The free, illustrated 2011-2012 Dummy Component Catalog is now available. Features dummy components that have the same materials and are made on the same production lines as live components, as well as standards and future technology needed. New sections in the catalog include an expanded selection of flip chips and flip chip test kits; Quick-Pak open-molded quad flat pack no leads; FusionQuad board and kits; IPC A620 compliant wire harness kit; IPC PCB-J-STD compliant hand solder kit; PCB-B-25A standard test board; PCB-B-24 standard test board, and PCB-B-36 standard test assembly. Numerous product revisions also are included. Additional technology includes Amkor’s TMV package; WLP Wafer Chip Size Packages’ finished package, and a Dummy Component Sample Case.

Practical Components, http://www.practicalcomponents.com/catalog.htm

MFR-1300 standalone desoldering equipment builds on existing MFR technology. New design permits hand piece to be used in two configurations. Can swap grip on hand piece from standard pencil grip to pistol grip. Power supply features internal pump that provides 0.7 bar (21" Hg) of vacuum suction force, combined with Smartheat technology. Has dual switchable output; can operate one or two different hand pieces. Includes replaceable collection chamber. Solder collection capabilities reportedly have been increased 40% from previous MFR desoldering systems.

OK International, www.okinternational.com

DT85M Series 3 Data Logger is for remote monitoring. Features cellular modem. Backlit LCD display shows channel data, alarms, and system status, navigable with six-button keypad. Features temperature operating range of -30°C to 70°C and up to 85% RH. Construction is powder-coated steel and anodized aluminum. Design (peak power 12W) permits use of a smaller solar panel. Enables automatic data delivery. Can send logged data to an FTP server. Internal storage capacity is 128MBs; has removable USB storage device support. Configurable alarm conditions can be used to trigger data delivery and send alarm messages to multiple email addresses or mobile phones. Features 16 analog input channels, expandable up to 320 channels and 960 analog points using optional CEM20 modules, as well as 12 flexible digital channels. Has up to 48 analog sensor inputs with two serial smart sensor ports. Fundamental inputs include voltage, current, resistance and frequency. Supports thermocouples, RTD, thermistors, monolithic temperature sensors, and 4-20mA. Maximum sample speed is 25Hz with 18 bits of effective resolution. Modbus is supported for SCADA connection, as well as multiple SDI-12 interfaces for environmental sensors. dEX graphical interface comes preinstalled.

CAS DataLoggers, www.DataLoggerInc.com

C245 Super Cartridges are for high thermal efficiency. Permit T245 hand piece station to supply the most power possible to the solder joint. Bottleneck is usually the tip of the cartridge.

JBC Tools, www.jbctools.com

OptiCon X-Line 3D x-ray inspection system enables a safe quality control of solder joints on opposed mounted BGA components, such as in double-sided equipped DDR-RAM modules. Single-sided and double-sided equipped PCBs can be inspected within one test run. Can analyze both top and bottom sides of boards and all layers in between layer by layer. Each BGA solder ball is localized in x/y-direction, as well as z-direction. Relevant parameters of each solder joint are determined in three layers. Open solder joints and wetting defects can be detected; voids can be determined in size and z-position within a solder joint. Is able to detect solder connections at IC pins and two-pin components, as well as THT components. Uses GigaPixel image technology. Real-time multi-angle image recording enables a test speed of 40cm²/s for full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of single layers.

Goepel electronic, www.goepel.com 

LMF 2000-SM 20W single mode fiber laser marker is for marking, scribing and cutting applications. Can produce finer lines (less than 30 µm) and increases the mark working area. Has an increased depth of focus for marking on curved surfaces. Is reportedly ideal for scribing and cutting alumina, silicon, copper and aluminum foils. Has high beam quality, with an M2 of less than 1.2. Permits only one propagation mode of light. Features a compact, air-cooled, robust design; PC, touch-screen, standalone or pendant operation; rotary and XYZ motion options, and a variety of marking software alternatives. Is compatible with all LMF standard configuration options for optics, heads, PC and motion.

