MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
 
Assembléon, www.assembleon.com

 

DCA-FD is a modified silicone conformal coating said to dry to the touch in 20 min. Increased solids content reportedly gives 35% greater coverage per liter compared to standard DCA. Has a wide operating temperature range and is suitable for a range of commercial and high-rel applications. Has lower VOC levels compared to standard DCA. Has excellent adhesion and is resistant to most solvents, lubricants and chemicals. Is highly resistant to mold growth and UV light. Can be sprayed, dipped or brushed. Is RoHs-compliant and meets UL746CQMJU2, DEF-STAN 59/47(4), and IPC-CC-830.
 
Electrolube, www.electrolube.com 

GTO graphical user interface helps rework and assembly technicians locate single or multiple components on a PCB. Produces a unified PCB image by combining top and bottom Gerber silkscreens, pick-and-place drill files, and formatted BoM (.csv file). Creates a composite view of PCB by fusing silkscreens, parts list, and placement information into a single view, allowing locating an individual component or a group of BoM line-item components. Generates assembly notes, and automatically generates symbol/color coded assembly prints, showing exactly which parts need to be located in certain locations on the PCB. Stored project bundle creates a single file containing top and bottom silkscreen, pick-and-place, BoM, and notes to be distributed to engineering or customers.

Saelig Co., www.saelig.com

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com

PowerRepair is for de-soldering and soldering of through-hole components to PCBs. Features mini-wave soldering technology, able de-solder/solder high-pin-count components and connectors. Also handles components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all Pb-free solder alloys. Soldering nozzle is designed for high energy transfer rate, even in high-temperature applications. Features short repair cycles, and low thermal stress on the PCB and components.  All soldering parameters are programmable.

Seho Systems, www.sehona.com

Multicore DA101 incorporates a no-clean, ROLO flux and is formulated for printing processes. Is said to withstand temperatures of 300°to 330°C for high-Pb reflow profiles and Pb-free temperatures between 240° and 270°C. Wets to copper, NiPdAu and Ag finishes, among others. Exhibits less that 5% void instances on average. Can be cleaned with standard cleaning chemistries.

Henkel, www.henkel.com/electronics

PCB123 version 3.3 circuit board design software now can convert any layout design files; has full customization via software development kit; bill of materials generated and updated as user designs; offers real-time quotes for board fabrication and parts; can order both boards and parts direct from interface; and includes more fabrication options and services. Free.
 
Sunstone Circuits, www.sunstone.com

 

A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.

 

Heraeus Thick Films Materials Business Unit, www.heraeus.com

Model 340PS and 340PSL positive-displacement dispensing valves for fluid dispensing incorporate the efficiency of a disposable fluid path from the reservoir to the dispense tip. Sequenced piston actuation dispenses a consistent shot-to-shot volume. Are effective with materials that are shear sensitive, extremely high or low in viscosity, possess tacky or stringy characteristics, or have drifting viscosities due to limited pot life. 340PS is suited for shot volumes from 0.004 to 0.180 mL. 340PSL offers shot size capability up to 1.200 mL. Both are available with polyurethane, flexible polyethylene or Teflon tubing.
 
Tridak, www.tridak.com

 

Camalot SmartStream non-contact dispense pumps now come with optional Dual Head Synchronous Mode. Synchronous dispense mode said to improve throughput by 50% while eliminating risk of poor yields/scrapped product experienced by alternative approaches to simultaneous dispensing on multi-up circuits. Is capable of detecting panel rotation and will automatically switch to an asynchronous dispense mode to ensure that both heads dispense accurately on the PCBs within the skewed panel. New software algorithms ensure dual pumps are pitched correctly and have identical flow rates. Is compatible with the Camalot XyflexPro+ and FX-D dispense systems and may be retrofitted in the field.

Speedline Technologies, www.speedlinetech.com

Screens with HT stainless steel mesh are woven on looms. High-tension mesh is capable of achieving tension values higher than traditional meshes. Permits the use of a lower off-contact and less squeegee pressure. Shows improvements in the separation of the ink from the mesh. Ink clears the mesh opening easier.

MicroScreen LLC, www.microscreen.org

VisionPro is hardware-independent software that expands image acquisition options with support for large camera images and nontraditional sources such as 3-D, thermal and x-ray imagers. Offers high-accuracy calibration and image correction for line-scan cameras, and expanded ID reading capability of 2-D codes. Image acquisition has been enhanced to support images up to 16 bits in depth. Has built-in compatibility with selected thermal cameras and 3-D profile scanners. Enables users to switch between 32-bit and 64-bit operating systems. Symbol reader tool has been expanded to read 2-D codes up to 144 x 144.
 
Cognex Corp., www.cognex.com/visionpro