Model 2651A SourceMeter instrument reportedly provides the widest current range available for testing high brightness LEDs, power semiconductors, DC-DC converters, batteries, and other high power materials, components, modules and subassemblies. Offers a four-quadrant voltage and current source/load coupled with precision voltage and current meters. Combines functionality of multiple instruments in a single full-rack enclosure: semiconductor characterization instrument, precision power supply, current source, DMM, arbitrary waveform generator, V or I pulse generator, electronic load and trigger controller. Is expandable into a multi-channel synchronized system via TSP-Link technology. Can source or sink up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A). Measures signals as low as 1pA and 100 mV at speeds up to one microsec. per reading. Provides a choice of digitizing or integrating measurement modes for characterization of transient and steady-state behavior. TSP Express LXI-based I-V test software is embedded.

Keithley Instruments, www.keithley.com

NicAlloy-XT stencil technology combines NicAlloy and electroform stencils. Bridges the gap between traditional laser cut stencils and electroform stencils. Meets aspect ratios down to 0.46. Incorporates NiPlate process for smooth aperture walls. Offers superior paste release and improved underscreen cleaning. Manufacturing processes produce uniform stencil thickness; high-quality print deposit.

Photo Stencil, www.photostencil.com

VT-RNSII inline post-reflow inspection uses faster shutter speeds and improved image processing to perform inspections 20% faster than the original VT-RNS series. Permits faster throughput and more detailed inspections of densely populated boards within the same cycle time. Uses color highlight system, which provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera obtains 3x the information of a conventional 1-CCD camera. Offers high resolution of up to 10 μm; supports inspection of components as small as 01005 and 0.0012" pitch. Optical character verification is standard. Includes EzTS program generation software. VT-RNSII-ptH benchtop model is available.

Omron Industrial Automation, www.omron.com

Sherlock automated design analysis software analyzes, grades and certifies expected reliability of printed circuit board assemblies. Can design-in product reliability earlier in the product development process; provides results within hours. Incorporates physics-of-failure.

DfR Solutions, www.dfrsolutions.com

S3088 flex system is an enhanced model to S3088-III. Is designed to combine high-reliability inspection capability with ease-of-programming features. From prototype capability to high production speed, this platform was designed to meet flexible AOI requirements. Intel core i7 computer and touch-screen monitor are included. vVision inspection software is optional. Reportedly ensures 100% inspection compatibility.

Viscom, www.viscom.com

Genesis Series 2 surface mount placement platform places passives down to 01005, 20mm sq., 0.4mm-pitch µBGAs; QFNs; and high-density, low-profile connectors. Part sensor verifies part presence immediately prior to placement. Reduces changeover up to a reported 75% with dual-platform tray feeder and flexible feeders. Max. board length 1016mm. Has linear motors with closed-loop 1µm positioning. Features dual on-the-head cameras that provide high magnification and wide field of view to vision components up to 30 x 30mm and up to 6mm tall. Digital upward-looking camera provides a 55mm field-of-view. Includes  1-, 2-, and 4-beam configurations  and three placement head options for throughputs  of up to 140,000 cph on the 4-beam version.                                                        

Universal Instruments Corp., www.uic.com

SD 903 semiautomatic stencil printer is modular and features defined squeegee pressure. Automatic squeegee feed guarantees each squeegee operation is done in a predefined speed. Accepts all stencils, fixed frames or quick-clamping devices. Tiltable double-squeegee reportedly is easier to clean. Reportedly can be configured in minutes without tools. Upgrades to automatic version.

Fristch SMT, www.fritsch-smt.de

V810 automated optical inspection caters to different sizes of printed circuit boards. Vision Handler is for surface, marking or dimensional defect inspection. Standalone manual loading/unloading. Inspects double-sided panels. Detects shorts, opens, missing component, non-wetting, billboards, tombstones, lifted leads, solder balls, voiding, insufficient solder, reversed tantalum capacitors and excess solder. Features offline programming SW; virtual live image for troubleshooting; adjustable image quality tools and a component library. Inspects boards with a max. size of 457 x 609mm. Typical image acquisition rate is 32.3cm²/sec.

Vitrox, www.vitrox.com

EPM-2890 is a thermally conductive, non-corrosive silicone adhesive. Provides moderate heat transfer between electrical components and heat sinks. Exhibits less than or equal to 1% weight loss when heated for 30 min. at 275ºC to withstand Pb-free solder reflow. Is a one-part, white silicone adhesive that will room-temperature vulcanize, with moisture, in 72 hr. Can be used as an adhesive, sealing, caulking or potting material. Offers 100 psi min. primer-less adhesion on aluminum. Provides thermal conductivity at 0.6 W/(mK). Has an extrusion rate of 40 gm per min. Is ROHS-compliant. Has low sodium, potassium and chloride content.

NuSil Technology, www.nusil.com

Insite B benchtop AOI for post-placement inspection features a compact optical head, capable of supporting up to five high-speed, high-res color cameras. Cameras are connected to the computer without any frame grabber. Cameras come in 5 or 10 MP. Illumination is provided by a controller with 16 individual LEDs. Software enables fast programming through a task-oriented interface.

Orpro Vision, www.orprovision.com

Inert Wave Soldering technology is said to reduce manufacturing and material costs, including nitrogen flow rates; significantly increase soldering joint quality; and enable Pb-free soldering. Reportedly reduces key defects by 90% and dross formation by 96% in production.

Air Products, www.airproducts.com/electronics_assembly

SLM120 high-speed LED mounter reportedly increases speed, efficiency and throughput by means of an adaptive head design; can simultaneously pick up multiple LEDs from a single feeder, regardless of LED size or tape pocket pitch. Can place LED packages from one feeder in excess of 28,000 cph on printed circuit boards up to 1200mm in length.  Has a dual-gantry design and single-side operation.

Samsung Techwin Co. Ltd., www.samsung-smt.com