Reflow Oven Cleaner is a formulated micro-emulsion for cleaning reflow ovens and wave solder machines. Is a nonflammable, low toxicity and odor solvent for removing all types of flux residues. Is said to prevent buildup of condensed flux residues. Can be used at temperatures of 20°-50°C, with an optimum working temperature of 40°C. Contains inhibitors to prevent corrosion to both ferrous and non-ferrous metals and is compatible with most plastics. Also suitable for many general degreasing applications.

Electrolube, www.electrolube.us.com

TimingDesigner 9.25 has enhanced Automerge functionality said to dramatically speed interface timing analysis. Permits use of reusable, model-based approach to timing analysis. Connects component timing models to create parameterized interface diagrams that can be used to validate timing and interactively test design alternatives. Interface models can be created early in the design phase to help drive constraint definition and timing budgeting. Propagation delay and signal integrity effects can be added for a more accurate representation of timing margins. Optional TimingDesigner Design Kit Library, for automated analysis process. Also updates Allegro PCB SI flow and features new design validation commands to identify critical margins, ensure proper analysis, and determine timing closure.

EMA Design Automation, www.timingdesigner.com/whatsnew

McDry Signal Tower with ERC-301AD hygrometer with an alarm system and a wireless temperature/humidity data logger are for McDry electronics drying storage cases. A light signal flashes and an audible alarm sounds when humidity level goes over the set limit for a fixed period of time. After the alarm flashes, the unit saves 10 data readings: one per hr.  The data logger permits viewing and tracking of temperature and RH levels within the cabinet to ensure safe storage of moisture-sensitive components and materials. Export data to Excel. No nitrogen needed; humidity is removed by use of a zeolite desiccant, which is recycled automatically and does not require replacement.

Seika Machinery Inc., www.seikausa.com

Dual-Cure 9481 reportedly cures in seconds upon exposure to UV/visible light and has a high-cured durometer. Is low viscosity. For spray application through manual or automated dispensing. Flow characteristics for fast coverage without migration to areas where protection is not needed. Adheres to PCB surfaces. Cured coating forms a transparent layer that protects from moisture, dust and other contaminants.  Cure cycles are typically fewer than five sec. Meets MIL-I-46058C and IPC-CC-830B. 

Dymax Corp., www.dymax.com

SOL9400 Series front-side silver pastes are for crystalline photovoltaic cells. Are improvements over SOL9235H; have higher efficiency and faster throughput.

Heraeus, www.heraeus.com

The 8th Generation model 2800 manual universal programming system combines the speed of Vector Engine Co-Processor technology with universal device support. Supports microcontrollers, NAND flash, NOR flash, serial flash, managed NAND flash, E/EPROM, flash EPROM and other technologies with densities up to an 8 Eb theoretical limit. Supports devices with voltage down to 0.7 (Vdd). Accelerates waveforms during the programming cycle. Has the capability to program with one, two, three or four socket cards. Offers a single socket card purchase for first article qualification.

BPM Microsystems, www.bpmmicro.com

Tridak Model 475 Series diaphragm valves are designed to be used with low-to-medium viscosity fluids. Prevent fluid contact with the actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings. Offer stroke adjustment to precisely dial-in desired shot volume. Available in three configurations: Standard Model 475 dispensing valve features an UHMW polyethylene diaphragm, acetyl copolymer fluid body and hard-coated aluminum air cylinder body; Model 475-T features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body and hard-coated aluminum air cylinder body.

Tridak, www.tridak.com

The Razor Beam 0.0315" (0.8 mm) pitch high-speed/high-density strip comes in right angle and vertical orientations for parallel, perpendicular, and coplanar applications. Is designed to save PCB real estate on X, Y, and Z axes. Contacts are reportedly ideal for rugged applications with undercut retention notches that increase withdrawal force and produce an audible click when the contacts engage. Have 20 to 50 contacts per row and a choice of lead styles. Available in heights from 6 mm to 12 mm. Is RoHS-compliant and Pb-free solderable.

Samtec, www.samtec.com

The Worldwide IC Packaging Market, 2010 Edition offers an in-depth look at the worldwide integrated circuit packaging market. Provides forecasts of individual IC device markets, for units, revenue and ASP from 2008 through 2014. Forecasts package solutions for each of these markets, broken into I/O ranges. An overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions, is also provided.

Major package families include:

• Dual in-line package (DIP)

• Small outline transistor (SOT)

• Small outline (SO)

• Thin small outline package (TSOP)

• Dual flat pack no lead (DFN)

• Chip carrier (CC)

• Quad flat pack (QFP)

• Quad flat pack no lead (QFN)

• Pin grid array (PGA)

• Ball grid array (BGA)

• Fine-pitched ball grid array (FBGA)

• Wafer-level package (WLP)

Unit forecasts for die mounted using direct chip attach methods are offered. CA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

Supplies contract IC packaging market forecast, with units and revenue analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is commentary on the state of the industry.

New Venture Research, www.newventureresearch.com

MX500 fully-modularized AOI, for inspecting solder and lead defects, presence and position, correct part, and polarity for inspection down to 01005 components, is scalable and flexible. Uses a multi-lane approach, featuring a horizontal-stackable conveyor system with a primary master inspection lane that can be coupled with additional lanes to support dual-lane, triple-lane and full-fledged quad-lane configurations. Includes novel inspection sensors for speed and flexibility.

CyberOptics, www.cyberoptics.com

Cone-shaped XS filters are for Panasonic CM402 and CM602 nozzles. Come in packs of 100 and are designed for 100-series, 100S-series, 200-series, 200S-series, 400-series and 1000-series nozzles. Are compatible with Panasonic replacement nozzles for high-speed (8- and 12-nozzle, Type A-0 and A-2) and multifunctional (Type B) placement heads. Function properly with the following Panasonic/KME pick-and-place machines: CM20F, CM301-D, CM301-DU, CM301-DS, DT401, DT401-M, DT401-F, DT400-M, CM401-M, CM401-L, CM402-M, CM402-L, CM400-M, CM212-M, CM232, CM201-D, CM202-D, CM201-DU, CM202-DU, CM201-DH, CM202-DH, CM202-DHU, CM201-DS, CM202-DS, CM202-DK and CM602-L.

Count On Tools Inc., www.cotinc.com

Redesigned Siemens ceramic replacement nozzles offer placement down to 01005 components. Are compatible with Siplace, CS, CF, D1, D2, D3, D4 F5, HM, HS-60, HF, S-27, HM, X2, X3, X4, X4i and SX. Have special vacuum geometry and are ESD-safe. Bodies machined from high-strength plastic. Reportedly will not crack or break under normal working conditions. Come individually or in six-packs in 901, 902, 904, 906 and 925 versions.

Count On Tools Inc., www.cotinc.com