New Products
ThermaWick THJP surface-mount thermal jumper chip transfers heat from electrically isolated components by providing a thermal conductive pathway to ground plane or common heatsink.
SafeRFQ.com is an RFQ exchange for companies seeking cooperation in the field of EMS production.
GenX-90P and GenX-130P large cabinet x-ray systems now accommodate PCB sizes up to 21" (533 mm) x 17.5" (445 mm) with oblique angle viewing up to 70°.
GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager