The 2 mm x 8 mm dual-track X-feeder is now 01005-capable. Two differently positioned slots permit selection of the ideal tape track for regular or highly adhesive tapes. Said to minimize component losses during setups or as result of pickup errors. Novel software transmits pitch automatically to both feeder tracks; the force required to remove the cover foil can be set accurately. Splice sensors optional. Includes LED displays and control elements.

Siemens Siplace, www.siplace.com

JX-100LED, for LED assembly, supports boards up to 31.5" x 14" when indexed twice in the machine. Features new algorithms for placement of side-view-type LEDs, top-view LEDs, rectangular ferrite chip-type and PLCC-type LEDs. Uses the same high-res. optical vision centering placement technology found throughout Juki’s product line. Components are rotated 360° in the laser. Supports automatic tool changer. Places a reported 15,300 cph at IPC-9850; handles parts from 01005 to 33.5 mm². Features optional tri-colored vision centering system for placing fine-pitch QFPs, BGAs and QFNs.

Juki Corp., www.jukiamericas.com

Slot-Lok circuit board shields offer a flexible shielding option. The two-piece design uses standardized production methods to create a near-custom solution. Virtually any shape, size or configuration of shield is possible – from through-hole or surface mount installations to automated pick-and-place or hand assembly operations. Manufactured with RoHS-compliant materials.

Leader Tech, www.leadertechinc.com

Fine-Pitch SMT Kit now comes in both Pb-free and SnPb versions. Pb-free component option comes with ENIG finish. Used to determine overall production or machine process capability of fine-pitch components. Custom component list optional.

STI Electronics Inc., www.stielectronicsinc.com

Replacement ZFF 250 Pre-Filters are low efficiency particle filters used to protect components within the SMT pick-and-place system from dust and other large, coarse debris. With the specially designed polymedia filter material along with iFuse coating, extend the life of SMT equipment by offering increased performance and protection against dust and debris. Fit the full range of Mydata pick-and-place systems.

Count On Tools, www.cotinc.com

SCS Ionograph ionic contamination tester now features an all-in-one onboard computer for control and monitoring. PowerView software displays the percent of alcohol present in solution, and provides mL of alcohol or water needed to achieve 75% IPA. Filters test data by profile, part number, lot number, pass/fail, and/or test date range. Displays results in a graphical summary. Can zoom in/out to view specific aspects, save in various formats, print, and use data. Uses ‘dynamic’ testing method to determine cleanliness of electronic components, assemblies with SMT devices, and bare and assembled PCBs.

Specialty Coating Systems, www.scscoatings.com

EBM soldering iron tips are available in two series. One series is compatible with Hakko’s 900M series of soldering equipment; the other uses Curie Heat Technology. Are 100% tested and offer easy temperature identification. Reportedly have better contact points and tip plating that’s conducive to longer life.

Easy Braid Co., www.easybraidco.com

Correct-A-Chip series Fine Pitch Bump Adapters accommodate pitches down to 0.40 mm. Can use higher pitch devices on smaller pitch boards. Tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.40 mm. Bottom has raised connection pads up to 0.010". Integrate higher pitch BGA devices with boards laid out with smaller pitches. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Come in tape and reel. Standard line and trace spacing down to 0.003" can be used. Available in panelized form, adapter only, or with devices mounted.

Aries, www.arieselec.com

Paradigm v.3.7 with a system alerts module is an ERP solution that now includes a plan by MRP function; generates and automates an action list of the required transactions that result after running MRP. Includes a non-nettable raw material processing feature; categorizes raw materials suspected of being defective, so as to not be used in MRP reporting. Various usability and user interface enhancements were also incorporated. The SAM module delivers real-time notifications via mobile device or PC; includes more than 50 alerts regarding sales, production, quality, materials, finance and maintenance; is compatible with Paradigm v.3.4 and higher.

Consona Corp., www.consona.com

Tacki ESD Pak comes in a 2" x 2" box with the tacky surface on the inside. Stores small components such as SMT discretes or ICs. Tacki Pads are 4" x 4" and 9" x 9" trays with a tacky surface for storing multiple types of components on the lab bench. Can take parts from both using tweezers without jarring components out of enclosures. Provide non-adhesive tacky surface that limits component movement. Are reusable. ESD-safe properties are 105 to 109 ohms. Tack level is 6 to 9 ft. lbs. of force.

SchmartBoard, www.schmartboard.com

PACTECH PCB310 is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10 mm flip chips; is companion to PACTECH dummy flip chips. Test die are combined with test boards for testing a variety of specs and processes. There are two rows of seven pads. Depending on die, they have either 184 bumps and a bump pitch of 200 µm or 572 bumps and a pitch of 200 µm/400 µm. Evaluation board is 6.3" x 3.95"; has two layers and is 0.062" thick. Board material is high temp Tg. Standard board finish is OSP Entek CU-A-HT.

Practical Components Inc., www.practicalcomponents.com

The Mixed Technology Training Kit is now available in both Pb-free and SnPb versions. Offers a mixture of through-hole and SMT. Contains common components found in mature technology applications. Parts are packaged in static shield bags.

STI Electronics Inc., www.stielectronicsinc.com