RDS 2100 and RDS 3000 drying systems for solar cell metallization consist of a combination of either five or seven IR zones and one central convection zone. Guarantee safe transport through the oven, either via mesh belt or with pin chain up to three lanes.  Conveyor of the heating zone can be separated from that of the cooling zone; reportedly no latent heat is carried into the cooling area. Have belt speeds up to 6 m./min. and throughputs of up to 5700 wph.

Rehm Thermal Systems, www.rehm-group.com

 

Model 765 needle valve is said to be ideally suited for non-reactive adhesives, silicone oils, inks and solvents. Can be used in processes such as device assembly, packaging, optics assembly and building PCBs. Offers low maintenance and precision flow control. Is easily integrated into process automation and robotics. Optimal operation is achieved using Model 345 valve controller.

Tridak, www.tridak.com

The Integrated Process and Stencil Support (iPASS) system targets defect reduction and Lean manufacturing principles. Is said to provide upfront design for manufacturability support; offers a spectrum of stencil technology and related tooling; provides comprehensive process management. Duplicates stencils and processes from one line to the next, and throughout global manufacturing network. Includes stencils, screens, blades and related tooling. Provides CAD services, including design review and check plots, design library standardization and management, and weekly reporting. Includes training, managed product rollout, order confirmation and on-time delivery, and data reporting.
 
Photo Stencil, www.photostencil.com

 

Universal Cover Tape 2688, Static Dissipative contains an antistatic coating designed to help prevent product damage and loss resulting from static charge causing components to stick to the cover tape. Also available is Universal Cover Tape 2680, Non-Conductive, for products not susceptible to static charge. Designed to seal electrical and electronics components into embossed carrier tape materials, including paper. Are said to be compatible with virtually all equipment and carrier tapes. Have pressure-sensitive adhesive, designed to create a strong bond to polycarbonate, polystyrene and paper carriers. Help reduce risk of component migration, flipping, vibration and chip sticking in feeders.

3M Electronic Solutions Division, www.3M.com/electronics

 

Gensonic manually operated ultrasonic generator comes with a single 40 kHz transducer unit, for cleaning solder paste stencils. An additional transducer head can be employed for tougher applications. Cleans paste left in stencil apertures.

GEN3 Systems, gen3systems.com

Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has RS-232C interface with SPI and NG PCB anti-touch verification. Is said to provide increased line efficiency and requires minimal space. No need to filter NG PCBs, and SPI operates normally, even during NG PCB verification. AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. Features a PCB shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch-screen operation.
 
Young Jin/Seika Machinery Inc., www.seikausa.com

 

Falcon 3-axis non-contact video measuring system is said to be suitable for multi-user shop-floor use and advanced manufacturing inspection applications. Employs high-resolution indexed zoom optics (up to 100x magnification), with an indexed camera iris control, increasing accuracy and repeatability of Z-axis results. Incorporates controllable quadrant LED illumination and motorized Z-axis control. Measuring stages provide a measurement capacity of up to 150 x 150 x 115 mm (X, Y, Z) and include factory-completed NLEC calibration as standard.

Vision, Engineering, www.visioneng.us

Parylene Conformal Coating Machine 1092 uses vapor phase to transform coatings from solids. Is horizontal, stainless steel, 8' long x 30" wide. Requires electrical power and a vent connection. Pumping section consists of cold trap and pump; separate controls for temperature and vacuum sensor.
 
Paratronix, www.paratronix.com

 

The FH family of flexible circuit connectors come in different configurations with contact pitches ranging from 0.3 to 1 mm. Are for flexible printed circuit and flat flex cable-type connections. Certain models feature side-retention tabs. Includes: 

FH12 – ZIF connector; 0.5 mm and 1 mm pitch; top or bottom contact points; horizontal and vertical mounting; front flip lock actuator; FPC thickness 0.18 or 0.3 mm; connector height 2, 2.4, 4.85 mm (vertical); contact positions from 6-60;

FH19C/19SC – ZIF connector; 0.5 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm (FH19C), 0.3 mm (FH19SC); connector height 0.9 mm; contact positions from 4-50;

FH23 – LIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.25 mm; contact positions from 15-71;

FH26 – ZIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1 mm; contact positions from 13-71;

FH27 – ZIF connector; 0.4 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.2 mm; contact positions from 10-60;

FH28 – ZIF connector; 0.5 mm bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.3 mm; connector height 2.55 mm; contact positions from 20-80;

FH34S – ZIF connector; 0.5 mm pitch; top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.3 mm; connector height 1 mm; contact positions from 4-34;

FH35 – ZIF connector; 0.3 mm top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.2 mm; connector height 0.9 mm; contact positions 19, 25, 33, 35, 45 and 51.

Hirose Electric Co. Ltd., www.hiroseusa.com  

 

Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield. 

Cookson Electronics, www.alpha.cooksonelectronics.com  

Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

XE-1000 series robotic soldering systems are for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS and CdTe solar cells. Automate soldering process. Programmable control reportedly permits repeatable soldering over a wide range of format sizes. Can be used for either SnPb or Pb-free applications.

Christopher Associates Inc., www.christopherweb.com