Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use of local and global inspection libraries. Can be used in parallel with library toolbox.

Integrates SPI Closed Loop (Downlink) so that currently measured displacement values of the SPI inspection can be returned to the paste printer as offset correction values.

Enables detailed appraisal of recognized defects in parallel with defect verification on S2088-II AOI, with live capture of defect image viewable under different camera perspectives — orthogonal and angled — and in color.

Viscom, viscom.de

EP30HV two-component epoxy is for bonding, sealing, coating and casting applications. Offers light transmittance from 350-2,400nm and has a refractive index of 1.55 at room temperature. Volume resistivity is over 10¹⁵ ohm-cm, dielectric strength is 440 V/mil and has a low coefficient of thermal expansion. Mixed viscosity 4,000 cps.  Cures at room temperature in 24 hr. or faster at elevated temperatures. Tensile strength exceeds 9,000 psi. Compressive strength greater than 14,000 psi at ambient temperatures. Linear shrinkage is 0.0003"/inch. Resists water, oils, acids, bases and many solvents. Serviceable over -60° to +300°F temperature range.

Master Bond, masterbond.com/properties/electrically-insulative-adhesive-systems

TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of possible standard camera configurations extends from one to multiple camera configurations (1 to 5Mp) as color or black/white variant. Various illuminations for the visible and UV ranges (conformal coating) are available. Also can be used for component presence, selective solder joint inspection, display and LED check, color recognition and optical character reading. Intuitive software enables a simple, convenient test program generation without programming knowledge. Custom camera, illumination and software integration optional.

GÖPEL electronic, www.goepel.com

Many Separo solder recovery system quickly and easily reclaims solder. Reportedly turns a shift's worth of wave solder dross to usable solder ingots in under an hour.  Works with lead-free or SnPb alloys and is capable of treating 4 to 5 kg (9 to 11 lb.) of hot or room-temperature dross per cycle. Heavier solder alloy settles at the bottom of a heated crucible while lighter dross oxides rise to top and are captured in a custom filter. After 30 to 40 min. molten solder is transferred to the five ingot molds below the crucible. No chemical additives required. Reclaimed alloy is 100% pure and usable.

MGR Electro, mgrelectro.com/en/prodotti/separo-2

Manncorp, manncorp.com/solder-recovery

Fusion platform incorporates high speed DC servo drive and reduced line length. Standard cell handles PCBs up to 508 x 952mm (fluxer/preheat/solder), or for high speed applications can be configured with fluxer/preheat and up to 3 solder modules with 5 heater options. Solder cells can be configured with custom dip, multi-dip, jet-wave and single point AP down to 1.5mm. Features auto pot changer for noncontact changeover.

Pillarhouse, www.pillarhouse.biz

XACT 3 inline screen and stencil printers feature a 508 x 508mm (20 x 20”) print format, and 12 sec.+ print cycle times. Come with adjustable stencil guide rails and accept stencils up to 29 x 29” without adapters. EVA vision system ensures ±15µm @6 Sigma alignment repeatability and facilitates 2D print inspection. Pneumatically driven closed-loop print heads ensure constant print pressure throughout the print stroke. Cleaning system benefits from side channel fan upgrade with higher vacuum flow. Features servo motors and upgraded L-shaped belts to improve transport of thin substrates. Options include 2D print inspection, vacuum tooling set-up, heavy duty transport and SPC data interface. User-friendly Wizard interface eases setup.

ASYS Group, www.asys-group.com

CondensoXS vapor phase reflow system reduces floor space by 25%. Uses injection principle and controls temperature and pressure (vacuum) for precise, diverse reflow profiling. Solders heavy units quickly and reliably. Horizontal transport of the assembled board prevents components from slipping, reducing reject rates rework requirements. Boards load at the front, underneath the cooling system.

Rehm Thermal Systems, www.rehm-group.com

ViComp optical inspection unit alternates images of a reference board (golden board) and actual production board. Is benchtop sized.

Seho Systems, www.seho.de

SimmScope semiautomated printed circuit board inspection tool has a 4-color, 4-quadrant lighting system. UV light source permits inspection of conformal coatings. Reportedly enhances speed and accuracy of manual first article and production inspection. Serves as a photo station that captures high-res magnified images (up to 14,800 dpi) of individual components or areas of interest on the board, including connectors, tall through-hole components, screws, and other hardware. An image of the complete board can be stored. Includes automated motions, background masking, and graphical and data report generator. Four system sizes are available for PCBs up to 18 x 30".

RS Simmons Co., www.rssimmons.com

VHX-700F multipurpose microscope includes depth composition and 3D display. Incorporates observation, measurement, and image recording capabilities; reportedly offers all imaging techniques found in traditional inspection equipment. Has a 0.1x – 5,000x magnification range; provides bright field, dark field, and transmitted illumination. Additional attachments offer polarized, diffused, and DIC imaging methods. A multi-angle stand is paired with a rotating stage to allow 360° views. Detaches for handheld imaging of larger parts.

Keyence Corp. of America, http://www1.keyence.com/PRVHX7

GSR1290 standalone router can handle panels up to 910 x 610mm. Depanels tabbed or scored assemblies by manually interchanging the Z-axis cutting assembly; cutting mechanism can be changed from spindle to a saw. Includes three rigid, compact linear axis' driven by AC servo motors. Pre-loaded linear guides reportedly have a mechanical repeatability of ± 0.01mm. Has cut speeds up to 100mm and second and positional speeds up to 1000mm.

Getech Automation Pte Ltd., www.getecha.com 

Benchmark 4.0 software is for the Momentum series, Accela and MPM125 printer platforms. Is supported by a more powerful computer and a wide-screen monitor; is a Windows 7 OS system that incorporates an open software architecture: OpenApps. OpenApps provides two-way communication between the printer and, for example, the user’s own in-house manufacturing execution system. Can develop the system on one’s own, use a 3rd party developer, or Speedline can provide resources to assist in development.

Speedline Technologies, www.speedlinetech.com