, pressure gauge, internal high-temperature gasket, bellows type seal in doorway throat area, 1/2" thick silicone rubber atmosphere seal, blower shaft seal, positive latching door hardware, adjustable offset door hinges, outlet with pressure relief, interior seams welded gas-tight, all wall penetrations fitted with compression fittings. Has 325 CFM cooling blower to pull room air through air jacket on inner oven for additional cooling.

The Grieve Corp., www.grievecorp.com

VT-S700 high-speed inline AOI is said to improve inspection accuracy and increase throughput by shortening tact time with an expanded field of view. A telecentric lens with a 2-MP camera reduces image distortion. Inspects at up to 10 µm resolution for components as small as 01005.

VT-RNS inline AOI system has a color highlight system that provides solder joint illumination by providing 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera enhances solder shape recognition accuracy by obtaining three times the information of a conventional 1-CCD camera, delivering inspection results down to 10 µm resolution. EzTS Easy Teaching software for VT-RNS enables operators to create and fine-tune inspection programs. A setup wizard format for component color, fillet color, etc. automatically generates inspection criteria.

VP6000 high-speed 3-D SPI system inspects solder paste deposition at inline speeds.  Uses structured light to perform 3-D inspections. Automatically adjusts Z-Axis for board warpage. Reportedly programs in less than 15 minutes with the importing of a single Gerber file and a CAD placement file.  Includes a full complement of SPC charts and graphs in the standard offline programming station.

Omron Electronics, www.omron247.com

StencilMate polyimide stencil is for reworking and hand-placing leadless devices such as QFNs, MLFs and LGAs. Controllably bumps leadless devices. Build-to-order stencil pairs are said to prevent bridging of neighboring solder joints while accommodating QFNs into stay-in-place stencils on the PCB. After removal of the leadless device, one of the stencils is peeled from its release liner, then aligned on the part. Solder paste is then squeegeed into the stencil apertures and reflowed. After reflow and stencil removal, the device has very uniform bumps, which then permit the leadless device to be placed similar to a BGA. Other processes have a mating stencil on the PCB, and the part is then fitted into the loaded apertures and reflowed. Comes in 0.10 to 0.20 mm thickness.

BEST Inc., www.solder.net