Loctite PowerstrateXtreme Printable (PSX-P) is a print-friendly thermal management product. Thermal management materials can be deposited using traditional screen and stencil printing methodologies. Is offered in medium dry and extended dry versions. Paste format enables the material thickness to be adjusted as required. Is applied as a paste; once dry, it yields a phase-change pad. Delivers an abandon time of two hrs. minimum. Paste format is ideal for high-speed or high-mix environments. Adaptable to deviations in surface flatness, with the ability to fill any voids with varying thicknesses.

Henkel, www.henkel.com/electronics

The GoSelective light standalone will now be referred to as GoSelective; GoSelective light inline is now called the SelectiveLine to express inline capability and highlight the modular concept, which permits upgrade of a fluxer and preheat modules. Are for high product mix. Feature precise axis system for exact positioning of various workstations, and are capable of handling bare boards or assemblies in carriers up to 500 x 500 mm. Are Pb-free capable. Come with fiducial recognition for automatic PCB alignment, process visualization, and offline teach program. SelectiveLine is for inline operation and may be upgraded individually. Covers three basic modules: the SelectiveLine soldering module, separate fluxer, and preheater; can be arranged individually or as a complete production line. Modules are controlled through a central SPC control unit with a CAN bus system. Drop jet fluxer control monitors fluxer nozzle function and measures flux quantity of each drop.

Seho Systems GmbH, www.seho.de

Mydata Midas replacement nozzles reportedly are direct replacements for OEM nozzles. Are said to be compatible with TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). Tool range includes the following nozzle types for fine-pitch components: C14, A12, A13, A14S, B12, A23, A24, and C23. Special Midas nozzles include spring suspended tools (A23S, A24S, C23S), MELF tools (A34, B34, B24, B23, C24), flat pipe tools (blade), multi-port tools, ESD ceramic tools, micro thin tools and gripper tools. Cover QFPs to BGAs to 01005s.

Count On Tools Inc., www.cotinc.com

 

LFB-1000 flip-chip bonder handles large-scale ICs.  Capabilities include NCP, chip-on-chip and copper pillar processing.

Shinkawa, www.shinkawa.com

Siplace CA combines die placement from wafers with classic SMT placement technology. Reportedly eliminates special die bonding processes. Processes flip-chips from wafers at high speeds together with passive components from reels. Is based on Siplace X series, with additional wafer systems as feeders. Features include flip unit, special vision systems, and linear flux dip unit. Each Speedstar CP 20 head is able to place up to 9,000 flip-chips or 6,000 die-attach components per hr. in sizes ranging from 0.8 to 18.7 mm with an accuracy of ±10 µm. Can handle different wafers, which are replaced automatically. Punch-out speed is programmable. Requires only one pass through the oven.

Siemens, www.siplace.com

System 16.350, a derivative of 28.400, is a mid-volume wave solder machine. Is 167.5 cm long, and is dual wave, including a titanium, 350 mm wide automatic finger conveyor with built-in finger cleaner. Other features are convection pre-heat, an adjustable spray fluxer and touch-screen control. Requires less solder – 200 Kg – and comes with a low solder warning. Processing temperatures can be set to Pb-free or SnPb requirements to 300ºC.

Manncorp, www.manncorp.com

Mydata Hydra replacement nozzles and consumables are direct replacements for OEM nozzles. Tool range includes H01 (white), H02 (yellow), H03 (red), H04 (blue), H05 (brown), and H06 (green). Covers all components from ultra-small 0201 chips to midsize ICs, as well as QFPs and BGAs. Uses impact-resistant plastic. Available in standard packs of eight or individually. Each tool is marked with a colored imprint, including the nozzle type.

Count On Tools Inc., www.cotinc.com

KISS-Ware 2.0 software and programming tools imports PCB assembly data from a variety of sources; assists programmer in development of a soldering program to drive KISS selective soldering systems. Uses one or more inputs, including Gerber, DXF, digital or scanned board images, to generate PCB dimensions and display X/Y data points that will become the fluxing and soldering targets. Enables program editing on the PCB image. Automatically generates machine commands required for processing the job. GUI highlights path identifying everything that has been programmed. Can highlight desired items to be edited. Typical programming time reportedly 5 min. Other command features include editing on the actual assembly image, step-by-step prompts, and global edits.

ACE Production Technologies Inc., www.ace-protech.com

NB Series mobile powered workstations are ergonomic carts for computers, printers, scales, barcode scanners, and most other small electronics equipment. On-board battery powers up to four devices simultaneously for 8-10 hr. Adjustable shelves can hold up to 75 lbs. each. Can have real-time access to WMS, ERP, and automated data collection. Have slotted masts to adjust the height of each shelf. Are 42" high with a footprint of 24" x 26"; easily maneuvered on 5" casters (front fixed, rear locking swivel). Are available in five models with a range of rechargeable power packages from a 40 AH battery, 350W inverter, and 10 A charger up to a 200 AH battery, 1250W inverter, and 30 A charger. A non-powered model is available. Accessories include additional shelves (including a slide-out shelf), a laptop holder, an adjustable keyboard tray, a binder holder, an adjustable LCD support, a lockable drawer, a CPU holder, and a barcode scanner holder.

Newcastle Systems Inc., www.newcastlesys.com

IG series micrometer technology is for edge guiding of opaque, transparent or translucent materials, position control, outer diameter measurement, and gap control. The control system includes numerous built-in, application-specific operation modes, enabling most installations to be configured and operational within seconds. Has a small footprint. Optical axis alignment is quickly accomplished. Fast alignment and setup is simplified with the highly visible beam and an LED bar monitor position display built into the sensor head. Uses a high-precision L-CCD to determine the edge positions of any target placed within the sensor’s beam. Includes several error extraction algorithms and an I-DSP.

Keyence, www.keyence.com/PRIG

ProFlow ATx enclosed head printing technology can accommodate all solder pastes. Combines a low-volume print chamber with a paste loading mechanism. Actively conditions solder paste materials; delivers a paste roll for precise aperture filling. Has direct, automatic loading from packaging. Reportedly meets criteria of first pass yield of better than 98% and scrap of less than 0.5%. 

DEK, www.dek.com

Q Series 600 mL cartridges have leak-free mixer connections and standard side-by-side outlets. Are currently available in 600 mL, 1:1 ratio cartridges. Are easy to open and close; fit common industry dispensers; are pressure-tested and sturdy. Are available in polypropylene or nylon. Have an optional flow restrictor for low viscosity materials.

Sulzer Mixpac USA Inc., www.sulzermixpacusa.com