Paraquda SMD pick-and-place machine uses new materials for high-speed control. Features short changeover times, an intuitive operation system (Eplace), and an integrated quality management system. Has 210 feeder capacity. Head can simultaneously hold and measure four components. Component range is 01005 up to 4" sq., up to 1" in height. Min. pitch is specified with 0.01". High-resolution fly-by vision system is equipped with latest Cognex SMD image processing technology.

Essemtec, www.essemtec.com

 

 

Offline teaching program II software has an XML data structure that enables a bidirectional data exchange; taking solder programs out of the offline teaching program and into the machine and vice versa is possible without further conversions. Differences between the original solder program and the program stored in the machine control system can be displayed automatically. Can process image data from cameras and scans. Automatically eliminates common picture distortions. Offers globally storing periodical process parameters for use with particular solder points or soldering passages when developing new solder programs. After teaching all solder points, the program computes the fastest way to minimize handling. This prospectively computed cycle time is displayed directly.

SEHO Systems GmbH, www.seho.de

No. 945 is an electrically heated 500°F universal oven used for various curing tasks. Workspace dimensions are 54" x 36" x 36".  6.6 KW are installed in Nichrome wire heating elements, while a 600 CFM, 1/2-HP recirculating blower provides horizontal front to rear airflow. Has 4" insulated walls, an aluminized steel exterior and Type 430 stainless steel interior. Equipped with an integral leg stand with casters and leveling pads. Controls include a digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blower airflow safety switch and SCR power controller.

The Grieve Corporation, www.grievecorp.com

NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.

FCT Assembly, www.fctassembly.com

NL930PT no-clean, Pb-free, halide-free pin probable solder paste has clear residues and is said to be consistently printable to low surface area ratios. Can be used with SN100C and SAC 305. Has good pin probability, print release to 0.55 SAR when used with Slic Stencil, and wets to all surface finishes, including OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a range of temperatures (65°-85°F) and relative humidity (25-65% RH). Stencil prints at up to 200 mm/sec.; voiding performance exceeds IPC Class III requirements. Features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.

FCT Assembly, www.fctassembly.com

mySelective 6745 selective soldering machine now features a new parallel processing design and dual-soldering nozzles said to nearly double throughput. Setup is quick using the Easyteach2 program.

XPM3 reflow oven now has an AUTOset fast setup feature capable of generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes an optimized profile from the preliminary recipe if needed. Reportedly, 85% of the time, modification of the auto-created profile is not necessary.

AUTOset controls ramp-up heating rate, thermal soak, time above liquidus, peak temperature, and total heating time.

Vitronics Soltec, www.vitronics-soltec.com

Spectrum S-920N Series now comes with dual simultaneous jet dispensing, which uses two DispenseJet valves to jet fluid, reportedly reducing dispense time by 50%. Is for CSP underfill and LED silicone encapsulation on multi-up panelized or patterned parts. Ensures flow rates for both DispenseJets deliver the same mass per part. Automatically compensates for fluid viscosity changes over time, as well as batch-to-batch variations to keep the process under machine control. Ensures consistent Takt times. Jets feature flexible spacing options.

Nordson Asymtek, www.nordsonasymtek.com

Arlink 8000 modular workstation system is ergonomically designed for assembly, service, repair, research and technical work. Can be assembled and reconfigured quickly. Can be configured in a variety of heights and lengths to best suit specific needs. Comes in five standard industry widths and in three different heights up to 84".  Has a starter and adder system, with the option of back-to-back configurations; enables unlimited layout possibilities. The definite positioning system makes relocating or adjusting work surfaces, storage, shelving, lights, power beams, footrests, etc. easy. Has a virtually tool-free assembly and reconfiguration process. Work surfaces are available in standard laminate or static dissipative. Is available on casters to create mobile workstations or parts carts.

Lista International Corp., www.listaintl.com

 

X2825 silica-filled board-level underfill encapsulant has a CTE of 26 ppm/°C. Is said to enhance drop and shock test reliability and provide thermal cycle performance. In one trial, thermal cycling of a BGA between -20° and +85°C, an unfilled version, with a CTE of 60 ppm/°C, resulted in first failure at 500 cycles; had no failures after 1500 cycles. Said to be reworkable at temperatures of 170° to 180°C.

Zymet, www.zymet.com

Flashstream 2800F-MK2 flash vector programming system is said to combine the largest memory capacity available with the latest 64-bit architecture. Has full data capacity support for devices larger than 4 GB. Has a 16 GB memory module; currently supports device data files up to 125.5 Gb with theoretical device size support up to 8 Eb.

BPM Microsystems, www.bpmicro.com

R6000 halogen-free printer ribbon is for circuit board ID. Comes with a variety of halogen-free polyimide labels. Is environmentally friendly. Reportedly has near identical performance characteristics as existing R6000 ribbons. Contains 45 halogen ppm – bromine and chlorine combined.

Brady Corporation, www.bradyid.com

Q Series 1500 mL cartridges have leak-free mixer connections and self-bleeding Quadro pistons. Are currently available in 1:1 ratio cartridges. Fit all common industry dispensers. Are pressure-tested for safe operation. Are available in polypropylene or Nylon and in 7/8-9 or 7/8-14 threads. Outlets available are side-by-side or cut-off tip.

Sulzer Mixpac USA Inc., www.sulzermixpacusa.com