BPWin version 5.10 features benefits for software support, such as email notifications, black box log visualization and label printing. An email notification feature for automated programming systems sends instant notifications of system events, plus a job summary report. Can set up email notifications to multiple users or a single user when a certain job event takes place. Black box log files can be viewed graphically with the log visualization feature. With color-coded data and letter-designated events, the log visualization feature can help determine what set of circumstances contributed to an unexpected event or other performance metric. Identifies and maintains programmed device traceability. Prints labels using dynamic data from the current job, such as device quantity, job master file name, job ID, device part number, data pattern information and system information. Interfaces with printer using Windows print driver and a text-based command language. Generates text, barcodes and RFID tags.

BPM Microsystems, www.bpmicro.com/bpwin-features.html

XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.

Vitronics Soltec, www.vitronics-soltec.com

Space-Saver BNC connector mounts on the edge of a PCB. Provides low profile for applications with tight vertical constraints. Reduces twisting stress on solder joints inherent in BNC connector mating. A notch in the connector slips over PCB edge prior to soldering, forming a tight mechanical fit that transfers majority of rotational energy to the PCB instead of solder joints. Center pin and connector body are soldered directly to a PCB, minimizing antenna effect caused by elevated mounting approaches and associated EMI/RFI problems at higher frequency ranges. Has a 75 ohm impedance and is tested to 2 Ghz.

Regal Electronics Inc., www.regalusa.com

The Fine Silver Conductor Trial Kit is capable of producing fine silver conductor traces down to 50 µm for high-density thick film circuits. Can experiment with fine polymer thick film circuits and functional printable and flexible electronics without screen printing equipment. Includes screen mask with standard fine patterns, a printing table, 50 g special silver ink, flexible substrates, squeegee, and other materials. Working table and thermal oven required.

DKN Research, www.dknresearch.com

NC265LR alcohol-based no-clean liquid flux is said to offer low residues and excellent wetting for Pbfree and SnPb wave soldering applications. Reportedly offers faster wetting for SN100C and SAC alloys and is compatible with a range of alloys. Reduces preventative maintenance requirements for spray fluxing applications. Has a 1-year shelf life when stored at room temperature and comes in a variety of packaging. Passes SIR per IPC-TM-650 method 2.6.3.7.

AIM, www.aimsolder.com

Fine Pitch Bump Adapters accommodate boards with pitches down to 0.40 mm. Permit use of higher pitch devices on smaller pitch boards. Adapter tops have landing pads that can be designed to accept any device on any pitch, and settle into fine pitch footprints, including TSSOP and QFP. Adapter bottom has raised connection pads up to 0.010" that provide easy mounting to the target board. Are 0.062" thick FR4 or Rogers 370 HR, with 1oz. copper traces on both sides. Non-solder mask-defined pads are finished with ENIG. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Are available in tape and reel for high-speed SMT assembly; can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" can be used. Are available in panelized form, as adapters only, or as turnkey solutions with devices mounted.

Aries Electronics Inc., www.arieselec.com

Keratherm U 90 silicone-free thermal interface material has a light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads; permits easy positioning between components and heat sinks. Is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin²/W. Is available in thicknesses of 0.125 mm, 0.225 mm and 0.325 mm. Keratherm U 80 provides 1.8 W/mK of thermal conductivity and 0.11 Kin²/W of thermal impedance; is 0.175 mm and 0.325 mm thick. Typical applications include medical devices, laser equipment, LED lighting, solar energy, disk drives and automotive electronics. Both are available on roll stock or custom shaped pads.

MH&W International Corp., www.mhw-thermal.com

No. 931 is an electrically heated, 1250°F high-temperature universal oven used for various heat treatments. Workspace dimensions measure 25" x 36" x 24". 18 kW are installed in Incoloy-sheathed tubular heating elements, while a 1000 CFM, 1-HP recirculating blower provides a universal front-to-rear airflow to the load. Features 10"-thick insulated walls, comprising 2" of 1900°F block and 8" of 10 lb/cf density rockwool insulation. Includes an aluminized steel exterior, Type 304 stainless steel interior, and a motor-operated vertical lift door controlled by a foot pedal. Includes digital indicating temperature controller, manual rest excess temperature controller with separate contactors, recirculating blower airflow safety switch, fused disconnect switch, and a 10' power cord.

The Grieve Corp., www.grievecorp.com

Q-BI58 is Pb-free solid wire for heat-sensitive assemblies. Is composed of 42% tin and 58% bismuth wire solder. Is a soldering alternative for heat-sensitive components that require a low melting point. Meets or exceeds J-STD-006 requirements and all other relevant standards. Sn42/Bi58 is sold per 500 g. box, and is available in a wide variety of diameters.

Qualitek International Inc., www.qualitek.com

Ablestik WBC-8901UV is for stacked die packages for the memory market, including TSOPs, MCPs and FMCs. Reportedly reduces total cost of ownership up to 50% compared to film. Can adjust die attach thickness based on specific manufacturing requirements; can select dicing tape of choice. Is applied via a spray coating method following wafer thinning process. Dicing tape is laminated to the wafer; backgrinding tape is removed, and the wafer is diced in preparation for die pickup and placement. Wafer coating of 10 µm, with a total thickness variation across the wafer of +/-10%, and material waste of less than 20% are possible.

Henkel, www.henkelna.com

Tridak Model 795 pneumatic dispensing spool valve dispenses high-viscosity fluids, gels, and pastes that require high pressure to achieve suitable material flow. Is for silicone gels, greases, adhesives and sealants. Adjustable flow control ensures accurate and repeatable fluid dispense cycles; adjustable suck-back feature provides clean fluid shutoff. Is designed to operate with fluid pressures up to 2,000 psi.

Tridak, www.tridak.com

Nerlite Hi-Brite machine vision lights include bright LED illumination over large areas. Permit intensity to be increased and focused to provide illumination to the part, even at a distance. Include versatile options, such as multiple sizes and color wavelengths, 10° spot and 50° flood lenses. Feature an integrated controller to quickly adjust light intensity from ultra bright to low light, and operate in continuous or strobe mode; standard industrial M12 connectors, and an industrial IP67 rating for protection against dust, fibers and immersion in liquid. Up to four lights can be connected on one power supply. 24V power standard matches most industrial factory settings.

Microscan, www.microscan.com