Munich, Germany and Westford, MA -- Zuken was chosen as the EDA vendor representative to participate in a multinational research project that came to a close in May. Zuken was selected for its knowledge in EMC (electromagnetic compatibility) simulation and modeling.

The aim of the MESDIE (microelectronic EMC system design for high density interconnect and high frequency environments) project was to research modeling for new chip sets, dedicated HDI and package modules for applications facing EMC/noise and system integration in the telecommunications, automotive, consumer and multimedia sectors.

MEDEA, the industry-initiated pan-European program for co-operative R&D in microelectronics, headed up the three-year, multinational MESDIE project. Working with companies such as Airbus, Alcatel, Bosch, Infineon, Continental, Philips and ST-Microelectronics, the project has begun forming the basis of methods of modeling and simulation at the system design level. 

Zuken helped advance technology concepts for EMC-related modeling of power ground systems for various off-chips structures, at both the HDI and board level. 

MELVILLE, NY – Arrow Electronics Inc. has expanded its Component Information Services, an online toolset that provides engineering, procurement and supply chain professionals with data to research and select electronic components. The enhancements offer a richer data set for compliance with RoHS and WEEE regulations issued by the EU.

In addition to identifying RoHS and lead-free compliance status for five million parts, data elements available include expected compliance dates, manufacturing parameters and hazardous material composition data for semiconductors, electro-mechanical and passive components.

 “One of the biggest challenges for manufacturers is gathering and staying current with the necessary environmental data as requirements evolve,” said Leonie Tipton, VP, Global Supply Chain Programs. “Arrow ensures that customers get the latest data --the same data used to manage our own business worldwide--conveniently accessible in one, centralized location.” 

Bromont, Quebec, Canada -- Samsung Electronics Computer Co. will expand its existing Cogiscan Moisture Sensitive Device (MSD) Control system in its Suzhou, China factory.

The system reportedly prevents costly field failures; minimizes number and duration of bake cycles; automates complex procedures; and ensures compliance with J-STD-033A rules/tables and facilitate IPC/JEDEC updates.

Lee Buyung Bum, engineering manager at Samsung in Suzhou, said, “Our most important customers are pleased that we fully comply with all the guidelines of the industry standard J-STD-033A. Our facility is producing some of the most advanced notebook in the worlds. The high density forces designers to place more and more active components on both sides of the same circuit board. This has significant implications in terms of tracking the floor life of moisture-sensitive components. Some of the most sensitive components must go through the complete assembly process, including top and bottom-side assembly and reflow within 24 hours of opening their protective dry bag. In addition the upcoming transition to lead-free products will further reduce the process window associated with MSDs.”

Plymouth, MI -- Hella, a supplier of automotive electronics and lighting systems, has restructured its North American operations by forming three distinct business units for its lighting, electronics and aftermarket businesses.

Dr. Raymund Heinen has been named president of Hella Lighting North America. Heinen will also be responsible for the management of corporate finance, personnel, IT, facilities management and corporate communications within the NAFTA region.

Steve Hubble is now president of Hella Electronics North America. He was previously VP of operations and engineering. Heinen and Hubble will be based in Plymouth.

Wolfgang Benz will serve as president of Hella's North American Aftermarket and Special Equipment operations, with offices in Peachtree City, GA..

The North American lighting group has nearly 2,500 employees at facilities in York, SC; Plymouth, MI; Mexico City and Guadalajara, Mexico, while its electronics group includes 530 employees in Flora, IL, and Plymouth. The aftermarket operations in the NAFTA trade region currently employ 150 people with approximately 1,800 distributors.  

PALO ALTO, CA -- Agilent Technologies Inc. has introduced the Versatest Series Model V5500, a final test solution for multichip package devices (MCP) and discrete flash memory. The tester-per-site architecture and optional Programmable Interface Matrix are said to optimize single-insertion testing of MCPs with multiple memory types (Flash, DRAM and SRAM).

Has 16,384 pins per testhead, to fully utilize x320 handlers at up to 320 NAND devices in parallel. Enables parallel testing of high-pin-count NOR and MCPs at up to 256 devices in parallel.

BOSTON -- Teradyne Inc. is laying off 400 employees, or approx. 7% of its workforce, with the cuts falling on the semiconductor test unit. The division produced nearly half of Teradyne’s net bookings in the first quarter, according to a release published by the Boston Business Journal.

The company did not immediately specify what locations would be affected. In June it sold its PCB manufacturing unit in North Reading, MA, to a division of Solectron.

Teradyne expects to complete the current layoffs by the end of the year, and said it would record severance charges of approximately $12.7 million and $4 million, respectively, for the third and fourth quarters.

BUFFALO, NY – NanoDynamics has opened an online Sample Store (nanodynamics.com/Home/samplestore) to minimize the hassle of evaluating or qualifying its products. Customers can order metal powder samples over the Internet and have them delivered anywhere.

The store will initially offer nanosilver and copper powder lines, with future plans to include nanosized nickel powders, nanoceramic powders and dispersions, carbon nanotubes and nanoclays.

