PanaCIM Work-in-Process software is suited to track and control production, from receiving to shipping. Is a configurable, intuitive framework that integrates different factory automation systems into a single network for traceability of any product or process, regardless of manufacturing mix or volume. Workstation interface provides foundation for data collection, work instructions, and factory operations. Accommodates new documentation versions to be added before rollout. Processes can be created via a drag-and-drop procedure; sensors, automation, and manual processes can be integrated. Is capable of defining trace data at the individual part level, defining inventory locations for factory floor. Compatible with PanaCIM Enterprise Edition and PanaCIM Maintenance.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Max-1200 coating system leverages nozzle-less ultrasonic spray head for thin, uniform application of coatings, such as anti-reflective, CdCl2, anti-smudge, adhesion promoters and other specialty coatings used in the solar, lens and display markets. Is designed to meet high throughput production requirements. Features programmable high-speed X-Y-Z gantry to process glass plates or other substrates up to 1.2m wide at a process speed of up to 3.3m per min. Employs bidirectional coating application sequence that provides an ultra-uniform coating layer onto the substrate.

Ultrasonic Systems, www.ultraspray.com

Alpha OM-353 is an ultra-fine feature print and air reflow-capable solder paste ideal for assemblies sensitive to component warpage or processes that require cleaning. Has been tested to provide printing performance down to 180µm pad size. Alpha OM-535 is a low-temperature paste with excellent drop shock resistance and electrical reliability for low-temperature reflow applications.  Reportedly produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.

Alpha Assembly Solutions, alphaassembly.com

Prism 800 coating system leverages nozzle-less ultrasonic spray head technology for thin, uniform application of coatings such as photoresists, EMI shield coatings, fuel cell catalysts, and other specialty coatings used in the semiconductor packaging, fuel cell, display, and medical markets. Is designed to meet high throughput production requirements. Features high-speed, fully programmable x-y-z gantry and usable spray area of up to 780 x 780mm. Options include tandem coating heads, two independent liquid delivery systems, dual substrate lift stations, robot load lift/shuttle station, etc.

Ultrasonic Systems, www.ultraspray.com

Flat PCB Trays for work in-process handling hold up to 25 0.12"-thick cards at 0.65" pitch. Are lightweight and sturdy. Flat PCB trays hold up to 25 PCBs of virtually any size for storage and transport at manual workstations. Made of conductive material; temperature rated up to 1,76O°F.

FKN Systek, fknsystek.com

EMS 561-854 conductive adhesive for die-attach applications with small- to medium-size die and tantalum capacitors is designed to cure in one minute at 170ºC. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and features conductive stability. Applicable by pin transfer or needle dispensing.

Engineered Materials Systems, www.emsadhesives.com

SF855-LR soldering flux is a low-solid, low-residue, no-clean, non-rosin organic flux designed for use in tabber and stringer equipment of PV through soldering tabs to cell contacts. Low solids content (1.6%) and nature of activator system reportedly result in nearly no residue left on cell after soldering. Wide operating window and temperature range; can be used in SnPb, SnAgPb and Pb-free applications.

Kester, www.kester.com

GTAz optical head comes on PowerSpector and SpectorBOX AOI machines. Delivers stereoscopic imaging using nine high-speed (90 Fps) cameras operating in full 24-bit color. Image differentials are merged and a vectorized map of the component created, then analyzed based on programmer-applied tolerances. Requires no active light projection, and thus is less costly and compact, for desktop systems. Removes need for capture cards utilizing Thunderbolt2 20GBs transfer speeds and full frame transfer. Views side of components rather than extruded 2D images (as with single-camera systems). Has 3D features such as verification of body height, tilt and coplanarity; and 2D benefits of fast programming and pin height and solder meniscus profile analysis, component presence/absence, polarity, value, angle, offset, color, extra part detection, solder ball detection and short detection. Line-sourced DOAL (direct on axis lighting) coaxial lighting system with high-resolution telecentric optics enables inspection of solder joints without shadow effects from tall components nearby as well as accurate inspection model building. Omnidirectional multi angle, multi-color LED lighting provides optimal illumination regardless of component direction.

Mek (Marantz Electronics), marantz-electronics.com

EMS 561-567 snap cure conductive adhesive is for stringing or shingling applications in crystalline silicon and thin-film solar modules. Is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and reportedly features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Cures in seconds at 150°C to 180°C.  

Engineered Material Systems, www.emsadhesives.com

Elpecast Wepesil VU 4675 elastic silicone casting compound features a shore-A-hardness of 30–40 and a high permanent thermal resistance of up to 200°C. Protects and insulates electronic components and assembled PCBs against extreme climatic conditions and aggressive media. Ceramic fillers aid thermal conductivity of approx. 1.2 W/m*K. Suited to applications where heat is to be dissipated rapidly from high power LEDs to a wide area. Gray, solvent-free; resists chemicals and weathering. Classified as hardly flammable due to its chemical characteristics. Removable for repairs. Mixing ratio of 1:1 parts by volume or weight. Cures at room temperature but may be accelerated by heat (e.g., 15 min at 125°C).

Peters, peters.de

Mk 4 XT V precision, flat-panel-based x-ray inspection platform now offers a adjustable isolated monitor arm and console. Improved profile integrates PC within the machine chassis, taking up less space on shop floor. Improved safety and reliability, with compliance to the latest European standards, and with coolant pumps now isolated from the electronics for ease of maintenance and repair. For inspection of complex printed circuit boards and electronic components.

Nikon Metrology, www.nikonmetrology.com

LAS 1200 extraction and filtration system purifies laser fumes and laser dusts. Airflow is led through five different filtration stages. Based on multiple air purification and the utilization of efficient filter media, filter combination is said to ensure a 99.9% separation rate. In the prefilter and main filter stages, solid particles down to the nano range are separated; filtration or adsorption of gases and vapours is executed in an activated carbon filter, utilizing a high-performance fan with large pressure reserve. Is suited for capture and filtration of dry, noncombustible dusts occurring during material processing that uses lasers. Purifies dusts, gases and vapors from processes such as laser cutting, laser welding, laser marking or laser ablation. Can be used stationary or as a mobile unit.

ULT, www.ult.de