Miyachi Unitek, www.miyachiunitek.com

FREH Freezer and EADH Air Duster contain hydrofluorocarbon propellant with improved environmental properties; reportedly can reduce CO₂ emissions by >99.5%. FREH Freezer is a nonflammable, noncorrosive refrigerant used for cooling small electronic and electrical components. Is said to lower temperatures to at least -50°C in seconds. Detects faulty soldered joints and overheating parts. Has an added extension tube. Eliminates dry joint location. Nonflammable EADH Air Duster helps remove all dust and airborne contamination from fragile or inaccessible areas on electrical and electronic equipment.

Electrolube, www.electrolube.com

CheckMate Stockroom software keeps track of inventory items by location. Can track inventory in the main stockroom, as well as multiple other locations. Tracks inventory by multiple units of measure (each/ml/in²) and records lot numbers, serial numbers and expiration dates. Reports provide replenishment information and usage. When used with CheckMate JobData Job Tracking and ToolroomTool/Equipment Tracking, it becomes a production management system. Can create manufacturing orders, bills of materials, and sales orders. Jobs can be tracked through production, and labor and parts cost against the job.

Dynamic Systems, www.a-barcode.com

Vision Mini smart camera is designed for embedded clinical and lab automation applications. Automates critical inspection tasks such as cap presence, color matching, and test tube identification, in addition to reading 1D and 2D barcodes. Measures 1.8" x 2.1" x 1"; permits flexible positioning in tight spaces. Features fully integrated lighting, autofocus lens, AutoVISION software tool set, and wide angle optics for close-range applications.

Microscan, www.microscan.com

Fanuc M-1ia is a lightweight, compact robot designed for small part handling, high-speed picking and assembly applications. Parallel-link structure reportedly provides higher speeds and accuracy compared to traditional assembly robots. Is available in two models (4- or 6-axis) for various applications and can be installed in multiple orientations. Is also available in three configurations, including robot-only (no stand), desktop mount with stand, and ceiling and angle mounting. Can be mounted to taping equipment. Enables part feeding from the sides of a work zone. Has R-30iA Mate rack-style controller.  Detachable color-graphic iPendant or monochrome pendant can be shared between multiple robots on the same assembly line.

Q Corp., www.qcorporation.com

3DIR metrology system includes confocal IR laser scanning microscopy for measuring post-bond parameters of 3-D stacked integrated circuits. Is a nondestructive, through-silicon metrology technique that monitors a variety of post-bond parameters, including overlay alignment accuracy, bonding interface thickness variations, and bonding interface quality including pre- and post-bond defect inspection and review. Measures alignment points at selected die of bonded wafers, stores images and data, and summarizes results. Correlation of overlay alignment offset data to electrical yield provide an early indication of bonded wafer yield. Software tools display data in the form of vector maps. Confocal capability permits thin optical sectioning in Z and construction of 3-D images of the bonded wafer interface and structures. 3-D reconstructions can be used to create sections in the XZ plane. Bonded wafers are automatically scanned at low magnification. Images are stitched together to form a single wafer image. When the overlay vector map is superimposed on the scanned wafer image, correlation of many of the failed overlay measurement points to bonded interface anomalies can be seen. Stitched image can be viewed and zoomed. Any site can be revisited and the image reviewed or rescanned and imaged using the IR microscope with objective magnifications up to 90x and 0.14µm pixel resolution.

Olympus Integrated Technologies, www.olympus-ita.com 

Gen6 C-SAM acoustic micro-imaging system retains virtual rescanning mode, digital image analysis, frequency domain Imaging and time domain imaging. Has inertially balanced linear motor scanner. Includes master control unit with a Windows 7-based computer with Intel QuadCore 64-bit processor. Operates Sonolytics software with PolyGate. Can select most useful resolution from under 1 mp to 268 mp. PolyGate permits automatic and simultaneous imaging of a sample at up to 200 different gates (horizontal “slices”). Useful searching for white bumps, die tilt, stacked die defects, etc. Has a 500MHz pulser with improved signal stability. Incorporates heated water to increase image quality by reducing signal and frequency losses in the coupling fluid.

Sonoscan, www.sonoscan.com