7KDL AOI offers dual-lane capabilities for high-speed manufacturing of products such as smartphones. Has large-board capabilities (up to 21’’ x 11’’) for each of the two lanes. Has built-in SPC tools, including inspection data traceability for real-time feedback.

VI Technology, www.vitechnology.com

TLA6400 portable logic analyzers are for embedded system debug and validation applications. Available in 34, 68, 102, and 136 channel configurations; come with 25 GS/s high-speed timing resolution, up to 667 MHz state timing, up to 64 Mb record length, and iCapture functionality. Can capture buses with clock rates up to 667 MHz and data rates up to 1333 Mb/s. Include Glitch trigger and storage; iView for integration between TLA6400 and more than 100 oscilloscopes, and Microsoft Windows 7 interface. Suited for debug and analysis applications, including signal integrity analysis, FPGA debug and verification, memory system validation, and embedded software integration and debug.

Tektronix, www.tektronix.com

Smart Tweezers ST5 is for component evaluation, on-board impedance testing, and SMT component sorting. Automatically determines the type of component and selects proper range and signal frequency for highest accuracy measurement. LCR-meter displays component type, measurement results, and test conditions used to determine results. Accuracy level is said to be about 0.2%. Also shows parasitic resistance and measurement. Tests for continuity and diodes. Evaluates all passive types of surface mount components, such as resistors, capacitors and inductors as small as 0201 size (0.3 mm).

Siborg Systems, www.smarttweezers.ca

EPM1-2493 low-viscosity, low modulus silicone elastomer has a nominal thermal conductivity of 1 W/mk. Offers bond lines as thin as 5 microns. Adheres materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. Reportedly reduces or prevents contamination of electronics components in applications exposed to high heat, such as solder reflow at 260°C. Adheres to aluminum, and with a primer achieves average lap shear values of120 psi (0.8 MPa). Is a pourable, conformal liquid for potting/filling recessed areas. Can be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. Comes in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. Cures at lower temperature but can be heat-accelerated for faster cure time.

NuSil Technology, www.nusil.com

ROI Calculator determines the cost of performing rework and repairs associated with solder contamination in wave solder operations. Determines amount of defects. Input data for shifts, days and working weeks per year.

Solderlab.com, www.solderlab.com/cost_of_rework

SFX5212 I/O module provides independently programmable I/O channels, and reportedly processes voltages up to 30V. Increases test coverage for non-boundary scan circuits or peripheral signals with higher signal voltage by combining structural and functional test procedures on a single platform. In addition to increasing test quality, test costs can be reduced by saving separate process steps.

Goepel Electronic, http://www.goepel.com

DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.

Assembléon, www.assembleon.com

UV15 is used for bonding, coating and sealing. Is a 100% reactive epoxy-based UV curable material. Contains no solvents nor other volatiles. Is free of oxygen inhibition. Cures quickly when exposed to UV light with a wavelength range between 320nm and 365nm. Typically cures in thicknesses of a few microns to 0.015-0.020 in. in 15 to 30 sec. or fewer. Cures by a cationic reaction and produces bonds that reportedly have lower shrinkage (1-2%) and higher temp. resistance than most UV systems. Tg is 90°-95°C with a straight UV cure. When post-cured for 30 min. at 125°C, Tg is 125-130°C. Service temp. range is -80°F to +350°F. Resists chemicals, including water, acids, bases, fuels and many solvents.

Master Bond, www.masterbond.com

Arduino Prototyping Shield for surface mount prototyping use novel "EZ" soldering technology for fast and easy soldering.

ezLOAD PCB support system for MPM SPM screen printers is built for batch printing and prototype work. Features machined base plate and soft, ESD-safe foam fingers. ezLOAD PAD features active grip technology to hold boards during the screen printing process; is ESD-safe. Is compatible with any SMT equipment, from pick-and-place to chip shooters, screen printers, dispensers, and AOI equipment. Is customizable.

Count On Tools, www.cotinc.com/ezload

D9600 C-SAM is a general-purpose system for laboratory/failure analysis work or for low-volume production inspection, including software and hardware upgrades. Has a linear motor x-axis scanner that leverages Gen6-style technology. Can select image resolution based on desired pixel spacing, down to 1µm, for the size scan desired. Includes Sonolytics operator interface. PolyGate technology is designed for optimizing imaging at multiple levels simultaneously. Visual PolyGate permits the operator to see all the gates (slices of time/depth to be investigated) chosen for each level of interest within a sample in a dual A-Scan display format. Each gate yields its own image. Permits the capture of up to 100 gates per channel during a single scan. Results can be turned into a 3D volumetric model. Can diagnose features within typical microelectronic samples, such as plastic-encapsulated ICs.

Sonoscan, www.sonoscan.com 

800 large format automatic optical inspection system is for printed circuit board assemblies up to 21.6" x 31.5". Offers full-color inspection. Has short programming time and combined pattern matching and condition-based AOI algorithms; has high throughput with excellent defect capture and low false calls on solder paste, components, and solder fillets. THT inspection algorithms allow for 100% inspection of through-hole component leads. Includes telecentric primary lens with the option of up to eight additional cameras for angled inspection, RGB lighting, and through lens illumination. Bench-top and inline versions are available.

MEK/Marantz, www.escapethegreyworld.com