Two IC thermal detection units for the Aerial flying probe tester detect thermal parameters of ICs under power. Compare temperatures of known good boards to suspect boards, and indicate bad components. Reportedly permit precise thermal measurement of the IC or other components while the part is powered up, even under low-voltage conditions.

Seica, www.seica.com

The Asset and Inventory Tracking System is a secure method of tracking, locating and managing assets. Includes 3M software, RFID or barcode tags and corresponding readers. No need to install and configure servers or purchase database licenses. Either 3M or third-party hardware and tags can be used by the software, providing leverage with equipment already owned. Barcode printing feature permits use of existing printers. A commercial-grade wireless handheld reader is for mobile asset management. Data are automatically backed up in a Tier III data center. Can tag assets with an RFID or barcode tag, after which fixed or mobile handheld readers can be used to check out items to individual users, locate assets in a workflow or provide more visibility of inventory. Includes a search and report function. Can attach documents such as owner’s manuals and warranties to the asset record.

3M, www.3Mtrackandtrace.com/tracking

MaxiReflow process gas cleaning system for reflow ovens is equipped with cyclone technology. Extracts contaminated process gas from all heated zones, leads it through a cyclone and then directs the cleaned gas back to heating area. The temperature inside the cyclone is controlled. By injecting a small amount of water into the cyclone, both liquid and solid residues are washed off and led into an active carbon filter unit. Is configured as closed system.

Seho Systems GmbH, www.seho.de

Vision series convection reflow ovens have new cooling zone designs. Are effective for the homogenous cooling of large thermal mass PCBs. Cooling area in VisionXP is laid out in 2, 3 or 4 stages. Fans in the individual zones, available with separate speed/volume control, can cool Pb-free processed PCBAs to below 50°C.  Bottom-side cooling configuration now available. The design is useful for uniformly processing thick PCBs, workpiece carriers, and PCBs with unevenly distributed copper innerlayers.

Rehm Thermal Systems, www.rehm-group.com

 

Condor EZ bond testing solution offers multiple test capabilities. Standard bond testing applications include wire pull, ball shear, die shear; also has capability to perform peel testing, push testing, and roller testing. All tests can be done on one test head; features four different measurement sensors. Can perform mechanical shock testing by changing the test head for impact testing or ribbon peel testing of photovoltaic cells by using USB tweezers. Joysticks move the X-Y stage to the desired position and feature 12 logically arranged buttons. Software features onboard graphics and intelligent wizards.

Xyztec, www.xyztec.com

 

V-M.O.L.E. solar profiling kit is photovoltaic solar cells metallization. Combines elements of legacy profilers with adaptations for metallization’s special requirements. Comes with the V-M.O.L.E. thermal profiler; special solar thermal barrier, which is 0.7" in height, MAP software; and special thermocouples. Includes OK button. The three-channel profiler provides quick-charge capability to go from dead-to-profiling in fewer than 15 min. Can quickly program key parameters and control limits into memory. Configurable report page offers more than 180 customizable data extractions. Steel enclosure is a 0.7" x 3.1" x 9.3". Alloy stainless steel sheathed thermocouples are 0.020" diameter x 12" Type-K with standard mini-connectors and can handle temperatures up to 1150°C.

ECD, www.ecd.com

Cantilever Cart comes in standard and custom versions. Is flexible with a lightweight, small footprint. Many accessories can be clipped onto the cart. Uses include: storing bins or totes at any height or location (KanBan); holding tools or work-in-progress; staging; moving heavy items (estimated 100 lb. capacity). Can be used in electronics test and compliance labs, or as a repair cart for machine support and maintenance personnel.

Bliss Industries, www.blissindustries.com

Inert atmosphere cabinet oven No. 799 is used for processing ceramic components prior to assembly. Features max. operating temp. of 750°C; workspace dimensions of 38" x 38" x 50"; 60 KW installed in alloy wire high-temperature plug heaters; 3000 CFM, 3 HP alloy recirculating blower providing horizontal airflow; 12" thick insulated walls; stainless steel interior; solenoid operated door lock. Includes pressure regulator, flow meter, pressure gauge, internal high-temperature gasket, bellows type seal in doorway throat area, 1/2" thick silicone rubber atmosphere seal, blower shaft seal, positive latching door hardware, adjustable offset door hinges, outlet with pressure relief, interior seams welded gas-tight, all wall penetrations fitted with compression fittings. Has 325 CFM cooling blower to pull room air through air jacket on inner oven for additional cooling.

The Grieve Corp., www.grievecorp.com

VT-S700 high-speed inline AOI is said to improve inspection accuracy and increase throughput by shortening tact time with an expanded field of view. A telecentric lens with a 2-MP camera reduces image distortion. Inspects at up to 10 µm resolution for components as small as 01005.

VT-RNS inline AOI system has a color highlight system that provides solder joint illumination by providing 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera enhances solder shape recognition accuracy by obtaining three times the information of a conventional 1-CCD camera, delivering inspection results down to 10 µm resolution. EzTS Easy Teaching software for VT-RNS enables operators to create and fine-tune inspection programs. A setup wizard format for component color, fillet color, etc. automatically generates inspection criteria.

VP6000 high-speed 3-D SPI system inspects solder paste deposition at inline speeds.  Uses structured light to perform 3-D inspections. Automatically adjusts Z-Axis for board warpage. Reportedly programs in less than 15 minutes with the importing of a single Gerber file and a CAD placement file.  Includes a full complement of SPC charts and graphs in the standard offline programming station.

Omron Electronics, www.omron247.com

StencilMate polyimide stencil is for reworking and hand-placing leadless devices such as QFNs, MLFs and LGAs. Controllably bumps leadless devices. Build-to-order stencil pairs are said to prevent bridging of neighboring solder joints while accommodating QFNs into stay-in-place stencils on the PCB. After removal of the leadless device, one of the stencils is peeled from its release liner, then aligned on the part. Solder paste is then squeegeed into the stencil apertures and reflowed. After reflow and stencil removal, the device has very uniform bumps, which then permit the leadless device to be placed similar to a BGA. Other processes have a mating stencil on the PCB, and the part is then fitted into the loaded apertures and reflowed. Comes in 0.10 to 0.20 mm thickness.

BEST Inc., www.solder.net

 

These ionic cleanliness test systems have larger test capacity and innovative measurement software and hardware. Deliver a measurement accuracy with a range of 0.01 - 30µg/cm² (auto-ranging) and measurement sensitivity of <0.25% of range. Test times are generally less than 5 min. Deliver a test measurement accuracy of better than 0.005µS. Use a solid gold measurement cell and a ballistic amplifier in the measurement circuitry.

GEN3 Systems, www.gen3systems.com

 

 

istorage automatic modular cabinet manages SMD reels from 7 to 15, QFP/BGA trays, PTH components, PCBs, and other parts. Can handle up to 5,500 reels. Permits multiple pick of part racks. Is bar-code driven, and calculates component quantities for single or multiple orders. Includes “count down” management for MSDs.

i-tronik, www.itronik.com