Alpha Argomax silver sinter pastes and films are for die attach applications. Were manufactured to perform well in fast sintering, high-volume manufacturing processes.

Atrox is a conductive adhesive for die attach applications.

Alpha, www.alphacpmd.com         

UV2000 ultraviolet light curing oven encloses Fusion UV lamp system, resulting in an 8% reduction in noise output, less RF interference, and enhanced service access. Has lamp height adjustability of 50mm – 200mm, and includes standard light baffles. Convert from single-sided to double-sided oven with four additional parts. Uses UV lamps to initiate fast UV light polymerization of adhesives and coatings. Various UV beam widths available.

PVA, www.pva.net

Model 2651A High Power System SourceMeter Instrument is for testing high power electronics, semiconductors, and materials. Features broad dynamic range, capable of sourcing or sinking up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A).

Keithley Instruments, www.keithley.com

C-EVO uses environmentally friendly technology and includes a new plate heat exchanger, single electrical box, efficient blower wheel, touch screen controller, and newly designed steam generator. Is said to have a small equipment footprint. Updated design offers easier access, reduces noise, increases airflow, and improves temperature control.

Tenney, www.tenney.com

535-10M-1 UV cured adhesive is a low stress, lower glass transition temperature (Tg) version of 535-10M. Is nonconductive, and cures rapidly when exposed to high-intensity UV light. Features low outgassing. Contains no antimony. Is said to eliminate “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. Can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

Engineered Material Systems, www.conductives.com

Insider 3 Long Tool combines 10 different screwdrivers into one lightweight, compact tool. The right bit installs into the magnetic holder in seconds for safe and simple use. Universal tool fits all standard 1/4" bits.

PB Swiss Tools, www.pbtools.us

Count on Tools, www.cotinc.com

PowerWave N2 reduces nitrogen and energy consumption. Is equipped with a closed, insulated, stainless steel tunnel system. Has hinged heat-resistant glass covers. Features fluxer unit that reduces flux consumption; has low maintenance requirements. Spray fluxer with HVLP technology reportedly ensures a stable spray jet and precise spray pattern, even at outer edges of the printed circuit board. Processed alcohol- and water-based fluxes. Flexible preheating zone configuration has active length of 1800mm; can be customized to specific production needs. May be equipped with infrared heating zones, immediately reacting quartz emitters, or convection heating modules. IR preheat zones ensure even heating of entire assembly; quartz heaters make for quick heat transfer and compensate temperature differences.

Seho Systems, www.seho.de

X⁵ profiler suggests new oven setup. Ships standard with process optimization software to improve process: to position profile in the center of the process window; maximize conveyor speed, and reduce oven’s electricity use, while running a deep in-spec process. Process optimization software verifies millions of alternative oven setups and automatically selects the most optimum recipe within a few seconds. Displays static “snapshot” of the process every time a new profile is run. Comes standard with a basic SPC package. Profile data are added to an SPC chart, which includes Cpk numbers. Hardware is designed to endure thousands of extreme thermal cycles, sometimes in ovens with voltage spikes on the conveyor, and frequently in harsh environments with rough handling. Has a full two-year warranty.

KIC, www.kicthermal.com

SensorView 2 is a smart display for Checker machine vision sensors. Can configure, test and monitor Checker 4G vision sensors without a PC. Has a 8.9" touch screen. Has built-in Ethernet-based communication. SensorView software has the same user interface as standard Checker PC software.

Cognex, www.cognex.com

DataMan 300 barcode reader now includes liquid lens optics. Can now upgrade from fixed focus to autofocus. Liquid lens variable autofocus technology is reportedly ideal for applications that require a large depth of field or when refocusing is needed after a product changeover. Intelligent tuning feature automatically selects optimum settings for the integrated lighting and for autofocus optics for each application. Liquid lens can be adjusted with software or serial commands without touching the reader. DataMan 300 has a resolution of 800 x 600 pixels; DataMan 302 has a resolution of 1280 x 1024 pixels.

Cognex, www.cognex.com

M.O.L.E. MAP 3.00 software is designed for machine-assembly-process optimization. Switches from one application to the next, transitioning between wave soldering and reflow processes. Integrates with all ECD profiling hardware. Can use ECD sensor inputs to ECD M.O.L.E. thermal profilers. Start wizards provide step-by-step guidance for new process development, existing process adjustments, data downloads and process verification. Navigation and file sharing enable links to previous sessions, multi-profile sharing through a bulk import feature, and report distribution via PDF or e-mail. Target-10 functionality provides “go/no-go” result indication, intuitive data interpretation, and deep drill-down data. M.O.L.E. and RIDER pairings separate one profiling data acquisition activity from another for environment- and application-specific information.

ECD, www.ecd.com

ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas Instruments processors. Software improvements include: Separate global and local constraint entry within the ScanExpress TPG preparation GUI; inverted transparency model support along with a new constraint to identify inverted nets; ability to associate multiple BSDL files to a single JTAG device; NAND Flash bad block management support in ScanExpress JET; optimization of STAPL file execution for improved throughput.

Corelis, www.corelis.com