New Products
TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.
Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.
MT-200 MiniTweez thermal tweezer is designed to rework tightly spaced micro-components such as 0201s, 0402s and 0603s.
Net Signal Wave (NSW) technology enables flying probe testing of PCBAs for large or small and single- or double-sided PCBs.
Multi-reflection suppression-enabled 3-D MX3000 final vision inspection system is for memory modules.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager