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New Products

GenX-90P and GenX-130P large cabinet x-ray systems now accommodate PCB sizes up to 21" (533 mm) x 17.5" (445 mm) with oblique angle viewing up to 70°.

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ECI 8000 E&C inks enable smart heating solutions for the smart home.

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GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.

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TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.

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Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.

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NB-IoT 3GPP Release 15 wake-up signal reduces power consumption of NB-IoT devices.

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