Mydata Midas C24 MicroMelf nozzles are for OD 1mm MELF components. Feature a tool tip radius of 0.5mm and a tool tip diameter of 2mm. Replacement nozzle tips come in packs of three. Are compatible with the following machine types: TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19 and MY100 (SX/DX). Replacement tooling nozzles include Standard Midas nozzles (A12, A13, B12, C14, A24S, etc.), Custom Midas nozzles (B34 Melf, Grippers, LED Nozzles, etc.), Hydra nozzles (H01, H02, H03, etc.) and other spare consumables (filters, grease, feeder parts, spare tips, etc.).

Count On Tools, www.cotinc.com

Generation 88 through-hole placement machine offers improved speed, throughput and functionality with a new control architecture and operating system. Includes Radial 88, VCD/Sequencer 88, and the Single-head Jumper Wire 88. Is suited for LED and other solid state lighting placement. Has low PPM levels. Available in standalone and pass-through configurations.

Universal Instruments, www.uic.com

Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Henkel, www.henkel.com/electronics

MC-392LED is for populating extra-long LED panel assemblies in a single pass. Optional CT-150 conveyor extension unit enables two-stage assembly of LED boards of up to 1.2m (47.25”) long. Dual-head placement rate is 6,400 cph. Features ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm @3 Sigma. Cognex-based “on-the-fly” vision system views packages from 01005 to 16 x 14mm, including CSPs and µBGAs. Optional upward-looking vision cameras align components up to 150 x 100mm, including large BGAs and QFPs to 0.3.mm (0.012”) lead pitch. Vision inspection camera selectively checks solder paste printing and component placement accuracy. Has 192 tape feeder capacity.

Manncorp, www.manncorp.com/pick-and-place/mc392led

Mydata replacement inline filters increase vacuum and air performance in equipment; last longer than OEM versions. Are capable of capturing particles as small as 0.1 µm. Include K-012-0015 (includes housing, o-ring, mesh filter and two couplers) and K-012-0016 (pack of 12 filters with enhanced air performance and durability). 

Count on Tools, www.cotinc.com

S3088 flex inspects printed circuit board assemblies. Is an enhanced version of S3088-III AOI. Combines high-reliability inspection capability with ease-of-programming features. Is for prototype capability to high-production speed. Intel core i7 computer and touch-screen monitor are included. Has optional operation of vVision inspection software. 100% inspection compatibility.

Viscom, www.viscom.com

FX series AOI has upgraded YESPC software. Is suited for high-volume or high-mix manufacturing, providing inspection of 01005 components. Includes Advanced Fusion Lighting and 5 megapixel color image processing. Software is a web-based statistical process control tool that can be used for real-time and historical charts and inspection reports. In real-time mode, it focuses on defect prevention by monitoring for unwanted trends in the manufacturing process. User selectable “chart windows” can be configured to show defect paretos, yield trends, machine utilization, as well as X-Y positional and Cp/Cpk data.

Nordson YESTech, www.nordsonyestech.com

Advantis 3 surface-mount modular placement platform is for medium-volume environments. Has VRM linear motor technology that provides improved accuracy, acceleration and velocity without the downtime of lead screw-driven positioning systems. Includes 30-spindle Lightning head. Vision capability can be expanded or spindles added without changing heads, delivering a throughput of up to 34,400 cph. Has a component range of 0201 passives through 150mm connectors and expansive odd-form capabilities. 1- and 3-beam base models are available, as well as a large overlapping component range between placement heads.

Universal Instruments Corp., www.uic.com

MT2168 pick-and-place handler places each individual package in the optimum position relative to the contactor, even in high parallel test setup. Self-alignment is performed in 6°, solving deviations in planarity or outline.

Multitest, www.multitest.com/MT2168

No. 813 walk-in printed circuit board curing oven, has a 350,000 btu/hr., 500°F gas heater. Workspace dimensions are 48" x 48" x 72".  Has 4" insulated walls and an aluminized stainless steel interior and exterior. A 3300 CFM, 2-HP recirculating blower provides horizontal airflow. Safety equipment, such as a 325 CFM 1/3 powered force exhauster, is included. Features a 2" insulated floor with truck wheel guide tracks and a removable top-mounted heat chamber.

The Grieve Corp., www.grievecorp.com

Innova and Innova + direct die feeders enable presentation of wafer-level devices to GenesisSC platform. Are portable; can assemble a complete module on a single machine, placing die and passives precisely. Can install multiple feeders on a single placement machine with minimum feeder slot consumption. Alternate feeder functionality permits continuous running of like part numbers on multiple feeders. Present a wide variety of flip chips or circuit-up devices with easy relocation. Process wafers of various sizes up to 300mm. The latter processes up to 13 300mm wafers with on-board expansion capabilities.

Universal Instruments Corp., www.uic.com

HawkEye Bridging post-print verification technology has added capability of shorts and contamination detection. Is a high-speed paste-on-pad verification system that delivers instant go/no-go instruction.  Highlights insufficient paste and prompts corrective action.

DEK, www.dek.com