JTAG Live is for checking PCBs for basic continuity and correct operation. Consists of three products: Buzz, Clip, and Script. Is compatible with JTAG programming cables from Altera and Xilinx, as well as with the two-port USB Explorer. Buzz provides the ability to check quickly (direct and indirect) connections between devices supporting boundary-scan; Clip offers ways to verify cluster logic using vector-based cluster tests, and Script enables users to adopt a functional, device-oriented test approach to take control of a design through on-board JTAG/boundary-scan compliant devices.

JTAG Technologies, www.jtag.com  

Sawa Eco-Roll SC-ER360 wiper roll cleaner removes solder paste using ultrasonic vibration. Is said to clean wiper rolls in 20 min., permitting their reuse. Measures 900 x 850 x 1200 mm.  Works with most solvents recommended by paste manufacturers.

Seika Machinery Inc., www.seikausa.com

IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards defines recommended requirements unpopulated single, double-sided and multilayer printed circuit boards. Provides specifications and requirements for maximum limits of ionic contamination using ion chromatography testing. Delivers guidance on cleanliness testing for both product acceptance and process control, verifying equipment and chemistries are stable.

IPC, www.ipc.org/ipc-5704

MS6000 Nano Rework Station is a manual system for chip sizes down to 0402 mm (01005). Handles parts from taping parts feeder or individual parts feeder. Parts can be picked by a vacuum bit and positioned by the CCD camera system. Has rotatable circular glass palette for monitoring. Features dispensing capabilities with a 5 cc syringe. Options include tweezer head, center vacuum bit, and 8 mm tape feeder.

Seika Machinery Inc., www.seikausa.com

FlyScan module integrates boundary scan and flying probe, and comes on the Pilot/Aerial flying probe testers. Is said to ensure automatic generation of the test program in a single software environment; automatic creation of the boundary scan program for non-JTAG nets, using the extended test function and the flying probes to transform them into JTAG testable nets; automatic elimination of test redundancies; automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component; and management of the faults detected by the boundary scan test in the repair station environment.

Seica Inc., www.seica.com

 

EMI/RF shields with snap-on, snap-off covers permit easy access to components within the shields. Are designed to protect components from radio frequency/electromagnetic interference and environmental hazards, and to provide electrical grounding. Standard forming tools come in any size and shape. Shielding options include one-piece or two-piece construction; standard base materials, including brass, tin, SnPb, nickel, copper, and cold-rolled steel, all of which can be provided with solderable plating, and NiAg base material.

Photofabrication Engineering Inc., www.photofabrication.com

Fischerscope XDAL and XDLM x-ray spectrometers are available. XDLM spectrometers with micro-focus tube and proportional counter tube are suited for the inspection of parts where small structures are measured. Typical applications are measurements on PC boards, plug contacts and electronic components. Are equipped with four exchangeable apertures and a programmable XY(Z) measuring stage. Are for testing mass-produced parts.

XDAL spectrometers with silicon PIN detectors provide reliable analysis results and coating thickness readings. Have a precise XY(Z) measuring stage. Are for automated sample measurements.

Fischer Technology Inc., www.fischer-technology.com

Cycle Stop Controller is an Ethernet-enabled device that electrically integrates with the cycle stop circuit of any machine type. When used with a software module such as line setup control, route control and MSD control, the application forces the machine to stop processing when a process validation error occurs. Eliminates the risk of building defective product due to invalid machine setup or trying to perform an operation out of sequence. Can be integrated with any third-party software application with a communication protocol using TCP/IP socket connection.

Cogiscan Inc., www.cogiscan.com

Ceasolder PAL is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Contains no ammonia; is non-corrosive to copper, gold, silver or pre-soldered surfaces. Is for robotic, pneumatic, hand-applied or template screening. Is easy to peel and non-flammable. Is available in 8 oz. squeeze bottles and 1 gal. containers.

Qualitek International Inc., www.qualitek.com

 

DSP866 is a no-clean, Pb-free, no-halogen solder paste. Is said to provide print definition characterized by brick-like prints. Good release is seen on 0.00" - 0.012" apertures with print speeds in the range of 1 - 6 in. per sec. Performs during continuous printing for up to 8 hr. Residues are said to be nonconductive, noncorrosive and highly insulated. Flux classification ROL0 per J-STD-004. Available in standard gray or patented green formula.

Qualitek International Inc., www.qualitek.com

An enhanced version of the interface between Pantheon layout software and Quantum Channel Designer and Quantum-SI products permits the determination of operating timing and voltage margins for high-speed interfaces. Along with Xtent high-speed design option, it provides a tool set for advanced signal integrity.

Signal Integrity Software Inc., www.sisoft.com
Intercept Technology Inc., www.intercept.com

 

The solder paste recycling unit enables approximately 90% of waste solder paste to recover as solder bar. Reduces CO2 emissions. Waste materials are mainly flux effluent, filter and waste cloth. Waste material is less than 1/10 the volume. Required time to recycle is approximately 35 to 45 minutes. Enables selection of manual or automatic mode using touchscreen panel. Max solder capacity per cycle is approx. 5.5 lbs.

Seika Machinery Inc., www.seikausa.com