TMBS Trench MOS Barrier Schottky rectifiers are now with 16 2A and 3A devices in eSMP series low-profile SMP package.
YRM20 chipshooter uses two head types: a high-speed, multi-purpose rotary head that, when combined with the high-speed feeder, delivers performance under optimal conditions of 115,000cph, as well as a one-head solution via inline (HM) head.
Design and test workflow reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems.
Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.
LX-1000 inline large-area optical inspection system offers 630mm x 630mm inspection area with single-or dual-sided imaging.
FlexiCoat EMI ultrasonic coating is designed for conformal spraying of EMI shielding material onto semiconductor packages.