Thief River Falls, MN -- Digi-Key and Freescale are hosting an exclusive design contest using the new MC9S12NE64xx Microcontroller. The grand prize is an Arctic Cat H1 ATV and trailer, and various cash prizes will be awarded. U.S. and Canadian residents can submit designs until August 15.

The contest offer is void where prohibited by law.

For more information on contest rules, prizes and registration:

US:   http://dkc1.digikey.com/us/mkt/Contest/DKFS_2.html

Canada:  http://dkc1.digikey.com/ca/mkt/Contest/DKFS_2.html

PHOENIX – EMS provider Suntron Corp. announced that its Northwest Operations (NWO) facility in Newberg, OR, received ISO 13485 certification for medical product manufacturing. The facility's quality system is also certified to ISO 9001:2000 and AS9100.

“We are pleased to have received our ISO 13485 certification which demonstrates Suntron's focus on providing the highest quality services while maintaining strict medical manufacturing standards," said Paul Singh, president and CEO. "This key medical certification is a milestone in our continuous quality improvement initiatives that provides Suntron with a competitive advantage in highly regulated industries.This accomplishment is an important strategic step and vital to supporting our customers success in the medical device market.”

MINNEAPOLIS, MN --  The SMTA has finalized the conference program for SMTAI, held Sept. 25 - 29, in Rosemont, IL.

Technical sessions held on Tuesday and Wednesday are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS and Process Control.

Full- and half-day educational courses, offered on Sunday and Monday, will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality and Process Control. Of the 30 tutorials offered, 16 are entirely new and 13 will focus on lead-free and environment-friendly issues.

The Emerging Technologies Summit on Monday will feature sessions on Roadmaps, Turning Lead into Gold, Advanced Power Technology and will conclude with an Emerging Technologies panel.

The Contract Manufacturing Symposium on Tuesday will consist of paper sessions on Mid-Tier EMS Strategy and Models and Markets. The Lead-Free Symposium on Thursday will feature paper sessions on the Joint Council on Aging Aircraft (JCAA) / Joint Group on Pollution

Prevention (JCPP) Lead-free Solder Project and additional sessions on Process Implementation and Reliability.

Two workshops will be held on Thursday morning on Lead-free Reflow Soldering Using Convection Dominant Ovens and Emerging Technologies Today & Tomorrow - The Next 50 Years.

Free events include:

- The Opening Session on RoHS Compliance and Lead-free

- A presentation on iNEMI Roadmaps

- A panel discussion on environmental efforts beyond lead-free implementation

- A technical session on Process Improvement and Lean Manufacturing in PCB Assembly

- A presentation on Rapid Setup and Turnover

- A mini-conference on radio frequency identification (RFID) technology

- A panel discussion on the RoHS and WEEE directives

- A technical session on Lead-free Reflow

The Board Authority Live: Impact of Green Technologies will address the impact of environmental legislation on PCB design, fabrication and assembly.  It will cover issues like lead-free and halogen-free laminate selection, tin whisker reduction, lead-free reliability data and using HDI to reduce manufacturing costs associated with RoHS and WEEE Directive compliance.

Board Talk will once again uncover the truths and myths of electronics assembly, with all proceeds being donated to the Charles Hutchins Educational Grant ($25 SMTA members/$30 non-members).

The keynote during the Annual Meeting and Luncheon on Wednesday will feature Dan Shea, CTO of Celestica, dicussing " The Impact of  Temperature on Hybrid and Compliant Assemblies." 

Hudson, NH -- Machine Capability Analysis (MCA) testing helps pick-and-place equipment manufacturers and users comply with the new IPC-9850 performance standard, according to Michael Sivigny, general Manager of CeTaQ Americas.

MCA testing is a third party, objective evaluation methodology in which special vision algorithms, accurate glass plates and components are utilized for independent measurement of Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are easily validated with the methodology. The software that operates the equipment provides statistical specification-based results on machine quality performance.

The IPC-9850 document standardizes the parameters, measurement procedures and methodologies used for the specification, evaluation and continuing verification of assembly equipment characterization parameters. The ANSI-approved standard also establishes the procedures to characterize and document machine placement capability of surface mount assembly equipment while maintaining a placement-accuracy-to-placement-speed relationship.

According to Sivigny, “CeTaQ machine capability analysis lets the user know if a machine is performing to manufacturer’s performance specifications, a key element in IPC-9850 compliance. If the machine isn’t performing to specifications, the user or manufacturer can use the information generated by the evaluation to correct offsets and bring the machine to its best possible performance condition.”

ARLINGTON, VA -– The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) was flat in June, perhaps signaling a traditional summer lull.

"We typically get a steadying period in the summer," said Bob Willis, ECA president. "Last year, July was flat after 11 consecutive months of order growth; this year June is flat after months of ups and downs."

Unlike 2004, which started off with a spurt of growth that receded in the second half of the year, Willis thinks the pattern this year leans to modest but sustainable growth over the second half.

The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance.