VersaFlow 3/45 inline selective soldering machine has dual track transport and single-wave solder nozzle technology. Simultaneously solders two PCBs sized up to 508 x 204 mm (20" x 8"). Parallel processes as many as 22 PCBs in the machine at one time. With up to four individual single wave solder nozzles and eight flux heads running simultaneously.

Ersa, www.ersa.com

HR 600 hybrid rework system features bottom-side heating (2400W) divided into three independent heating zones. Hybrid topside emitter provides 800W of heating power and combines infrared and convection heating. Uses closed-loop technology. Component temperature is measured and can be controlled exactly. Noncontact temperature measurement performed via digital IR sensor (pyrometer). Optional visual process control and dip-and-print processes for solder paste or flux application. Can be adapted modularly and step by step for future rework requirements. Footprint about 85 x 60cm.

ERSA, www.ersa.com

DataMan 50L compact barcode reader is designed for 1-D oriented barcode reading. Measures 23.5mm x 27mm x 43.5mm; features IP65-rated housing. Is reportedly ideal for mounting in tight spaces on production lines and in machinery. Equipped with Hotbars, image analysis technology. Read rates can surpass 99%. Has the ability to analyze “no reads” by letting the user see what the reader sees, live on a monitor or through image archiving. Is designed with no moving parts. Features three-position lens and integrated aimer.

Cognex, www.cognex.com/50L.aspx

AsahiKlin AE-3000 fluorinated solvents have no flash point, no ozone depletion potential and low global warming potential. For use as precision cleaning solvents, moisture displacement fluids, defluxing agents for electronics, and carrier solvents for lubricants. Series includes four products that are nonflammable and noncorrosive. Have low surface tensions, low viscosities and high liquid densities; are chemically and thermally stable.

AGC Chemicals Americas, www.agcchem.com

M10 Multi Level Tester is for automated printed circuit board-level functional testing, flashing and RF tuning of smart devices like mobile phones, smartphones, tablet computers, PCs, motherboards, automotive electronics. Is scalable and modular, and for high volume production.

JOT Automation, www.jotautomation.com

Sigma F8 component mounter has a Quatro (Four-Head Structure) direct drive head. Places passive components as small as 0402s at a placement accuracy of 3 Sigma ± 36 microns. Closed-loop rotary inspection and on-the-fly component recognition. Self-loading feeder. On- and offline programming. Footprint of 1,280 × 2,240 × 1,450 mm. Stores all process and component placement data for PCB and component traceability.

Hitachi High Technologies America, www.hitachi-hta.com

Silicone macromers include monofunctional and heterobifunctional monodisperse reactive fluids. Reactive silicone fluids and materials are for adhesives, binders, ceramic coatings, dielectric coatings, encapsulants, gels, membranes, optical coatings, photolithography, polymer synthesis, and sealants.

Gelest Inc., www.gelest.com

TS9200D Series Jet Tech valve has a replaceable diaphragm. Small mass of diaphragm reportedly permits faster cycle rates. Adjustable.

Techcon Systems, www.techconsystems.com

Sherlock-300F benchtop automated optical inspection system handles components as small as 01005s. PCB assemblies are fed into the machine on a built-in conveyor, eliminating the drawer design typical of benchtop AOI. All program setup and operation is done directly on a touchscreen display using multi-touch gestures.
Generates inspection programs from pick-and-place files or CAD data import. Can be used after stencil printing for 2D solder paste inspection, after placement for component presence, placement and value verification, and after reflow or wave soldering for solder joint and final assembly inspection. Automatically adjusts for board warp and flexible substrates.

Manncorp, www.manncorp.com/aoi/sherlock-300f/

ABI BoardMaster 8000 Plus is for testing and fault-finding on almost any kind of PCB.

Includes:

• Two Board Fault Locator modules, with 128 test channels for multiple test methods for fault diagnosis and functional testing of digital ICs (in-circuit/out-of-circuit), IC connections status, and voltage acquisition, V-I Curve testing of components on unpowered boards.
• Analog IC Tester for in-circuit functional testing of analog ICs and discrete components (no programming or circuit diagrams needed). Fully configurable V-I Tester for detection of faults on unpowered boards.
• Multiple Instrument Station with 8 high specification test and measurement instruments in one compact module (Frequency Counter, Digital Storage Oscilloscope, Function Generator, Digital Floating Multimeter, Auxiliary PSU, and Universal I/O).
• Triple Output Variable Power Supply provides required supply voltages to the unit under test.

Comes in a rugged transportable case that also contains a Windows PC.

Saelig, www.saelig.com

TestWay software assesses defect opportunities and identifies possible consequences of inadequate testability and test coverage on a new design. Analyzes each stage of the design-to-delivery workflow. Checks ROHS, reliability, DPMO, BSDL file validation to guide component selection. Verifies electrical DfT guidelines. Includes standard checks and customer’s specific checks. Optimizes test probe placement according to test strategy definitions, estimates test coverage, models the cost, and calculates production yield and TL9000 initial return rates. Estimates test coverage using theoretical models for a range of test and inspection strategies. Exports CAD data into native format usable by assembly machines, AOI, automated x-ray, in-circuit testers, flying probe testers and boundary scan testers. Can read completed test program or test report and compare the coverage between the estimated and measured analysis.

Aster Technologies, www.aster-technologies.com   

VS Series vacuum soldering systems feature fast heating and cooling rates, easy profile setup and editing, and data logging. Support use of different gases, formic acid and microwave plasma. All offer a small footprint, and said to reduce solder joints voids. Supports processes such as plasma cleaning and gas exchange for advanced packaging through controlled use of gases during the soft-soldering process at temperatures up to 450C, for oxide-free and void-free connection of chip and substrate. Permit flux-free soldering and use of solder preforms. Degassing and drying can be integrated into a single process. Models include VS320, VS160UG, and VS160S.

Rehm, rehm-group.com