BR 300 soldering robot is based on four numerical axes for the automation of bottom-side selective point-to-point or linear iron soldering operations. Enables soldering tasks of through-hole components without complex handling. Components can be placed automatically. Performs placement and soldering operations rapidly.

MTA Automation Inc., www.mtaautomation.com

RMA250 Solder Paste is a rosin-based chemistry designed to provide a high level of repeatability and consistency. Reportedly offers excellent open time, extended abandon time, and excellent soldering activity with all surface finishes. Is formulated for fast printing and meets requirements for ANSI/J-STD -004, -005, as well as all Bellcore test criteria. The pin probable paste features excellent print volume consistency with surface area ratios as low as 0.55 when used with UltraSlic stencil technology. Has a low voiding/high-reliability composition and a wide reflow window. Post-process residues are clear and can be removed with a saponifier.

FCT Assembly, www.fctassembly.com

High-density, 0.050" pitch through-hole and surface mount spring-loaded connectors come in single and double-row strip packaging. Spring pin components are plated with 20 µm hard gold and assembled in a high-temperature thermoplastic insulator suitable for wave and reflow soldering processes. Are RoHS-compliant.

Series 854-22-0XX-10-001101 and 855-22-0XX-10-001101 through-hole insulators feature molded standoffs. Tail diameters of 0.016" require minimal diameter plated holes for connector mounting. Surface mount spring connectors are low profile, standing less than 0.230" tall when engaged mid-stroke (0.0275").  Each SMT spring pin features a base geometry of 0.030" round by 0.010" tall.

Through-hole (Series 856-10-0XX-10-051000 and 857-10-0XX-10-051000) and surface mount (Series 856-10-0XX-30-051000 and 857-10-0XX-30-051000) 0.050" pitch target connectors provide a gold-plated, flat and conductive mating surface for the 854/855 series. Series 856/857 are precision-machined and assembled into thermoplastic insulators. Suitable for reflow soldering.

Mill-Max, www.mill-max.com

K4000 PCB singulator depanelizes skip-scored PCB panels up to 24" long. Operates via foot switch; right and left blade guards assure safety. Front and back support and take-up table are height adjustable. Optional light beam safety curtain across the front of the blades, as well as a conveyor belt. IR sensor at conveyor end stops belt for PCBs with components. Scrap pieces pass underneath the sensor beam into a discard bin. Tooling to help align panels also available.

FKN Systek, www.fknsystek.com

ScanWorks toolkit for embedded instruments validates connectivity of DDR3 memory chips with certain Intel processors. Verifies performance of the bus that connects DDR3 memory devices to Intel’s processors based on the micro-architecture codenamed Sandy Bridge. Employs Intel IBIST embedded instrumentation to drive data patterns onto the bus that connects the processor to DDR3 devices. These patterns form the basis for tests that verify the read/write capabilities of the memory bus. Operational parameters on the bus such as voltage and signal timing can be modulated.

Asset InterTech, www.asset-intertech.com

LED BIN validation and traceability software validates SMT line setup by tracking each reel to its feeder and specified feeder location on the machine; ensures each replacement reel contains LEDs with a correct and compatible brightness index number. Generates traceability reports based on the BIN of each LED reel used. Forces the machine to stop processing when a process validation error occurs. Reduces machine downtime during product changeovers and feeder replenishments. Each component reel load/unload event is logged in a central database. Component-level data can be linked with the actual product/PCB lot number, work order or serial number.

Cogiscan, www.cogiscan.com

ThermoScan test sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over ICs. Uses mechanical capability to automatically move IR temperature sensor over PCB to measure the powered PCB temperature pattern; bridges gaps between conventional test technologies. Can be used at every stage of the production process and for design verification; helps to optimize thermal distribution. Provides troubleshooting information for PCB repair. Measures and analyzes thermal behavior of single-sided and double-sided PCBs. Temperature range -18° to 220°C with a measurement accuracy of 3%. Sensor response time is 150 ms after 1 to 2 min. warm-up.

Acculogic Ltd., www.acculogic.com

Mighty Scope Pro Pack kit comes with two handheld digital microscopes and a polarizer attachment for electronics inspection, analysis and measurement. Includes Mighty Scope adjustable from 10x to 200x, Mighty Scope with 500x magnification; polarizer for contrast-enhancing use of the 10x-200x scope; two accessories for hands-free operation:  metal stand with adjustable working distances and cradle stand with two height adjusters for the 10x-200x model. Each of the two bodies has a 1.3 Mp camera with 1/3" color CMOS image sensor, a Microtouch shutter control and six adjustable white LEDs. Brightness control wheel for fingertip lighting adjustments; automatic white balance and gain control; video capture at up to 30 frames per sec.; ergonomic design.

Aven, www.aveninc.com

MSD 1200 Series desiccant cabinets include a modular enclosure offering access from two sides that can be expanded to meet production needs and a new dry unit with closed loop on-demand regeneration. Said to exceed IPC J-STS-033B.1 requirements for handling moisture-sensitive devices. U5001 "Dynamic Series" Zeolite dryers feature dehumidification, reportedly enabling a basic MSD1212 to take 240 sec. to move from 50% RH to less than 5% under unloaded conditions at 25°C. Optimal humidity levels are below 0.5% RH. Designed to regenerate only when necessary. If there are no door openings the dry unit will not regenerate and therefore consume less power. Integrated cabinet and dry unit design for quiet and maintenance-free operation. Average power consumption 30W per hour.

Totech Superdry, www.totech.eu.com

PS Series of automated handlers now support SOT-23 device packages. Also support PLCC, SOIC, SON, WSON, SSOP, CSP (BGA, microBGA and FPGA), QFP, TQFP, TSOP, PoP and more. Are for programming flash memory such as NOR, NAND, MCP, MMC, SD, MoviNAND, OneNAND, iNAND, microcontrollers and more.

Data I/O, www.dataio.com

VWWB-2A series of substrate handling wands includes the ESD-safe Push Button Wand Kit, for handling substrates such as individual photovoltaic cells during manufacturing. Push-button wand is lightweight and designed for connection to an in-house continuous vacuum system. Kit includes wand, vacuum hose, VBM-2 holder and substrate handling tip.

Virtual Industries, www.virtual-ii.com

REScan reverse engineering software aids the Flying Scorpion double-sided flying probe system. With XMatic CAD translation tool set, semiautomatic steps have been replaced with fully automated software processes. Speeds through field returns with no data available; aids in deciding if a board is repairable or needs replacement.

Acculogic Ltd., www.acculogic.com