New Products
Master Bond EP29LPTCHT is a two-component, low-viscosity epoxy compound that can be used for underfill and encapsulation applications.
Inspectis software 5.0 offers overlay features, including a built-in DXF creator and editor for producing scaled overlay graticules.
Microcut 6080 offers positioning and cutting tailored to requirements of small apertures, for cutting exact openings with a size of 18μm on the laser entry side and 10μm on the exit side, in 30μm stainless-steel foil.
ASM ProcessExpert consists of ASM ProcessLens 5-D SPI system and ASM ProcessEngine software.
i3070 series 6 in-circuit test enables electronics manufacturers to improve test throughput and operational efficiency of PCBA manufacturing.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager