3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.

XM Bond high-resolution camera is for inline wire bond inspection.

SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.

ST 925 combines ST 325 programmable convective/hot air rework station, PH 100 low profile IR preheater and ST 500A Z-axis platform.

Supreme 3HTND-2DM rapid curing, toughened, one-part epoxy is for chip-on-board encapsulation using the dam-and-fill method.

ETS Series test fixtures conform to a standard size (2.50” x 2.75” square), and include mounting holes for easy stacking.

MicroHawk ultra-high definition imagers and smart cameras decode small and difficult-to-read barcodes, including data matrix 2D symbols and direct part marks used in electronics manufacturing. Can read symbols with an x-dimension as small as 0.0254mm.

Zebra 1002 Carbon Connector connects printed circuit boards to LCD displays. Includes 240 alternating layers of conductive and nonconductive silicone per inch; can accommodate contact pad spacing as close as 0.015".

FX-942 dual-sided optical inspection system incorporates 12MP/5-axis inspection technology for top- and bottom-side applications, including solder ball, solder fillet quality, lead and pin, and foreign material inspection.

Alpha OM-550 HRL1 low temperature solder paste reportedly has SAC 305-type mechanical and thermal reliability.

NI-RFmx 2.2 measurement software for PXI RF test systems, when used with second-generation PXI Vector Signal Transceiver (VST), allows testing of 4.5G and 5G RF components such as transceivers and amplifiers using a wide range of carrier aggregation schemes, even as the 5G standard is still being defined.

REL22 low Ag SAC solder contains bismuth and melts at about 208°C.