RPS Vision Correct fully integrated fiducial inspection and auto correction software is for selective soldering systems. Uses stored images to validate known fiducial points and other indicators.  Identifies position errors of detected fiducials and uses correction algorithms to adjust the soldering program by the X and Y axes deltas. Features include high-def video camera and white LED ring light; precision position correction ±0.005"; sensitivity control for image recognition and search regions, and integration with CamConductor programming software.

RPS Automation LLC, www.rpsautomation.com

Linechart performance-monitoring, multi-vendor software module is said to raise utilization rates to more than 90%. Provides visibility into all production lines and identifies factory inefficiencies. Provides graphical feedback for several pick-and-place equipment performance indicators. Identifies deficiency when productivity falls below acceptable levels. Displays data down to the feeder and nozzle level. Tracks productivity, efficiency, component waste, components-per-hour, and board counts. Each is graphically displayed as a line, bar, or Pareto chart, and can be refined to group the data by day, week, month, machine, product, head, nozzle, and feeder.

Universal Instruments Corp., www.uic.com

Leica DVM5000, DVM3000 and DVM2000 digital microscopes display images directly on a high-resolution monitor. Streamlined zoom optics reach difficult-to-access surfaces for nondestructive inspection of large stationary parts. Feature high-quality optics; offer a wide variety of quantitative analysis options, including 2D analysis or 3D surface measurements.

DVM5000 is designed to be brought to the sample. Can convert into a compact, portable system with a few adjustments.

DVM3000 includes zoom optics with encoded magnifications, a high-performance digital camera, integrated metal halide lamp, and standard interfaces for computer and monitor to enable all sample-related data to be sent to the computer for subsequent evaluation.

DVM2000 entry-level microscope is comprised of zoom optics, digital camera, and software, and is based on standard components. Provides a comprehensive range of products and accessories to configure the ideal digital solution for individual needs.

All are equipped with a 2.11 Mp digital camera.

Leica Microsystems, www.leica-microsystems.com

MYPlan v. 4.1 includes a Job Sequence Optimizer. Calculates the best production sequence and changeover strategy for any mix of products and batch sizes. Eliminates unnecessary feeder movements. Automatically calculates an optimized job sequence, using an optimization algorithm that takes both machine speed and feeder loading effort into account. Suitable jobs run together based on part commonality; are placed in family kits. Other jobs will be run separately, with different changeover strategies depending on batch size and priority, including prototypes, large batches, and variants. Is fully integrated with the material handling system MYLabel and the automated storage solution SMD Tower. Provides full visibility of material status and availability.

Mydata Automation, www.mydata.com

 

TR7007 3D SPI has a reported throughput of 171cm²/sec. at 14 µm resolution and 87cm²/sec. at 10 µm. Implements a fringe pattern technology and a dual lighting system that eliminates shadows and provides defect detection. Uses a linear motor.

Test Research Inc., www.tri.com.tw

IPC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling; now provides additional codes for more precise specification of certain Pb-free solders.  Provides guidance on marking and labeling of components and PCBs using a range of solder alloys. Enables clear identification of assemblies with lead or Pb-free solder; components that have lead or Pb-free second-level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes, and conformal coatings. Prescribes maximum component temperature for assembly and rework.

IPC, www.IPC.org

A-Series pick-and-place machine reportedly now places ICs at the same speed and accuracy as chip components using the Twin Placement Robot. TPR eliminates need for extra line balancers; is ideal for DRAM placement. Reportedly places up to 111,000 cph, at accuracy of up to 35 µm. Picks components from front side tape and tray feeder. Has below 10 defects per million.

Assembléon, www.assembleon.com

Solder Plus UV is a UV-fluorescent solder paste that enables pre- and post-reflow detection of solder deposits on automated production lines. UV light source excites the paste, causing it to emit a fluorescence detectable with conventional vision systems.

Nordson EFD, www.efd-inc.com

SimuTech technology on the TD2929 is a twin track system with dual overhead gantries. Permits print, 2-D inspection, bottom-side stencil cleaning and dot dispensing simultaneously on two PCBs. Features include a dual digital servo positioning loop, vibration printing and ultrasonic cleaning. Provides high-density bottom-side contour tooling support.

P3 combines the Touch Print Digital TD2929 and the Mx400LP pick-and-place system with tray and max feeders. A dual-lane conveyor enables two PCBs to work simultaneously. Can reach placement speed of 31,000 CPH.

Milara Inc., www.milarasmt.com

XPii-II pick-and-place machine incorporates technology from the iineo platform. Benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. Features two placement heads and uses turret head, intelligent feeders and powerful software. Comes with choice of turret heads and incorporates optical sensors that can detect components as small as 01005 and as large as 50 x 50 mm from picking to placement on-the-fly. Will accommodate components supplied on tape, strip tape, stick and matrix trays. Uses integrated intelligence. Is configurable, permitting two versions: 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Has no restrictions or limitations on component range.

Europlacer, www.europlacer.com

Sentinel print verification and process management technology captures the full board image, analyzes the data and accepts or rejects the print in real time. Reportedly manages printing inputs and outputs, and integrates verification and traceability tools. Permits printing and high-speed inspection to run concurrently. Offers high-speed paste on pad, bridge detection and alignment capabilities, with vision coverage operating at 36,000 mm2 per sec. Closed-loop control manages alignment, automatic understencil cleaning operations and paste dispensing. Rejects bad boards automatically without interrupting production.  Managed through touch-screen control of Instinctiv V9 software.

DEK International, www.dek.com

SE350 3-D solder paste inspection system has calibration-free sensor technology. Zero machine-to-machine variation across the production lines. Leverages technology of SE500; is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm). 

Cyberoptics Corp., www.cyberoptics.com