New Products
Free height computer-on-module (COM) connectors with 0.5mm centerline address vertical, parallel and board-to-board connections that require high-speed data transmission and different stacking heights.
MWS 2300 wave soldering system now has automatic nozzle height adjustment that does not influence cycle time.
SECS/GEM communication package for MPM Edison printer is a semiconductor market communication standard that provides a common interface between manufacturing equipment.
10 650V silicon carbide (SiC) Schottky diodes feature merged PIN Schottky (MPS) design.
SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.
W series embedded Wi-Fi antennas offer range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band operating frequencies up to 6GHz, performance-enhancing foam coatings, and various mounting options.
Press Releases
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market
- SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
- Coherix Unveils Industry-First Service Program for Adhesive Dispensing Systems
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- Editorial Contributions
- Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency
- Factors Contributing to Solder Ball Formation: A Guide
- Verifying PCBA Cleanliness with Ion Chromatography
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization