MT8870A universal wireless test set has test capability for up to eight user equipment devices in a single mainframe without the need for external switching. Basic module includes an integrated vector signal analyzer, vector signal generator, and multi-core processor. Can configure a mainframe with up to four modules with four VSAs and four VSGs. Implements test capabilities for multiple formats through the addition of VSA and VSG software options, with current support ranging from Bluetooth and Wi-Fi to LTE and 802.11ac. Can be configured with one to four VSA/VSG modules, supporting 10 MHz to 6 GHz, as well as the 160 MHz bandwidth. Each module has two duplex and two simplex RF connectors. GPIB and Ethernet control of the VSA/VSG modules are available.

Anritsu Company, http://www.anritsu.com/en-US/

X8011 PCB comes with a link to the verification station for ease of analysis. Unspecified defects can be automatically pinpointed and re-examined in detail. XMC analysis software allows convenient operation, containing several automatic analyses such as BGA, QFN and inspection, and void calculation. The verification terminal link is identical to the inline system’s. All data and images of the type of defect can be stored and called up over the traceability system. Defects that evade conclusive identification can be directly and automatically pinpointed for detailed examination; i.e., with an inclined view or zoom enlargements.

Viscom, www.viscom.com

ABI Sentry counterfeit IC detector uses a combination of electronic parameter settings (voltage, frequency, source resistance and waveform) to generate a PinPrint for each pin of the IC being checked. Compares electrical signature of known components with suspect components. Can detect missing or incorrect dies, lack of bond wires, inaccurate pin-outs and pin impedance variations. Pass or fail results are returned after testing. Device library can be built by adding specific known good devices. Each device can have documents associated with it, such as photos of device markings and data sheets. Contains hardware required to analyze electrical characteristics of ICs with up to 256 pins. 256 pins+ devices can be tested by rotating the device (BGA, QFP) to permit all pins to be learned and compared. Is supplied with four 48-pin dual inline zero insertion force sockets. Weighs 8 lbs.

Saelig Co., www.saelig.com

FactoryLook 6.0 provides a scalable enterprise manufacturing intelligence platform. Is capable of managing all equipment operations and all workflow processes required for manufacturing operations. Open architecture offers access to data and enables communications and data flow between internal and external systems. New features include management of large volumes of complex data; Manufacturing Intelligence is actionable in real-time; equipment and recipe management tools; multiple views into interactive dashboards; roles-based dashboards for operations management, and brand integration with PLCs, SCADA, and DCS equipment.

Vistrian, www.vistrian.com

VT-RNSII inline post-reflow inspection system and VT-RNSII-ptH benchtop model now have faster shutter speeds and improved image processing to perform inspections 20% faster than the original series. Use Color Highlight system that provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera system enhances solder shape recognition accuracy. Offer resolution of up to 10µm; support inspection of components as small as 01005 and 12 mil pitch. Optical Character Verification capability is standard. Have EzTS program generation software. Include models for paste inspection and pre-reflow component placement inspection.

Omron, www.omron247.com

ScanVision tool suite for boundary scan design visualization performs multi-board design visualization at the layout and schematic level. Consists of Layout Visualizer, Schematic Visualizer and Virtual Schematic Visualizer. Database is generated by importing individual design data and interconnection referencing. Tools include Cascon Board Merger and Cascon Component Explorer. Performs interactive cross-probing between schematic and layout, selective labeling of pins, components and circuits, and tracking of signal paths via multiple boards with dynamic switching. Enables operations such as test coverage analysis, hardware debugging or graphical fault display far above the board boundaries up to system level. Has System Cascon v. 4.6.1.

Goepel electronic, www.goepelusa.com

MC-400 benchtop pick-and-place machine places 0201s through 100 x 150mm SMDs. 01005 available. Has a placement rate of 3,000 pph. Picks from cut strips, reels, sticks and waffle trays. Has ±0.05mm accuracy and ±0.01mm repeatability. Includes remote diagnostics and full vision alignment. Has a placement area of 415 x 320mm.

Manncorp, www.manncorp.com 

Ultima TR2 series selective soldering and fluxing system, for soldering through-hole components and connectors to surface mount and mixed technology PCBs, incorporates a high-precision x-, y-, and z-axis drive that moves the PCB, rather than the solder pot, resulting in a lightweight construction that takes up 36” x 31” of table space. The 35 lb. solder pot and pump assembly features an integral nitrogen hood with a built-in micro-preheater for inerting solder site and stabilizing wave temperature. Feeds live video of soldering process to PC via standard bottom-side witness camera. Universal PCB holder with quick-release cam-locks handles boards up to 13” x 10”, while a larger model is available for 18” x 15” assemblies. Separate fluxer improves throughput (no waiting for soldering to finish before fluxing and vice versa) and keeps over-spray and sticky flux residue away from the soldering operation.

Manncorp, https://www.manncorp.com/selective-soldering/

ProBot is an automatic profiling system that verifies whether each printed circuit board is processed to specification in the reflow oven. Suspect PCBs can be sent to batch x-ray. Allows for more effective sampling. Is designed to fit virtually any reflow oven. Is highly modular; can specify desired features.

KIC, www.kicthermal.com

Sarcon 30QR is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. Is available in roll or sheet form and can be die-cut, molded or extruded. Use for conductive insulator for semiconductors, compression joining material for thermistors and temperature sensors, as well as gap filler material for all types of heaters. This V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.

Fujipoly America Corp., www.fujipoly.com

PrintoCent Pilot Factory now performs roll-to-roll assembly in addition to roll-to-roll printing. Combines functionalities created through printing technology with silicon-based and other electronic components into a functional end-product. Is automated, and handles entire rolls or any substrate in sheet form, and can be used to assemble a great variety of components, from semiconductor chips size of 100µm to flexible solar panels and batteries.

VTT Technical Research Centre of Finland, www.vtt.fi

PCB West: The Silicon Valley's leading printed circuit design and manufacturing conference: Sept. 25-27, 2012 www.pcbwest.com

VTOS Builder user-configurable verification and test OS provides a test platform for quick verification of new design and debug problems in embedded hardware. Tests for design correctness and production readiness in less than one week. Is reportedly easily configurable for new prototype hardware. Can be used across multiple embedded design projects. Loads and runs on custom hardware in 30 minutes. Uses a device tree without compilation. No OS porting required. New components can easily be added and device parameters configured by editing the device tree.

Kozio, www.kozio.com