Statistical Process Control software tracks manufacturing data and presents in pie charts, pareto charts, etc. using different parameters, including pad size, part number, pad shape, part type, by PCB supplier and other metrics. Can be used on or offline. Generates reports without stopping production with constant, automatic updates as an optional function.

Koh Young Technology, www.kohyoung.com

 

Zestron Bath Analyzer 10 and 20 are now available in 5-liter containers. Have been formulated to measure the concentration and indicate alkalinity of baths containing Atron, Vigon and cleaning agents. Developed as an alternative to the Refractive Index method; are designed to monitor chemical bath concentrations irrespective of dissolved organics.

Zestron, www.zestron.com

 

 

No. 926 is an electrically heated 250°F shelf oven and environmental test chamber. Is used for age-testing electrical/electronic components. 12kW installed in Nichrome wire elements provide heat to the load. Workspace dimensions measure 68" x 30" x 66". A 1000 cfm, 1 HP recirculating blower provides horizontal airflow. Features 4" insulated walls, aluminized steel interior and exterior, plus a 20" x 56" double-pane Lexan window in each of the unit’s two doors. Includes a disposable fresh air filter, digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blow airflow safety switch and a remote control panel.

 

The Grieve Corp., www.grievecorp.com  

Horizon screen printer is equipped with new cover packages. Provide instant access to the front and rear of platform; are lightweight and reportedly eliminate the need for further tooling. Have quick release panels. Preconfigured platforms include Horizon 01iX, Horizon 02iX and Horizon 03iX.
 
DEK, www.dek.com

 

VectorGuard double-layer platinum stencil is for semiconductor applications and component manufacture. Is fabricated through a two-step lithography and nickel-electroforming process. The mesh layer holds the stencil intact. The circuit layer determines the thickness and shape of print deposits. Is for solar cell manufacture or LTCC manufacture. Reportedly prints long conductive lines without diminishing stencil strength. Combines filling and innerlayer printing stages. Dimensional accuracy said to be better than 0.1µm/mm.
 
DEK, www.dek.com
 

The 5.0/7.5/10.0 mm triple-span radial machine has large span capacity that reportedly virtually eliminates manual assembly requirements. Features 10 mm tooling for the Radial 8XT. Comes in standalone and pass-through configurations. 15 mm dispense head tooling is offered.

Universal Instruments, www.uic.com 

 

Tridak Model 785 poppet valve dispenses low-to-medium viscosity materials, such as adhesives, silicones, greases, and other filled materials. Design minimizes friction between the actuating components of the valve and the material being dispensed. The stroke adjustment and control feature offers precise adjustment of fluid deposit volume and flow. Material is shut off cleanly at the end of each cycle. Peak performance is obtained when actuated with Tridak Model 345 valve controller.

Tridak, www.tridak.com

 

Circuit frames for PCB repair can be custom laser-engraved to match the pads or trace areas requiring repair. Patterns on the frames can accommodate spaces/traces down to 0.025 mm. Designed for SnPb and Pb-free processes. Cutouts replace pads or traces on 1 oz copper PCBs. Come in epoxy and dry-film versions. Custom patterns can be laser-machined with lot sizes as low as one.
 
BEST Inc., www.solder.net

 

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

S3088-III AOI features enlarged inspectable PCB dimensions and improved camera technology. Is for economical electronics assembly inspection, from prototype to large series. Can be deployed for paste print or placement inspection. In high-resolution mode, reportedly detects defects on 01005 components. Revised PCB transport permits boards up to 20" x 20" to be inspected. Can be equipped for extreme cycle time requirements or heavier PCBs. Offers color evaluation for angled inspections. Comes with switchable resolution with the OnDemandHR function or integrated verification.
 
Viscom, www.viscom.com

MY100DX pick-and-place machine assembles components on high-mix boards at up to a reported 34,000 cph.

MY100SX handles batches or continuous production up to 21,500 cph.

MY100LX is for high mix operations.

Each now has higher-count feeders without no change in machine footprint. Work with Agilis intelligent feeders.

Mydata Automation, www.mydata.se