NL930PT no-clean, Pb-free, halide-free pin probable solder paste has clear residues and is said to be consistently printable to low surface area ratios. Can be used with SN100C and SAC 305. Has good pin probability, print release to 0.55 SAR when used with Slic Stencil, and wets to all surface finishes, including OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a range of temperatures (65°-85°F) and relative humidity (25-65% RH). Stencil prints at up to 200 mm/sec.; voiding performance exceeds IPC Class III requirements. Features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.
FCT Assembly, www.fctassembly.com
mySelective 6745 selective soldering machine now features a new parallel processing design and dual-soldering nozzles said to nearly double throughput. Setup is quick using the Easyteach2 program.
XPM3 reflow oven now has an AUTOset fast setup feature capable of generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes an optimized profile from the preliminary recipe if needed. Reportedly, 85% of the time, modification of the auto-created profile is not necessary.
AUTOset controls ramp-up heating rate, thermal soak, time above liquidus, peak temperature, and total heating time.
Vitronics Soltec, www.vitronics-soltec.com
Spectrum S-920N Series now comes with dual simultaneous jet dispensing, which uses two DispenseJet valves to jet fluid, reportedly reducing dispense time by 50%. Is for CSP underfill and LED silicone encapsulation on multi-up panelized or patterned parts. Ensures flow rates for both DispenseJets deliver the same mass per part. Automatically compensates for fluid viscosity changes over time, as well as batch-to-batch variations to keep the process under machine control. Ensures consistent Takt times. Jets feature flexible spacing options.
Nordson Asymtek, www.nordsonasymtek.com
Arlink 8000 modular workstation system is ergonomically designed for assembly, service, repair, research and technical work. Can be assembled and reconfigured quickly. Can be configured in a variety of heights and lengths to best suit specific needs. Comes in five standard industry widths and in three different heights up to 84". Has a starter and adder system, with the option of back-to-back configurations; enables unlimited layout possibilities. The definite positioning system makes relocating or adjusting work surfaces, storage, shelving, lights, power beams, footrests, etc. easy. Has a virtually tool-free assembly and reconfiguration process. Work surfaces are available in standard laminate or static dissipative. Is available on casters to create mobile workstations or parts carts.
Lista International Corp., www.listaintl.com
X2825 silica-filled board-level underfill encapsulant has a CTE of 26 ppm/°C. Is said to enhance drop and shock test reliability and provide thermal cycle performance. In one trial, thermal cycling of a BGA between -20° and +85°C, an unfilled version, with a CTE of 60 ppm/°C, resulted in first failure at 500 cycles; had no failures after 1500 cycles. Said to be reworkable at temperatures of 170° to 180°C.
Zymet, www.zymet.com
BPM Microsystems, www.bpmicro.com
R6000 halogen-free printer ribbon is for circuit board ID. Comes with a variety of halogen-free polyimide labels. Is environmentally friendly. Reportedly has near identical performance characteristics as existing R6000 ribbons. Contains 45 halogen ppm – bromine and chlorine combined.
Brady Corporation, www.bradyid.com
Q Series 1500 mL cartridges have leak-free mixer connections and self-bleeding Quadro pistons. Are currently available in 1:1 ratio cartridges. Fit all common industry dispensers. Are pressure-tested for safe operation. Are available in polypropylene or Nylon and in 7/8-9 or 7/8-14 threads. Outlets available are side-by-side or cut-off tip.
Sulzer Mixpac USA Inc., www.sulzermixpacusa.com
Two IC thermal detection units for the Aerial flying probe tester detect thermal parameters of ICs under power. Compare temperatures of known good boards to suspect boards, and indicate bad components. Reportedly permit precise thermal measurement of the IC or other components while the part is powered up, even under low-voltage conditions.
Seica, www.seica.com
MaxiReflow process gas cleaning system for reflow ovens is equipped with cyclone technology. Extracts contaminated process gas from all heated zones, leads it through a cyclone and then directs the cleaned gas back to heating area. The temperature inside the cyclone is controlled. By injecting a small amount of water into the cyclone, both liquid and solid residues are washed off and led into an active carbon filter unit. Is configured as closed system.
Seho Systems GmbH, www.seho.de
Vision series convection reflow ovens have new cooling zone designs. Are effective for the homogenous cooling of large thermal mass PCBs. Cooling area in VisionXP is laid out in 2, 3 or 4 stages. Fans in the individual zones, available with separate speed/volume control, can cool Pb-free processed PCBAs to below 50°C. Bottom-side cooling configuration now available. The design is useful for uniformly processing thick PCBs, workpiece carriers, and PCBs with unevenly distributed copper innerlayers.
Rehm Thermal Systems, www.rehm-group.com