Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%. 

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

IM-6000 series provides high-precision dimension inspection. Pattern registration and search functions provide place-and-press measurement operation. Reportedly eliminates need for optical comparators, x-y stages for part positioning, CNC measuring devices, and measuring and stereo microscopes. Parts to be measured are placed on the IM’s sample tray, and the measurement button pressed. An iPASS automatically locates, identifies and measures parts placed anywhere within the unit’s 100 mm field of view. A part evaluation library stores the images, measurement functions and specifications of parts, and provides automatic pattern search, part recognition and measurement without setup the next time inspection of the same parts is performed. Performs up to 99 distinct measurements with the press of a button. High-precision image acquisition and sub-pixel processing permit measurement of hard-to-inspect features.

Keyence Corp. of America, www.keyence.com

Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.

Siemens Electronics Assembly Systems, www.siplace.com

 

The EWS-310 wave soldering machine has continuous PCB width adjustment; accommodates boards up to 12" or 310 mm in width. Reportedly provides the same level of process control and parameter monitoring found in more expensive machines. Total power consumption is at least 10% less than comparable models. Employs a durable "L" finger handling mechanism. Has on-board LCD touch screen with graphic user interface. 

APS Novastar, www.apsgold.com

 

M22X DL-18/460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D solder paste inspection. Handles medium and large PCBs. Features high-speed digital XGA color camera, as well as analysis via synthetic imaging. Combines speed and accuracy of CL systems with a new lighting concept. Three pulse wave modulated LED light sources (main, side and DOAL) can lighten inspection points from three different angles. Up to six different lighting combinations are available.
 
Marantz, www.escapethegrayworld.com
Christopher Associates Inc., www.christopherweb.com

 

See-Flo 1100 is a fixed-ratio, positive displacement, meter-mix dispense system ideal for manual and automated adhesive and sealant applications. Meters low- to high-viscosity two-component materials, such as epoxies, urethanes, silicones and acrylics supplied by pumps or pressure tanks. Can be floor-mounted, mobile-cart mounted and may be process integrated with a dispensing robot assembly. For dispensing continuous precision beads.
 
Sealant Equipment & Engineering, www.sealantequipment.com

 

Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
 
DEK, www.dek.com

Pressurex is a thin flexible sensor film that reveals pressures from 2 - 43,200 PSI. When placed between the contacting surfaces of a flip chip bonder, it changes color directly proportional to the amount of pressure applied. Precise pressure magnitude and distribution is then determined by comparing color variation results to a color correlation chart.

Sensor Products Inc., www.sensorprod.com/pressurex

Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing.  Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Is for fluid packaging operations, including filling vials, bottles and other specialty containers. Can be integrated into robotics and automated production processes. Possesses adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals. Comes in stainless steel and Teflon construction. Model 345 valve controller is ideally suited to actuate this valve.
 
Tridak, www.tridak.com

Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails. 
 
Fujipoly America Corp., www.fujipoly.com

 

Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window. 
 
Henkel, www.henkel.com/electronics

 

BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com