ISO-Spector S2 5D SPI features patented third-generation sensor technology said to enable unique, simultaneous 2D and 3D inspection.
BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.
Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.
Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.
Sarcon SPG-20A silicone is an easy-to-dispense, low-viscosity compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W.
Complete line of nozzles for Panasonic AM100 machines enable accurate, repeatable, optimized chip placement.
KY-P3 3D Pin Inspector delivers true 3D inspection without concern for inaccuracies resulting from conventional 2D inspection.
LCR-Reader MP (Multi Purpose), for electronic measurement and testing, features AC/DC voltage measurement up to 15V, frequency measurement, pulse counting and signal generation up to 400kHz.
Series 300 electronic weld head offers weld force profile reportedly ideal for miniature parts welding.
Third-party nozzles for Samsung – Hanwha Techwin Excen chip mounters enable accurate, repeatable, optimized chip placement.