OE-8001 die attach adhesive is a one-part heat curable methyl silicone resin adhesive for LED manufacturing. Reportedly offers better adhesion strength than conventional silicone DA and better thermal stability than conventional epoxy DA. Is formulated for good pin transfer.

Dow Corning, www.dowcorning.com

LS60V-LED automated SMT pick-and-place machine handles longer LED panel lengths and LED package nozzle dimensions and material selection. Uses touchless centering system, providing placement rates of up to 4,800 cph. Handles panels up to 800 mm. Comes with an array of nozzles for common LED packages. Custom nozzles available. Is capable of placing 0201s, SOICs, 0.0015" pitch QFPs and CSPs, BGAs, and µBGAs. 

APS Novastar, www.apsgold.com

Trident eSPC software is available on all PC-equipped Trident defluxing systems. Permits scanning (or manually entering) individual assembly barcodes as they are loaded. All process parameters are stored and can be viewed either on-screen or via a wireless printer. All relevant process data are stored and associated with specific assembly serial numbers. Automatically captures assembly serial number; date/time of batch (start and completion); programmed wash solution temperature; actual wash solution temperature; maximum quantity of programmed rinse cycles; actual quantity of rinse cycles; programmed cleanliness value; actual cleanliness value; pass/fail cleanliness status; programmed drying time; actual drying time; programmed drying temperature; actual drying temperature; operator name; operator notes, and equipment notifications (if any). Advanced search capability for specific assemblies that have been cleaned and tested.

Aqueous Technologies Corp., www.aqueoustech.com

BlissLift (BL600) has a more robust column, larger lift platform and increased load capacity. Features the same adjustable width legs and push bar as standard BlissLift. Is capable of lifting more than 600 lbs at a 24" load center.  Lift platform can pick up 19" rackmount chassis. Works with standard Bliss Chassis Cart.

Bliss Industries, www.blissindustries.com

CHO-SEAL 6502 and 6503 EMI gasket materials were developed for high-performance in adverse environments common to aerospace, automotive and telecommunication applications. Are Ni-plated aluminum particle-filled silicone and fluorosilicone elastomers. Offer shielding after exposure to high and low humidity and temperature cycles, as well as salt/fog environments. Come in molded and extruded product forms, as well as a silicone, thermally cured, robotically dispensed and a form-in-place version: CHO-FORM 5560. Filler technology performs when used against aluminum flanges with either MIL-C-5541 trivalent or hexavalent, Class 1A or Class 3 chromate conversion treatment. NiAl particles reduce aluminum flange galvanic corrosion activity by factor of two.

Chomerics, www.chomerics.com

MicroLine 1000 S depaneler features a UV laser beam for cutting along components or circuit paths, reportedly without mechanical or thermal interference. Is toolless, allowing any contour. Is programmable via included software or via the CAD software. Compact footprint.

LPKF, www.lpkf.de

 

Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.

Heraeus, www.wc-heraeus.de

S2088BO-II automatic optical wirebond inspection desktop system is available. Was developed to inspect medium and small product runs, delivering defect detection on die, ball-wedge, wedge-wedge and security bonds. Reportedly guarantees reliable defect detection to cover typical bonds. During inspection, a high-res camera records all bond sites and wires. Inspects aluminum thick wire and aluminum, or gold thin wire connections, down to diameters of 17 μm. Inspection library includes inspection patterns for damaged and misplaced components. Is 100 % compatible with all Viscom inline systems; can be employed as a programming station.

Viscom, www.viscom.com

PV-7010 potting agent is a fast room temperature or heat cure, as well as a thick section cure. Requires no solvents or cure byproducts. Is a translucent, tough dielectric gel with minimal shrinkage for protecting electronic devices in solar applications. Is used for coating, encapsulating or potting; seals and protects in applications requiring stronger adhesion or improved dimensional stability. Has a working time of 10 min. Is a 1:1, two-part silicone potting material used for junction box components. Is available in cartridges, pails and drums.

Dow Corning Solar Solutions, www.dowcorning.com/solar
Krayden Inc., www.krayden.com 

Tridak Model 475 diaphragm valves are designed to be used with low-to-medium viscosity fluids. Internal design prevents fluid contact with actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings.  Minimal valve maintenance is required. Offer stroke adjustment. Are available in three configurations: Standard Model 475 features an UHMW polyethylene diaphragm, acetyl copolymer fluid body, and hard-coated aluminum air cylinder body; Model 475-T valve features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA valve incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body, and hard-coated aluminum air cylinder body.

Tridak, www.tridak.com

Trident OneShot automatic defluxing and cleanliness testing system is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. Includes a 16" touch-screen interface, shadow-reducing focus-wash technology, unlimited recipe quantities, Windows PC control platform, networking capabilities, and real-time cleanliness testing. Features optional barcode scanning and SQL database searches. Is capable of removing all flux/paste residues (rosin, no-clean, water-soluble) from any alloy, and is designed to use a selection of pre-dosed defluxing chemistries. Boards are cleaned, cleanliness tested, and dried in less than 30 min.

Aqueous Technologies Corp., www.aqueoustech.com

Reflow Oven Cleaner is a micro-emulsion for cleaning reflow ovens and wave solder machines. Is a non-flammable, low toxicity, odor solvent designed to remove all types of flux residues; can prevent buildup of condensed flux residues. Can be used at temperatures between 20° C and 50 °C, with an optimum working temperature of 40°C. Can switch the oven on immediately after use.  Contains inhibitors to prevent corrosion to ferrous and non-ferrous metals; is compatible with most plastics.

Electrolube, www.electrolube.com