High Thermal Demand (HTD) hand-piece and slim tips are for MX-5200 series.

EP39MAOHT room temperature curing system is for bonding, sealing, coating, potting and encapsulation applications.

Sigma Series G5S modular mounter features two heads, a rotary head for speed and a multi-function head for lead-clinching and tamping.

H24 mounter head is part of the Fuji NXT nozzle series.

Series 300 electronic weld head offers precisely controlled weld force for miniature parts welding.

Helios G4 plasma-focused dual ion beam (FIB) system is designed to de-process and provide ultra-high-resolution scanning electron microscope (SEM) analysis on semiconductor devices.

Vivid Cure liquid optically clear adhesives are urethane acrylates.

Aqube HY9 hybrid cleaning system is pre-equipped for extended water management and is smart factory ready.

Aqube HY7 hybrid cleaning system is pre-equipped for extended water management and is smart factory ready.

CircuitShield anti-corrosion and waterproofing coating contains a novel chemical plasma coating that replaces traditional encapsulants and coatings.

SMF-WC52 ultra tacky flux is applied in flip-chip dipping process.

Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.