Tacki ESD Pak comes in a 2" x 2" box with the tacky surface on the inside. Stores small components such as SMT discretes or ICs. Tacki Pads are 4" x 4" and 9" x 9" trays with a tacky surface for storing multiple types of components on the lab bench. Can take parts from both using tweezers without jarring components out of enclosures. Provide non-adhesive tacky surface that limits component movement. Are reusable. ESD-safe properties are 105 to 109 ohms. Tack level is 6 to 9 ft. lbs. of force.

SchmartBoard, www.schmartboard.com

PACTECH PCB310 is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10 mm flip chips; is companion to PACTECH dummy flip chips. Test die are combined with test boards for testing a variety of specs and processes. There are two rows of seven pads. Depending on die, they have either 184 bumps and a bump pitch of 200 µm or 572 bumps and a pitch of 200 µm/400 µm. Evaluation board is 6.3" x 3.95"; has two layers and is 0.062" thick. Board material is high temp Tg. Standard board finish is OSP Entek CU-A-HT.

Practical Components Inc., www.practicalcomponents.com

The Mixed Technology Training Kit is now available in both Pb-free and SnPb versions. Offers a mixture of through-hole and SMT. Contains common components found in mature technology applications. Parts are packaged in static shield bags.

STI Electronics Inc., www.stielectronicsinc.com

PCB123 v4 advanced software design tool has an intuitive CAD interface for freedom and flexibility in schematic and layout editing. Features 500,000 new parts, improved search functionality with complete access to parts libraries, automated BoM, data importer that imports DXF files from mechanical CAD tools. Integrates DRC/DfM rules into the software. Offers research, availability and pricing for each component registered in the Digi-Key database. Is free and requires no license.

Sunstone Circuits, www.sunstone.com

3800 Die Bonder has 3.5 µm accuracy, 3 sigma and 2600 UPH over a 35.5" x 20" work envelope. Has quiet linear motors and is fully automated. Is suited for HB/HP LED assembly; microwave modules; RF power amps; complex hybrids; MEMS; laser diodes, and LED printhead attachment. Options include pulse heat and steady state stages for eutectic die attach applications. Comes with a process camera for live viewing of pick-and-place processes. Eight-position tool turret enables rapid tool changes. Has removable side panels with a front facing user interface.

Palomar Technologies, www.palomartechnologies.com

Kimtech Pure M3 sterile pouch facemask is for contamination control in sterile environments. Is recommended for use in ISO Class 5 or higher cleanrooms. Pouch design and large breathing chamber reduce the chance for particle buildup. Tight seal reduces goggle fogging and the risk of escaping particles. Two knitted headbands help hold the mask in place. Has fabric inner facing. Is made of apertured, low-lint polyethylene film; contains no natural rubber latex.

Kimberly-Clark, www.kimtech.com

BR 300 soldering robot is based on four numerical axes for the automation of bottom-side selective point-to-point or linear iron soldering operations. Enables soldering tasks of through-hole components without complex handling. Components can be placed automatically. Performs placement and soldering operations rapidly.

MTA Automation Inc., www.mtaautomation.com

RMA250 Solder Paste is a rosin-based chemistry designed to provide a high level of repeatability and consistency. Reportedly offers excellent open time, extended abandon time, and excellent soldering activity with all surface finishes. Is formulated for fast printing and meets requirements for ANSI/J-STD -004, -005, as well as all Bellcore test criteria. The pin probable paste features excellent print volume consistency with surface area ratios as low as 0.55 when used with UltraSlic stencil technology. Has a low voiding/high-reliability composition and a wide reflow window. Post-process residues are clear and can be removed with a saponifier.

FCT Assembly, www.fctassembly.com

High-density, 0.050" pitch through-hole and surface mount spring-loaded connectors come in single and double-row strip packaging. Spring pin components are plated with 20 µm hard gold and assembled in a high-temperature thermoplastic insulator suitable for wave and reflow soldering processes. Are RoHS-compliant.

Series 854-22-0XX-10-001101 and 855-22-0XX-10-001101 through-hole insulators feature molded standoffs. Tail diameters of 0.016" require minimal diameter plated holes for connector mounting. Surface mount spring connectors are low profile, standing less than 0.230" tall when engaged mid-stroke (0.0275").  Each SMT spring pin features a base geometry of 0.030" round by 0.010" tall.

Through-hole (Series 856-10-0XX-10-051000 and 857-10-0XX-10-051000) and surface mount (Series 856-10-0XX-30-051000 and 857-10-0XX-30-051000) 0.050" pitch target connectors provide a gold-plated, flat and conductive mating surface for the 854/855 series. Series 856/857 are precision-machined and assembled into thermoplastic insulators. Suitable for reflow soldering.

Mill-Max, www.mill-max.com

K4000 PCB singulator depanelizes skip-scored PCB panels up to 24" long. Operates via foot switch; right and left blade guards assure safety. Front and back support and take-up table are height adjustable. Optional light beam safety curtain across the front of the blades, as well as a conveyor belt. IR sensor at conveyor end stops belt for PCBs with components. Scrap pieces pass underneath the sensor beam into a discard bin. Tooling to help align panels also available.

FKN Systek, www.fknsystek.com

ScanWorks toolkit for embedded instruments validates connectivity of DDR3 memory chips with certain Intel processors. Verifies performance of the bus that connects DDR3 memory devices to Intel’s processors based on the micro-architecture codenamed Sandy Bridge. Employs Intel IBIST embedded instrumentation to drive data patterns onto the bus that connects the processor to DDR3 devices. These patterns form the basis for tests that verify the read/write capabilities of the memory bus. Operational parameters on the bus such as voltage and signal timing can be modulated.

Asset InterTech, www.asset-intertech.com

LED BIN validation and traceability software validates SMT line setup by tracking each reel to its feeder and specified feeder location on the machine; ensures each replacement reel contains LEDs with a correct and compatible brightness index number. Generates traceability reports based on the BIN of each LED reel used. Forces the machine to stop processing when a process validation error occurs. Reduces machine downtime during product changeovers and feeder replenishments. Each component reel load/unload event is logged in a central database. Component-level data can be linked with the actual product/PCB lot number, work order or serial number.

Cogiscan, www.cogiscan.com