Multitest Plug & Yield is for test of 3D packages. Consists of Multitest InStrip3D, a test interface board and a contacting solution based on vertical spring technology. Is used for electrical test of partial stacks during assembly of a mobile SoC. Meets requirements of partial stack test with respect to sensitive bare dies. Uses load board for fine-pitch, high layer count PCBs to support this 0.4mm pitch array application in a high pin count multisite configuration. Accommodates increased forces from the dense pogo array of approximately 6000 pins.

Multitest, www.multitest.com

ReMovl board-level shield incorporates ReCovr attachment mechanism applied to pickup bridge of BLS frame, allowing permanent, tool-less detachment of bridge after frame is soldered to PCB. Raised pickup bridge option permits clearance above components during placement and reflow. For manufacturing processes where post-reflow detachment of pickup bridge is beneficial/required. Has 0.080 in. height (min.), 0.071 in. top flange width, and 0.5-1.0 lb. typical pull force.

Laird Technologies, www.lairdtech.com

FX800 fume filtration system extracts and filters vapors and fumes associated with conformal coating and fluid dispensing processes. Is plug and play; does not requiring ducting; features adjustable airflow (speed control), flow control and brushless motors. Flow control automatically increases speed of the motor as the filter blocks. With adjustable speed control, motor does not have to constantly run at 100%.

PVA, www.pva.net

PotWatch features Web-based ordering and a scheduled method for testing, tracking and validating solder pot alloy purity. Solders within most SnPb and SAC alloy matrixes are tested to J-STD-006B standard. Maintains schedule for solder testing and sends e-mail notifications to advise of next test date; follows up with delivery of PotWatch Solder Collection Kit.

SolderLab, www.SolderLab.com

Siplace Gluefeeder is for dual-sided boards and other applications requiring selective gluing and fastening of SMT components. Is not permanently integrated into the placement machine or screen printer. Head guides components over the dispenser where a precision jet applies glue dots to them before they are affixed to the board. Products requiring glued components can be produced on different lines. Can handle deformed PCBs.

ASM Assembly Systems, www.siplace.com

QuantX is a silicone-free family of integrated dispensing components, manufactured using mold designs. Reportedly results in repeatable dispensing and a reduction in assembly rejects. Syringe barrels are available in 3cc, 5cc, 30cc and 55cc, together with accessories. Syringe barrel provides curved path to the dispense tip aperture.

Fisnar, www.fisnar.com/quantx

ezLOAD XL PCB support system is for larger boards. Can be customized for any length and width combination. Is adjustable for multiple applications. Horizontal posts can be unlocked and replaced with longer or shorter ones. Features an extruded aluminum base and soft, ESD-safe foam fingers. PAD features active grip technology to hold boards during assembly; is ESD-safe.

Count On Tools, www.cotinc.com/ezload

Paraquda SMD placement machine now comes with new dispenser option said to be capable of up to 20,000 glue or paste dots per hr. Is mounted directly on the pick-and-place head and can be equipped with a time-pressure or screw dispensing valve. Valve’s vertical motion is controlled by a motor/encoder system; high-resolution laser sensor regulates the distance between the dispensing needle and PCB. Fast exchange system available.

Essemtec, www.essemtec.com

SN100C P810 D4 lead-free solder paste is said to be lower voiding than conventional lead-free solder. Reportedly minimizes mid-chip solder balling and exhibits good wetting on all common substrates. When used in combination with vacuum reflow, produces solder joints on 19x19 mm pads and joints to power transistors with less than 1% voiding. Is based on SN100C.

Nihon Superior Co., www.nihonsuperior.co.jp/english

Premium Hot Bar Monitoring system is for Hot Bar reflow soldering, heat-seal bonding, ACF-bonding, and heat staking. Measures force, temperature, time and displacement; features Hot Bar connections and high throughput. Is equipped with MG3 Premium Hot Bar Monitor. Dual channel capability offers simultaneous monitoring. Has configurable graphic user interface with four display quadrants, graphic and numeric indicators, and online help. MG3 features on-screen SPC capability that generates real-time monitoring. Includes up to 99 available schedules and password protection. Offers interface infrastructure with RS232 or Ethernet TCP/IP. Process interrupt functions enable steering of the bonding process. USB port provides data storage and data transfer. Hot Bar Modules are integrated.

Miyachi Europe, http://www.miyachieurope.com/products/system/

U5002 closed loop desiccant dry units are designed to exceed challenges associated with IPC J-STD-033C (components) and 1601 (printed circuit boards) for handling moisture sensitive devices. Incorporate molecular sieve desiccant technology. Zeolite dryers feature dehumidification, enabling a 1400 liter cabinet to move from 50%RH to less than 5% in fewer than 4 min. Humidity levels achieved are below 0.5%RH with vapor content. Have been designed to regenerate only when necessary, based on operating load.

Super Dry, www.superdry.info

Through-hole 1mm pitch 860 series headers and 861 series single-row sockets provide support for applications requiring multiple insertions and extractions. Have solder tail diameters of 0.015"and 0.014" respectively. Tail diameters allow for smaller PCB holes. Insulator bodies have standoffs on the termination side of the connectors to aid in solder flow during the soldering process. Header and socket provide a mated height of 0.200" for board stacking applications. Are available in 2 -50 positions and are RoHS compliant; sockets have gold-plated shells and contacts; headers have gold-plated pins.

Mill-Max, www.mill-max.com/PR629