Revision F IPC-JSTD-001 training kit is used in IPC training classes for certification.
Particle Impact Dampers reduce random vibration in PCB assemblies in harsh environments.
3D Planner virtually simulates the inspection process and evaluates a range of inspection scenarios offline.
XJTAG v3.6 includes several new productivity and automation-focused enhancements, for setting up tests for complex boards in significantly less time.
Sarcon EGR-11F thermal interface material absorbs a range of unwanted electromagnetic energy.
SQ3000 3D CMM (coordinate measurement) system is powered by multi-reflection suppression (MRS) technology and CyberCMM, new software for coordinate measurement.
YSi-V 12M TypeHS2 hybrid automated optical inspection system succeeds YSi-V 12M TypeHS.
iSpector JDz 520 bench-top inspection system includes 5mp camera, 15µm telecentric lens, co-axial light and 520 x 460mm max. PCB size.
Master Bond EP13LTE features a low coefficient of thermal expansion of 15-20 x 10-6in/in/°C.