GenX-90P and GenX-130P large cabinet x-ray systems now accommodate PCB sizes up to 21" (533 mm) x 17.5" (445 mm) with oblique angle viewing up to 70°.
GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.
TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.
Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.