256Jet-S inkjet printhead features a 256-nozzle printhead for noncontact printing of a variety of acid and alkaline etchants and conductive metals for direct write, printable solar/photovoltaic applications. Reportedly lasts up to eight times longer than alternative inkjet printheads. For use in direct write, precision dispensing of etchants with PH ranging from 2 to 14. Lasts up to three years; has a lifespan of 90 billion firings. Jets a viscosity range from 6 cps to 30 cps. Is available in 5 pl, 30 pl, 50 pl, or 80 pl drops.
 
Trident, www.trident-itw.com

 

Automatic Contactor Cleaning, for MT9510, cleans fast and without manual interruption of the handling process. Is fully automated and software-controlled, and requires no opening, undocking, or downtime of the handler during operation. Permits user-defined cleaning cycles. Requires no modifications to the handler base unit, and is said to be easy to install into any existing MT9510 and MT9510XP equipment.

Multitest, www.multitest.com/MT9510

 

MatchCon series of connectors feature a special contact design for applications with strong vibration exposure, such as automotive. Male and female contacts interlock, providing a high contact force and eliminating the typical fretting seen with Sn-plated versions. Based on a 1.27-mm pitch, provide a variety of 90° and 180° board connectors in SMT and with TH pins. The cable connection is secured by IDC technology and by an additional locking between the board and cable connector. Come in 6 to 26 pin counts.
 

Galaxy Thin Wafer System offers process capability of Cp>2 @ +/-12.5 µm. A wafer pallet secures wafers as thin as 75 µm during transport and processing. Is approximately 400 mm²; is flat to less than 10 µm; can accommodate wafers as large as 300 mm. Can be held securely while being processed DirEKt Ball Placement, DirEKt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. DirEKt Coat process for deposition of 25 µm thick die attach adhesives and other coatings now has process capability of Cp>2 @ +/-12.5 µm and a total thickness variation of 7 µm on 150 µm wafers up to 200 mm in diameter. Said to be capable of first-pass yield ball placement of 200 µm spheres at 3000 µm pitch, thermal interface materials deposition and wafer bumping.

DEK, www.dek.com

Kaleido high-resolution color head enhances definition at the repair station; enabling decisions based on the defect picture. Inspects solder joint and lead defects. With i-lite technology, a color-enhancement solution at the defect viewer station is offered; can see 01005 components, as well as associated solder joint. RGB lighting structure enables rendering of color picture.
 
Vi Technology, www.vitechnology.com

 

EP30BN is a two-part boron nitride epoxy adhesive; is a medium-viscosity epoxy with good flow characteristics for bonding, sealing and potting. Is designed to optimize heat dissipation, and cures at room temperature. Mechanical strength properties and chemical resistance are maintained over the temperature range of -60° to 300°F. Has volume resistivity in excess of 1014 ohm cm and thermal conductivity of 24 btu/hr/ft²/°F/in.
 
Master Bond, www.masterbond.com
 
 

 

Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
 
Henkel Corp., www.henkel.com/electronics

 

Spectrum thermal process optimization software is said to automatically identify the correct furnace setup for a thermal profile within the sweet spot of the established process window. Uses information from a single profile pass to evaluate millions of possible furnace setups. Each possible furnace recipe will yield a profile, and the Spectrum identifies the fit between the profile and the established process window. Within seconds, reportedly can complete an exhaustive ranking and present its recommendation for the furnace recipe (zone temperatures and conveyor speed). Is a software-only option for the SunKIC profiler.

KIC, www.kicthermal.com

e-Clipse is said to be fast and convenient to attach, and provides repeatable profile readings. Features four spring-loaded thermocouples within a lightweight fixture that also holds the solar wafer. TCs have disk-shaped beads, rather than the traditional spherical shaped beads, for reliable contact to the solar wafer surface. Permits quick replacement of broken wafers. Four standard type K TC connectors plug into the profiler.

KIC, kicthermal.com

 

 

Multicore DA100 die attach solder paste is suitable for high-lead and Pb-free applications. Incorporates a no-clean, ROLO flux system. Complies with RoHS legislation. Delivers low void formation. Exhibits less that 5% void instances on average. Is formulated to hold a higher metal loading for dispensable applications. Reportedly dispenses easily with high pause time and dot-to-dot consistency.
 
Henkel, www.henkel.com/electronics
 

 

The second-generation Wave Surfer is a self-contained measurement system for wave solder machines. Provides data on wave solder machine setup and profiling. Is said to be easy-to-use, with five embedded thermocouples. Works in conjunction with KIC profilers. Is made of a material similar to typical wave solder pallets, and reportedly withstands thousands of passes. A fixture holds the profiler in place during each run to measure pertinent process data, including peak temperature, dwell time, parallelism, and conveyor speed.

KIC Thermal, www.kicthermal.com

 

The 28.400-2 compact dual-pot system is mounted on transport and storage carts that permit easy conversion from Pb-free to SnPb. Otherwise, it is identical to model 28.400, the single-pot version. Is 9.5' long; features dual-wave; three independently controlled zones with forced-air convection heating, and bottom-side IR preheating. Includes internal automatic spray fluxer, titanium finger conveyor with motorized width adjustment for PCBs from 50 to 400 mm and closed-loop conveyor speed control.
 
Manncorp, www.manncorp.com/wave-solder/28.400-2