KFS-VAF volumetric atomized flux applicator is for selective soldering. Controls and dispenses atomized flux material on demand via a user-programmable control system. Does not require any mechanical adjustments. Spray volume and width is set by user-programmed control parameters; varying amounts of coverage can be accomplished as needed on the same printed circuit board. Can be used with all known fluxes, even up to 33% solids. Can be integrated with the KFSDJ drop jet fluxer.

ACE Production Technologies Inc., www.ace-protech.com

SolderStar Pro - VP is for vapor phase reflow profiling. Permits measurement in both standard vapor phase chambers and vacuum applications. Has an ultra-low mass data logger and thermal shield combination. Has minimal influence on the process measurement.

SolderStar Ltd., www.solderstar.eu

SpotCheck handheld counter provides fast estimates of parts quantities without removing tape from the pick-and-place feeders. No time is lost threading leader tape and loading the reel. Is self-contained and requires no attachments. Produces SMD tallies in less than 60 sec. without interrupting production. Has pre-kitting functionality. Accuracy range is ±5%.

Manncorp, www.manncorp.com

SE500-D dual lane SPI system is designed with large board handling capability. Has a flexible conveyor configuration; permits different products with varying board widths to be run on the same line. Supports asynchronous inspection on separate lanes. Has calibration-free sensing; inspects assemblies at 80 cm²/sec. speeds or greater.

CyberOptics Corp., www.cyberoptics.com

Hysol PC40-UMF is a solvent-free conformal coating material. Is a stable one-part material with a shelf life of six months. Is UV curable in 30 sec. with a built-in secondary moisture cure mechanism. Offers superior wetting and wicking performance; its rheology has been optimized for the latest dispensing technologies. Dispense capability enables material to be more easily applied on selected areas.  Has excellent fluorescence under black light.

Henkel, www.henkel.com/electronics 

FX-3R high-speed modular mounter has higher production capacity than FX-3: 90,000 CPH (0.040 sec./chip under optimal conditions). Is equipped with linear servomotors in the X and Y axes to drive the heads. The weight of the head has been reduced; the head design has a more rigid structure. Supports large boards up to 610 mm x 560 mm (XL board specification) as a standard feature; offers an optional feature to produce a long board up to 800 mm wide, mainly used for LED lighting. Includes hybrid tape feeder feature; accepts both electric and mechanical tape feeders in one machine.

Juki, www.jukiamericas.com

Zebra 2005 Elastomeric Connector is for smaller consumer electronic products and commercial instrumentation. Can be ordered in application-specific widths ranging from 0.015" to 0.118". The layered carbon-filled and non-conductive silicone construction incorporates 500 conductors per in. to accommodate applications with LCD contact spacing of 0.006". Offers a current carrying capacity of 50 mA per 0.040" x 0.040" pad. Can be ordered with solid or sponge edge supports. Has low compression force material. 

Fujipoly America Corp., www.fujipoly.com

MAX series dispensing systems are configured with PCD volumetric dispense technology and a Micro-Dot pump. Are ideal for silver-filled conductive and nonconductive epoxies, solder pastes, adhesives, encapsulants and other fluids used in electronics assembly. Compatible with all GPD’s dispensing pumps, including the Micro-Dot for dispensing below 0.010". Are designed with a 100% molded, unibody frame. Have Contour Mapping software; provide ±0.001" accuracy over the entire work area. Handle up to two different dispense pumps simultaneously. Can be configured with heat for applications such as underfill, encapsulation, or others that may benefit from a heated product.

GPD Global, www.gpd-global.com

Smart GUI software for Siplace placement machines features a new graphical user interface. Displays essential data about the machine's status, current jobs and their progress. If the software detects problems on the line, it converts instantly into an analysis and instruction tool. Categorizes the malfunction and indicates the exact location (machine and track). Initiates self-healing procedures or starts a video assistant to display the steps needed to fix problems. Graphics provide a troubleshooting process step by step. Line personnel reportedly can fix more than 90% of incidents without a special technician.

ASM Assembly Systems, www.siplace.com

Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics

Cobra pick-and-place machine is a three-step SMEMA inline system, with an octagonal placement head, up to two dispensing valves, customizable machine finishing, up to 240 feeder slots, a mineral cast chassis, and ePlace software. Motion system is constructed as a real-time system that reduces the number of cables in the machine. Mounts device packages from 01005s, QFPs, complex BGAs, QFNs, CSPs, bare dies, and connectors to odd shapes up to 10 x 150 mm.

Essemtec, www.essemtec.com

SRT Micra benchtop rework platform is designed for rework of small, high-density electronic devices. SierraMate V9 software simplifies process definition; reportedly ensures consistent, repeatable results between facilities. Offers Auto-Run feature, an automated process setup tool, and virtual process engineer; minimizes rework setup and profiling times. Can accommodate 01005 passives and 0.3 mm pitch area array devices. Removes residual solder. |

VJ Electronix, www.vjelectronix.com