F08 Poly-form flexible preform adhesive meets IEC 61249-2-21. Supports efforts to reduce chlorine and bromine levels in component assemblies. Halogen-free adhesives are designed for bonding metals, plastics and glass. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is consistent. Facilitates manual and automated handling. Can be pre-shaped in multiform configurations to accommodate a broad range of applications.

Multi-Seal, www.multi-seals.com

StikNPeel single-use flexible rework stencil is adhesive-backed. Tacky adhesive makes sure the stencil stays coplanar to the board during paste printing; solder does not smear underneath the stencil. Can be placed in crowded areas of the PCB without relying on tape down or fixturing methods. Made from Mylar and available in 0.004", 0.005" and 0.006" thicknesses. QFPs and other devices and areas down to 0.5 mm pitch can be fabricated. Each stencil is cut to order from customer datasheets, Gerbers or dxf/dwg files. Max. stencil size is 4" x 4". Twenty pieces per package.

BEST, www.solder.net 

MXG-2500REZ lens has a wide zoom range and triple objective turret. Provides macro to micro views. Lens parfocality permits sustained focus from 35x to 2500x. Turning the turret permits access to each objective lens and an optical zoom range of more than 70x the min. magnification. Features integrated auto calibration select that recognizes the objective lens’ positioning and zoom level. Calibration information displayed and stored. Includes dual illumination mechanism that provides co-axial and ring lighting.

Hirox, www.hirox-usa.com
Seika USA, www.seikausa.com

No. 955 is a 500ºF electrically-heated, top-loading oven. Workspace measures 312" x 24" x 24". Four 2 HP recirculating blowers provide horizontal rear-to-front airflow. Has 4" insulated walls, aluminized steel exterior and interior, a motor-operated rear-hinged door opening the top and front, and a workspace floor reinforced for 7200 lbs. loading onto the 1/4" steel plate surface. Features digital programming temperature controller with two channels; two independent zones of temperature control; two manual reset excess temperature controllers with separate contactors; four recirculating blower airflow safety switches. 

The Grieve Corp., www.grievecorp.com

Eco-Stencil AQ batch stencil cleaner is for ultrasonic and spray-in-air systems. Removes all types of solder paste (e.g., water-based, RMA, no-clean, Pb-free) and uncured adhesives from stencils and misprinted boards. Is water-based and uses environmentally friendly surfactants. Is a drop-in replacement for semiaqueous and aqueous cleaners. Works with current filtration methods.

Techspray, www.techspray.com

DVD-18C, “Soldering Terminals” is a 37-min. video that covers best practices for soldering wires to commonly used terminals, in accordance with IPC-A-610E and J-STD-001E. Demonstrates how to solder wires to turret, cup, bifurcated, hook and pierced terminals. Illustrates wire-wrapping techniques, use of a solder heat bridge for heat transfer, soldering for inspectability, and evaluation of acceptable and unacceptable solder joints. Includes a leader’s guide, review questions, IPC training certification documents and English subtitles. 

IPC, www.ipc.org

RP series benchtop robot may be set up with multiple heads to perform dispensing operations and other tasks such as pick-and-place assembly, laser inspection, weighing, etc. Each axis boasts pre-loaded lead screws and ball slides. The base is a full-size machined surface with pre-tapped holes to provide solid and accurate foundation for mounting tooling, fixturing, etc. Product remains stationary.

Dispense Works, www.dispenseworks.com

MaxPan4 panelizes PCBs substrates for conveyers. Is fully automated, using laser and automated vision for registration and alignment. Number of panelized PCB substrates is user-specific, based on assembler's equipment size.

IPTE, www.ipte.com

Software release 7.43 has additional functions for programming and inspection mode. Includes improved inline classification using additional color defect images in an inclined view; reduces human error and misclassifications made at the classification station. Can record defect images – both at an inclined angle and in color – to ease defect assessment; can be configured. Images are automatically recorded and are available when the assembly is no longer in the AOI system.

Viscom, www.viscom.com

The EB9000S soldering iron station includes an LCD display with a built-in power indicator and tip cartridge status; dual switchable output, and an external fuse. Uses Curie Heat Technology. Includes 4-year warranty.

Easy Braid Co., www.easybraidco.com

CST Studio Suite 2011, including CST Microwave Studio high-frequency simulation software, is for electromagnetic problems. Material property descriptions have been enhanced across available solvers. High-performance computing options are available for the frequency domain and the integral equation solver. Time and frequency domain can provide sensitivity information for an arbitrary number of parameters in one simulation run. The trust region framework can employ sensitivity information. Yield analysis for complex 3D models is available at virtually no additional computational cost. The multiphysics flow has been enhanced. Based on one simulation model, the simulation task concept makes optimization feasible, considering electromagnetic, thermal and mechanical aspect. Temperature calculated from the electromagnetic losses can be used to change the material parameters for a consecutive electromagnetic field simulation. CST Mphysics Studio also features a thermal solver on tetrahedral grids.

Computer Simulation Technology, www.cst.com

ProActiv printing technique includes a control subsystem and a set of squeegees featuring embedded electronics. Is said to extend the print process window for consistent printing of small apertures for 0.3 mm CSPs and 01005 passives. Enables next-generation components to be printed next to standard components using a conventional printing process with a single thickness stencil. When activated, energizes paste in contact with or in very close proximity to the squeegee blade. Reportedly does not alter the paste but makes it more compliant, improving packing density of solder particles into apertures and enhancing solder bond, increasing solder paste transfer efficiency.

DEK, www.dek.com/proactiv