Multicore LF620 is a no-clean, halide-free, Pb-free solder paste that has a broad process window for printing, reflow and humidity resistance. Has a consistent print performance with minimal hot slump, even with temperatures of 86°F or more and relative humidity of 80%. Exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes, including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Has good printability at low or high speeds. Is well suited for the automotive sector.  Delivers a high tack force for component stability during high-speed placement, an abandon time of four hours and a print work-life of up to 24 hours.

Henkel, www.henkel.com/electronics

The IS-450 selective soldering machine automatically solders through-hole components onto mixed technology PCBs using an under-board mini-wave; solders connectors, capacitors and high-power devices onto boards at Pb-free process temperatures of 250º to 330ºC. Conducts dip-and-drag selective soldering for post-reflow, through-hole components and odd forms. Is powered by closed-loop servo motors for X, Y & Z axis motion that articulate the fluxer and mini-wave. Maintains adjustable clearance of as little as 1.5 mm. Reportedly solders from 3X to 8X more quickly, and with higher accuracy, than hand soldering. Is programmable off-line to govern wave temperature and height, travel speed and dwell time at each point.

Manncorp, www.manncorp.com

Vectra G Series includes two halogen-free liquid crystal polymer grades with processing characteristics that avoid issues commonly encountered when using flame-retardant, high temperature nylons to mold components. Vectra G131 and G331 are LCPs designed to help meet Pb-free soldering and halogen-free requirements. Vectra G131 is 35% glass-filled; Vectra G331 is 35% mineral- and glass-filled. Both are flame resistant without additives; V-0 to 0.15 mm; potential drop-in solutions for small FR, HT nylon parts. Said to achieve dimensional stability in thin-wall parts at more than 260°C. Processing advantages reportedly include fast molding cycle; no flash and mold deposit; Pb-free reflow capable; no moisture-related blister issues; longer tool life (noncorrosive in water-heated molds).

Ticona Engineering Polymers, www.ticona.com 

IPC-A-610E, Acceptability of Electronic Assemblies, provides visual acceptance criteria for post-assembly mechanical and soldering assembly requirements. Now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization and additional SMT terminations. Photos and drawings showing good and bad connections have been updated. Contains 165 new or updated illustrations (800 total). Sections have been reorganized so data and images are easier to find and use. Changes that have occurred in array packaging since the standard’s last revision are also addressed, as are changes to hot tear and filet lifting.

IPC, www.ipc.org

MD-F3000 fiber laser marker is for direct part marking. Delivers 30W of power directly on the target surface; dense, hard metals can be permanently marked and etched in milliseconds. Small head permits easy installation in tight spaces; has a fan-less design and is sealed from dirt and dust. Incorporates 3-axis beam control system that provides marking across a 300 x 300 mm area. Marking Builder-2 software has been upgraded with a new quality function that reduces setup time.

Keyence, www.keyence.com/PRMDF

Uni-Cyclone centrifugal mixer/defoamer is capable of programming duration, cycle profile and up to 1500 RPM centrifugal speed, as well as internal rotational speed. Can be used for solder paste, semiconductor materials, solar pastes, epoxies, and other materials. Mixing of materials and defoaming reportedly accomplished with cycle times half of conventional mixers. Can be controlled from a PC with complete traceability of every program.

Japan Unix, www.japanunix.co.jp/ju_en/index.html

No. 1012 electrically heated, 500ºF top-loading oven is for testing electronics equipment. Two zones, each 96" x 12" x 12", can be separated for use as independent ovens. 24 KW (12 KW per load) are installed in Incoloy-sheathed tubular heating elements. Two 1/3-HP recirculating blowers provide a total horizontal airflow of 1200 CFM to the workload. Features 4" insulated walls, aluminized steel interior and exterior, manually operated rear hinged door, reinforced flooring that can accommodate a load up to 500 lbs., and swivel casters with swivel lock and wheel brakes. Controls include digital indicating temperature controller, manual reset excess temperature controller with separate contactors, and recirculating blower airflow safety switch.

The Grieve Corporation, www.grievecorp.com

AOI software v.5 now includes 64-bit computing technology, standard 12 Gb of memory (expandable to 72 Gb), and integrated 3D Gerber translation; reportedly can generate production-ready 3D inspection program from stencil data within 5 min. Specifies stencil thicknesses and step stencil data in a wizard-driven environment. Inspection parameters are set automatically based on user input. Gencad and Gencam handling permit mapping individual components and lead numbers to Gerber data.

Machine Vision Products Inc., www.machinevisionproducts.com

 

Spectra is a large-board AOI built on the design of the Supra and Ultra series. Uses a tri-linear stage and comes in two formats. Is capable of inspecting boards up to 24" x 24". Spectra XL is capable of inspecting up to 24" x 36". 

Machine Vision Products Inc., www.machinevisionproducts.com

GenesisSC blends flip-chip assembly capabilities on a Genesis platform. Reportedly provides a complete solution for any production environment. Is tailored for dies and passives placement, including 300 mm wafers. Placement accuracy is said to be ±10 µm @ Cp>1. On-board linear thin film applicator provides dipping capabilities for paste or flux.

Universal Instruments Corp., www.uic.com

LK-G5000 laser displacement sensor comes with RS-CMOS sensor for a 392 kHz sampling rate said to be 8 times faster than previous models, ±0.02% full scale linearity and 0.01 µm repeatability. Is smaller than previous models. Active Balanced Laser Control Engine control is more powerful, and balances laser emission time, laser power, and gain. Dual-port data transfer, using a quad speed clock, enables pixel data to be transferred eight times faster than conventional models, thus simultaneously achieving high-speed and high-resolution. HDE (High Definition Ernostar) lens, together with twice the pixel resolution, results in highly-defined received light wave patterns. Three selectable built in algorithms improve the application solving potential. Perform calculations for up to 12 sensor heads for flatness, warpage and multi-point thickness. Measure speed and acceleration while measuring displacement.

Keyence Corp. of America, www.keyence.com/prlk5

The AIM print test board and kit includes new component technologies: 0.4 and 0.5 mm pitch FusionQuad components, DualRow MLF, 01005 and 0201 resistors, as well as others. Contains BGA and microBGA pads, both having circular and square pad designs to test paste release. Includes the standard IPC slump test pattern. A number on the board indicates the distances between pads. Common pad sizes are incorporated into the layout, including 1206, 0805, 0402, 01005 and 0201 rectangular pads for discrete components; have varying distances between them. Four pads are available for use with various aperture styles to permit wetting tests. Includes several fine-pitch QFP pads.

AIM, www.aimsolder.com