VAC745 and VAC765 vapor phase soldering machines are PC-controlled in combination with a 15" touchscreen. Offer network capability and unlimited program and data storage. Feature modification of program parameters, real-time recording of solder profiles, and targeted data and data management. Integrated IPS Intelligent Profiling System enables users to create a solder profile in one step; PCB temperature is used to control the process. Can influence evacuation time, holding time of the vacuum and venting time. Novel InVapour technology creates a fully inert soldering and vacuum process.

IBL Technologies, www.ibl-tech.com  

CondensoX performs reflow soldering by means of hot steam and Galden medium.

ViCON simple system operation and optimum process traceability software monitors all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

VisionXP+ convection soldering system optimizes energy efficiency and reduces emissions, saving up to 20% in energy use.

Alpha Accuflux preforms contain an ultra-low voiding flux formulation that is deposited very accurately from preform to preform ensuring repeatable performance every time.

Alpha OM-358 Innolot solder paste is low-voiding properties, for automotive applications.

Alpha OM-347 solder paste is a cleanable, no-clean material with fine-feature printing capabilities.

Turbo-Max CCR tabletop conformal coating removal system incorporates MV-2L Micro Abrasive Blaster, Ionized Ergonomic Work Chamber, Point Ionizer at Nozzle, and a compact filter system.

Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the SQ3000 3D AOI is for inspection of 0201 metric components and microelectronic applications.

58-9296 Series single position, vertical poke-home connectors are an alternative to hand soldering in high volume, 18AWG applications with perpendicular terminations and limited board space, including power supplies, LED drivers and industrial motor controls.

Speedmask 9-20479-B-Rev-A UV/light cure temporary masking agent protects connectors and other components during soldering or conformal coating.

Connection Validation evaluates solder joint quality by calculating intermetallic compound formation and provides closed-loop feedback to the operator, mitigating risk in the process.