WTK-1 Terminal and Wire training kit includes three different gauges of wire and five styles of terminals. Comes standard with a terminal holder; reusable tool holds terminals during wiring and soldering operations. Terminals fit snug in holes of the TH1 when the holder is new. Holes are intentionally slightly undersized for expansion with use. Each kit comes individually packaged with all components bagged and tagged.

Practical Components, www.practicalcomponents.com

Sarcon 100GR-HL thermal interface material is an advanced gap filler pad manufactured with a hardened top surface. Consistently adheres to the target electrical component or opposing heat sink. Can remove without tearing or damaging the material during assembly and rework. Transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0 mm thick, flame retardant TIM comes in sheets up to 300 x 200 mm.

Fujipoly America Corp., www.fujipoly.com

XF-603 is a 0.0001" white polyimide, halogen-free label material designed to meet the VTM-0 level of flame retardants per UL94. Has significant self-extinguishing performance. When combined with a high-temperature resistant polyimide film, is said to prevent flame propagation. Is coated with a high-opacity gloss white topcoat designed for flexo-graphic and thermal transfer printing. When matched with proper inks or thermal ribbon, it reportedly withstands high temperatures, harsh chemicals and solvents. Complies with RoHS, REACH, and is certified to be halogen-free to IEC 61249-2-21.

Polyonics, www.polyonics.com

OE-8001 die attach adhesive is a one-part heat curable methyl silicone resin adhesive for LED manufacturing. Reportedly offers better adhesion strength than conventional silicone DA and better thermal stability than conventional epoxy DA. Is formulated for good pin transfer.

Dow Corning, www.dowcorning.com

LS60V-LED automated SMT pick-and-place machine handles longer LED panel lengths and LED package nozzle dimensions and material selection. Uses touchless centering system, providing placement rates of up to 4,800 cph. Handles panels up to 800 mm. Comes with an array of nozzles for common LED packages. Custom nozzles available. Is capable of placing 0201s, SOICs, 0.0015" pitch QFPs and CSPs, BGAs, and µBGAs. 

APS Novastar, www.apsgold.com

Trident eSPC software is available on all PC-equipped Trident defluxing systems. Permits scanning (or manually entering) individual assembly barcodes as they are loaded. All process parameters are stored and can be viewed either on-screen or via a wireless printer. All relevant process data are stored and associated with specific assembly serial numbers. Automatically captures assembly serial number; date/time of batch (start and completion); programmed wash solution temperature; actual wash solution temperature; maximum quantity of programmed rinse cycles; actual quantity of rinse cycles; programmed cleanliness value; actual cleanliness value; pass/fail cleanliness status; programmed drying time; actual drying time; programmed drying temperature; actual drying temperature; operator name; operator notes, and equipment notifications (if any). Advanced search capability for specific assemblies that have been cleaned and tested.

Aqueous Technologies Corp., www.aqueoustech.com

BlissLift (BL600) has a more robust column, larger lift platform and increased load capacity. Features the same adjustable width legs and push bar as standard BlissLift. Is capable of lifting more than 600 lbs at a 24" load center.  Lift platform can pick up 19" rackmount chassis. Works with standard Bliss Chassis Cart.

Bliss Industries, www.blissindustries.com

CHO-SEAL 6502 and 6503 EMI gasket materials were developed for high-performance in adverse environments common to aerospace, automotive and telecommunication applications. Are Ni-plated aluminum particle-filled silicone and fluorosilicone elastomers. Offer shielding after exposure to high and low humidity and temperature cycles, as well as salt/fog environments. Come in molded and extruded product forms, as well as a silicone, thermally cured, robotically dispensed and a form-in-place version: CHO-FORM 5560. Filler technology performs when used against aluminum flanges with either MIL-C-5541 trivalent or hexavalent, Class 1A or Class 3 chromate conversion treatment. NiAl particles reduce aluminum flange galvanic corrosion activity by factor of two.

Chomerics, www.chomerics.com

MicroLine 1000 S depaneler features a UV laser beam for cutting along components or circuit paths, reportedly without mechanical or thermal interference. Is toolless, allowing any contour. Is programmable via included software or via the CAD software. Compact footprint.

LPKF, www.lpkf.de

 

Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.

Heraeus, www.wc-heraeus.de

S2088BO-II automatic optical wirebond inspection desktop system is available. Was developed to inspect medium and small product runs, delivering defect detection on die, ball-wedge, wedge-wedge and security bonds. Reportedly guarantees reliable defect detection to cover typical bonds. During inspection, a high-res camera records all bond sites and wires. Inspects aluminum thick wire and aluminum, or gold thin wire connections, down to diameters of 17 μm. Inspection library includes inspection patterns for damaged and misplaced components. Is 100 % compatible with all Viscom inline systems; can be employed as a programming station.

Viscom, www.viscom.com

PV-7010 potting agent is a fast room temperature or heat cure, as well as a thick section cure. Requires no solvents or cure byproducts. Is a translucent, tough dielectric gel with minimal shrinkage for protecting electronic devices in solar applications. Is used for coating, encapsulating or potting; seals and protects in applications requiring stronger adhesion or improved dimensional stability. Has a working time of 10 min. Is a 1:1, two-part silicone potting material used for junction box components. Is available in cartridges, pails and drums.

Dow Corning Solar Solutions, www.dowcorning.com/solar
Krayden Inc., www.krayden.com